HK1055802A1 - Photosensitive resin composition - Google Patents
Photosensitive resin compositionInfo
- Publication number
- HK1055802A1 HK1055802A1 HK03108066A HK03108066A HK1055802A1 HK 1055802 A1 HK1055802 A1 HK 1055802A1 HK 03108066 A HK03108066 A HK 03108066A HK 03108066 A HK03108066 A HK 03108066A HK 1055802 A1 HK1055802 A1 HK 1055802A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- resin composition
- photosensitive resin
- photosensitive
- composition
- resin
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Chemical & Material Sciences (AREA)
- Emergency Medicine (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Epoxy Resins (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000008082 | 2000-01-17 | ||
PCT/JP2000/009333 WO2001053890A1 (en) | 2000-01-17 | 2000-12-27 | Photosensitive resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1055802A1 true HK1055802A1 (en) | 2004-01-21 |
Family
ID=18536417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03108066A HK1055802A1 (en) | 2000-01-17 | 2003-11-06 | Photosensitive resin composition |
Country Status (6)
Country | Link |
---|---|
US (1) | US6727042B2 (xx) |
JP (1) | JP3416129B2 (xx) |
CN (1) | CN1218219C (xx) |
AU (1) | AU2001222286A1 (xx) |
HK (1) | HK1055802A1 (xx) |
WO (1) | WO2001053890A1 (xx) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100524019C (zh) * | 2001-08-29 | 2009-08-05 | 住友化学工业株式会社 | 光刻胶组合物 |
JP2003098658A (ja) * | 2001-09-25 | 2003-04-04 | Tamura Kaken Co Ltd | 感光性樹脂組成物及びプリント配線板 |
US7241725B2 (en) * | 2003-09-25 | 2007-07-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Barrier polishing fluid |
JP4198173B2 (ja) * | 2004-09-17 | 2008-12-17 | 凸版印刷株式会社 | 着色アルカリ現像性感光性樹脂組成物及び該着色アルカリ現像性感光性樹脂組成物を用いたカラーフィルタ |
KR100606655B1 (ko) * | 2004-09-22 | 2006-08-01 | 한국전자통신연구원 | 광반응성 유기고분자 게이트 절연막 조성물 및 이를이용한 유기박막 트랜지스터 |
JP4641861B2 (ja) * | 2005-05-11 | 2011-03-02 | 株式会社Adeka | アルカリ現像性樹脂組成物 |
CN101006393B (zh) * | 2005-05-11 | 2011-11-30 | 凸版印刷株式会社 | 碱性显影型感光性树脂组合物、带有使用它形成的液晶分割取向控制突起的基板和滤色器、以及液晶显示装置 |
JP4916224B2 (ja) * | 2005-06-20 | 2012-04-11 | 株式会社Adeka | アルカリ現像性感光性樹脂組成物 |
CN101133363B (zh) * | 2005-06-20 | 2011-04-20 | 凸版印刷株式会社 | 着色碱性显影型感光性树脂组合物、及使用了该着色碱性显影型感光性树脂组合物的滤色器 |
US7601482B2 (en) * | 2006-03-28 | 2009-10-13 | Az Electronic Materials Usa Corp. | Negative photoresist compositions |
TWI316381B (en) * | 2007-01-24 | 2009-10-21 | Phoenix Prec Technology Corp | Circuit board and fabrication method thereof |
KR101387796B1 (ko) * | 2007-02-20 | 2014-04-21 | 쇼와 덴코 가부시키가이샤 | 감광성 수지의 제조 방법, 그 제조 방법으로 얻어지는 감광성 수지 및 감광성 수지 조성물 |
JP4376290B2 (ja) * | 2007-03-05 | 2009-12-02 | 株式会社日本触媒 | ソルダーレジスト、そのドライフィルム及び硬化物ならびにプリント配線板 |
WO2008127039A1 (en) * | 2007-04-12 | 2008-10-23 | Lg Chem, Ltd. | Composition for manufacturing indurative resin, indurative resin manufactured by the composition and ink composition comprising the resin |
JP4985768B2 (ja) * | 2007-05-11 | 2012-07-25 | 日立化成工業株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP5376793B2 (ja) * | 2007-11-07 | 2013-12-25 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板 |
CN101246310B (zh) * | 2008-03-19 | 2010-11-03 | 吉林大学 | 负性含氟光刻胶组合物及在聚合物光波导器件中的应用 |
JP5279423B2 (ja) * | 2008-05-19 | 2013-09-04 | 富士フイルム株式会社 | 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板 |
US7952200B2 (en) * | 2008-07-16 | 2011-05-31 | Infineon Technologies Ag | Semiconductor device including a copolymer layer |
US9223212B2 (en) * | 2011-07-31 | 2015-12-29 | Nippon Kayaku Kabushiki Kaisha | Photosensitive resin composition and cured product thereof |
WO2013022068A1 (ja) * | 2011-08-10 | 2013-02-14 | 日立化成工業株式会社 | 感光性樹脂組成物、感光性フィルム、永久レジスト及び永久レジストの製造方法 |
US9795752B2 (en) | 2012-12-03 | 2017-10-24 | Mhs Care-Innovation, Llc | Combination respiratory therapy device, system, and method |
CN106589320A (zh) * | 2016-11-30 | 2017-04-26 | 江苏芯锐传感科技有限公司 | 多功能环氧固化剂组合物及其制备方法 |
JP6830808B2 (ja) | 2016-12-21 | 2021-02-17 | 日東電工株式会社 | 光導波路形成用感光性エポキシ樹脂組成物、光導波路形成用硬化性フィルムおよびそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板 |
JP7363105B2 (ja) * | 2019-05-31 | 2023-10-18 | 株式会社レゾナック | 感光性樹脂組成物、感光性樹脂フィルム、プリント配線板及び半導体パッケージ、並びにプリント配線板の製造方法 |
WO2023218876A1 (ja) * | 2022-05-13 | 2023-11-16 | 株式会社日本触媒 | アルカリ可溶性樹脂、感光性樹脂組成物及びその硬化物 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0327044A (ja) * | 1989-06-23 | 1991-02-05 | Mitsubishi Electric Corp | 感光性樹脂組成物 |
JPH04225355A (ja) * | 1990-12-27 | 1992-08-14 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
JP2877659B2 (ja) | 1993-05-10 | 1999-03-31 | 日本化薬株式会社 | レジストインキ組成物及びその硬化物 |
JPH0912654A (ja) * | 1995-06-26 | 1997-01-14 | Nippon Kayaku Co Ltd | エネルギー線硬化性樹脂組成物及びその硬化物 |
JP4030025B2 (ja) * | 1995-09-14 | 2008-01-09 | 株式会社日本触媒 | 光硬化性液状ソルダーレジスト用インキ組成物 |
JPH09316149A (ja) * | 1996-05-31 | 1997-12-09 | Nippon Kayaku Co Ltd | 樹脂組成物、そのフィルム及びその硬化物 |
JP3659825B2 (ja) * | 1997-12-19 | 2005-06-15 | 太陽インキ製造株式会社 | アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜 |
JP2000321765A (ja) * | 1999-05-13 | 2000-11-24 | Showa Highpolymer Co Ltd | 感光性樹脂組成物 |
-
2000
- 2000-12-27 US US10/169,927 patent/US6727042B2/en not_active Expired - Fee Related
- 2000-12-27 CN CN008187754A patent/CN1218219C/zh not_active Expired - Fee Related
- 2000-12-27 AU AU2001222286A patent/AU2001222286A1/en not_active Abandoned
- 2000-12-27 WO PCT/JP2000/009333 patent/WO2001053890A1/ja active Application Filing
- 2000-12-27 JP JP2001554121A patent/JP3416129B2/ja not_active Expired - Fee Related
-
2003
- 2003-11-06 HK HK03108066A patent/HK1055802A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1433532A (zh) | 2003-07-30 |
US20030087189A1 (en) | 2003-05-08 |
JP3416129B2 (ja) | 2003-06-16 |
AU2001222286A1 (en) | 2001-07-31 |
CN1218219C (zh) | 2005-09-07 |
US6727042B2 (en) | 2004-04-27 |
WO2001053890A1 (en) | 2001-07-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20091227 |