GR1000702B - Μεθοδος και συνθεση προστασιας και ενισχυσεως της ικανοτητας συγκολλησεως μεταλλικων επιφανειων. - Google Patents
Μεθοδος και συνθεση προστασιας και ενισχυσεως της ικανοτητας συγκολλησεως μεταλλικων επιφανειων.Info
- Publication number
- GR1000702B GR1000702B GR900100172A GR900100172A GR1000702B GR 1000702 B GR1000702 B GR 1000702B GR 900100172 A GR900100172 A GR 900100172A GR 900100172 A GR900100172 A GR 900100172A GR 1000702 B GR1000702 B GR 1000702B
- Authority
- GR
- Greece
- Prior art keywords
- composition
- metal surface
- solderability
- enhancing
- protecting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Paints Or Removers (AREA)
- Nonmetallic Welding Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
Μέθοδος και σύνθεση για την προστασία και ενίσχυση της συγκολλητικότητας μιάς μεταλλικής επιφάνειας. Μίγμα το οποίο περιλαμβάνει ένα επιλεγμένο προστατευτικό υλικό και ένα δικαρβοξυλικό οξύ ως καθαριστικό, επιτίθεται στη μεταλλική επιφάνεια προς σχηματισμό ενός προστατευτικού φιλμ ή επιστρώσεως που ενισχύει επίσης και τη συγκολλητικότητα της μεταλλικής επιφάνειας. Το μίγμα επιτίθεται στην μεταλλική επιφάνεια ως διάλυμα που έχει διαλύτη φορέα που εξατμίζεται αφήνοντας το φίλμ. Το φιλμ ενεργοποιείται με θέρμανση στη θερμοκρασία συγκολλήσεως απελευθερώνοντας το καθαριστικό. ω
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33617889A | 1989-04-11 | 1989-04-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
GR900100172A GR900100172A (en) | 1991-09-27 |
GR1000702B true GR1000702B (el) | 1992-10-08 |
Family
ID=23314909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GR900100172A GR1000702B (el) | 1989-04-11 | 1990-03-09 | Μεθοδος και συνθεση προστασιας και ενισχυσεως της ικανοτητας συγκολλησεως μεταλλικων επιφανειων. |
Country Status (14)
Country | Link |
---|---|
EP (1) | EP0423286B1 (el) |
JP (1) | JPH0822473B2 (el) |
KR (1) | KR930006435B1 (el) |
AU (1) | AU612075B2 (el) |
CA (1) | CA2027570C (el) |
DE (1) | DE69012941T2 (el) |
DK (1) | DK0423286T3 (el) |
ES (1) | ES2060159T3 (el) |
GR (1) | GR1000702B (el) |
IL (1) | IL93537A (el) |
MY (1) | MY105262A (el) |
NO (1) | NO905310D0 (el) |
TR (1) | TR25823A (el) |
WO (1) | WO1990011867A1 (el) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5177134A (en) * | 1990-12-03 | 1993-01-05 | Motorola, Inc. | Tacking agent |
US6796482B2 (en) * | 2002-10-31 | 2004-09-28 | Freescale Semiconductor, Inc. | Phase separated system for fluxing |
DE10314700A1 (de) | 2003-03-31 | 2004-10-14 | Behr Gmbh & Co. Kg | Verfahren zur Herstellung oberflächenmodifizierter Werkstücke |
JP2008062253A (ja) * | 2006-09-05 | 2008-03-21 | Denso Corp | はんだ付け用フラックスおよびはんだペースト組成物 |
JP2014168791A (ja) * | 2013-03-01 | 2014-09-18 | Hitachi Chemical Co Ltd | フラックスフィルム、フリップチップ接続方法、及び半導体装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR879907A (fr) * | 1941-04-15 | 1943-03-09 | Fides Gmbh | Résine synthétique pour soudure |
US2715616A (en) * | 1951-12-20 | 1955-08-16 | Robert M Macintosh | Organic coating for wire |
US2898255A (en) * | 1958-06-30 | 1959-08-04 | Ibm | Soldering flux composition |
GB1050444A (en) * | 1962-06-13 | 1966-12-07 | Libbey-Owens-Ford Glass Co. | Method of soldering and fluxing composition therefor |
JPS4855854A (el) * | 1971-11-17 | 1973-08-06 | ||
US3977916A (en) * | 1974-12-20 | 1976-08-31 | Chevron Research Company | Wax-flux composition containing alkylaryl sulfonic acid for soldering |
US3960614A (en) * | 1975-01-31 | 1976-06-01 | Chevron Research Company | Wax-flux composition containing a diester of sulfomaleic acid for soldering |
AT356776B (de) * | 1977-09-19 | 1980-05-27 | Herberts & Co Gmbh | Verfahren zur herstellung von elektrisch isolierenden, hochflexiblen und/oder loetfaehigen ueberzuegen |
DE2828197A1 (de) * | 1978-06-27 | 1980-01-03 | Winchester Electronics Gmbh | Halogenfreies flussmittel fuer die weichloetung auf kolophoniumbasis |
JPS5592293A (en) * | 1978-12-28 | 1980-07-12 | Sanwa Kagaku Kogyo Kk | Solid flux for soldering |
JPS5649680A (en) * | 1979-09-27 | 1981-05-06 | Toshiba Electric Equip Corp | Power source device |
DE3205315A1 (de) * | 1982-02-15 | 1983-08-25 | Siemens AG, 1000 Berlin und 8000 München | Flussmittel zur verwendung beim weichloeten |
JPS6216899A (ja) * | 1985-07-15 | 1987-01-26 | Asahi Kagaku Kenkyusho:Kk | 水溶性フラツクス |
GB8628916D0 (en) * | 1986-12-03 | 1987-01-07 | Multicore Solders Ltd | Solder composition |
-
1990
- 1990-02-23 ES ES90906556T patent/ES2060159T3/es not_active Expired - Lifetime
- 1990-02-23 EP EP90906556A patent/EP0423286B1/en not_active Expired - Lifetime
- 1990-02-23 KR KR1019900702596A patent/KR930006435B1/ko not_active IP Right Cessation
- 1990-02-23 DK DK90906556.7T patent/DK0423286T3/da active
- 1990-02-23 JP JP2506087A patent/JPH0822473B2/ja not_active Expired - Lifetime
- 1990-02-23 AU AU54381/90A patent/AU612075B2/en not_active Expired
- 1990-02-23 WO PCT/US1990/000876 patent/WO1990011867A1/en active IP Right Grant
- 1990-02-23 DE DE69012941T patent/DE69012941T2/de not_active Expired - Fee Related
- 1990-02-23 CA CA002027570A patent/CA2027570C/en not_active Expired - Lifetime
- 1990-02-26 IL IL93537A patent/IL93537A/xx not_active IP Right Cessation
- 1990-02-27 MY MYPI90000305A patent/MY105262A/en unknown
- 1990-03-09 GR GR900100172A patent/GR1000702B/el not_active IP Right Cessation
- 1990-04-06 TR TR90/0335A patent/TR25823A/xx unknown
- 1990-12-07 NO NO905310A patent/NO905310D0/no unknown
Also Published As
Publication number | Publication date |
---|---|
NO905310L (no) | 1990-12-07 |
AU612075B2 (en) | 1991-06-27 |
AU5438190A (en) | 1990-11-05 |
DK0423286T3 (da) | 1994-10-24 |
KR930006435B1 (ko) | 1993-07-16 |
IL93537A0 (en) | 1990-11-29 |
CA2027570A1 (en) | 1990-10-12 |
NO905310D0 (no) | 1990-12-07 |
DE69012941T2 (de) | 1995-03-02 |
WO1990011867A1 (en) | 1990-10-18 |
JPH0822473B2 (ja) | 1996-03-06 |
MY105262A (en) | 1994-09-30 |
ES2060159T3 (es) | 1994-11-16 |
JPH03505305A (ja) | 1991-11-21 |
EP0423286A1 (en) | 1991-04-24 |
KR920700092A (ko) | 1992-02-19 |
CA2027570C (en) | 1998-05-12 |
IL93537A (en) | 1992-11-15 |
DE69012941D1 (de) | 1994-11-03 |
GR900100172A (en) | 1991-09-27 |
EP0423286B1 (en) | 1994-09-28 |
TR25823A (tr) | 1993-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MA | Right expired |