GB997996A - Field effect device and method of manufacturing the same - Google Patents
Field effect device and method of manufacturing the sameInfo
- Publication number
- GB997996A GB997996A GB198163A GB198163A GB997996A GB 997996 A GB997996 A GB 997996A GB 198163 A GB198163 A GB 198163A GB 198163 A GB198163 A GB 198163A GB 997996 A GB997996 A GB 997996A
- Authority
- GB
- United Kingdom
- Prior art keywords
- type
- layers
- regions
- wafer
- type layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000005669 field effect Effects 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000012535 impurity Substances 0.000 abstract 7
- 239000000758 substrate Substances 0.000 abstract 4
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 abstract 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 238000009792 diffusion process Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 abstract 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000011574 phosphorus Substances 0.000 abstract 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000005049 silicon tetrachloride Substances 0.000 abstract 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 abstract 1
- 239000005052 trichlorosilane Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
- H01L29/808—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a PN junction gate, e.g. PN homojunction gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
997,996. Semi-conductor devices. MOTOROLA Inc. Jan. 16, 1963 [Feb. 19, 1962], No. 1981/63. Heading H1K. A field effect device is manufactured by epitaxially depositing two layers of semi-conductor material on a substrate and then diffusing impurity into the layers to form a source and a drain which define the limits of the channel and gate formed by the layers. As shown, Fig. 1, a P-type substrate 11 has N-type layer 12 and P-type layer 13 epitaxially deposited on one face. As shown, Fig. 2, layer 13 is masked, 23, and N-type impurity is diffused into the layers to form heavily doped N+-type source and drain regions 16, 17. The remaining portion of the P-type layer forms the gate 19 and the portion of the N-type layer directly below this forms the channel 18. The process is used to manufacture a plurality of field effect devices from a monocrystalline wafer of silicon doped with boron which is heated to 1180‹ C. in a stream of hydrogen into which is introduced silicon tetrachloride or trichlorosilane vapour doped with phosphine vapour to epitaxially deposit an N-type layer, after which the impurity is changed to diborane vapour to epitaxially deposit a P-type layer on top of the N-type layer. The wafer is then heated in steam to form a coating of silicon dioxide which is then selectively removed using a photoresist method, phosphorus is diffused into the layers to form N+-type sources and drains, and the remaining oxide layer is removed. The wafer is then sliced into individual units which are mounted on a header, connections made to the source, drain and gate regions, and the device is encapsulated. The drain is in the form of a rectangle surrounded by the gate and channel layers which are surrounded by the source. Impurity may be diffused into the outside edges of the sources to form P+ type regions connected to the substrate thus making all the junctions emerge on the upper face of the wafer so that it can be divided up into individual units by scribing and breaking without damaging the junctions. Devices of this kind can be mounted on the header using an electrically insulating but thermally conductive layer of alumina or beryllia, and ohmic connections can be made to the various regions on the upper face only. Alternatively a current limiter can be produced by making a single metallic contact to all the regions except the drain which has a separate contact. A mesa field effect device can be produced by etching the wafer of Fig. 1 and then diffusing in the source and sink regions. Preferably the epitaxially deposited layers and the substrate have about the same impurity concentration so that the junctions formed do not change position if inter-diffusion of the doping impurities occurs. Also the sheet resistivity of the channel of a device may be measured and if it is found to be too low the wafer can be heated to 1100‹ C. to cause inter- , diffusion of impurities so that the sheet resistivity of the channel is increased without changing the positions of the junctions. Devices can be manufactured with regions of opposite conductivity type to those mentioned.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17397062A | 1962-02-19 | 1962-02-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB997996A true GB997996A (en) | 1965-07-14 |
Family
ID=32092255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB198163A Expired GB997996A (en) | 1962-02-19 | 1963-01-16 | Field effect device and method of manufacturing the same |
Country Status (5)
Country | Link |
---|---|
BE (1) | BE627499A (en) |
DE (1) | DE1237693B (en) |
FR (1) | FR1347395A (en) |
GB (1) | GB997996A (en) |
NL (1) | NL288745A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0268426A2 (en) * | 1986-11-17 | 1988-05-25 | Linear Technology Corporation | High speed junction field effect transistor for use in bipolar integrated circuits |
USRE34821E (en) * | 1986-11-17 | 1995-01-03 | Linear Technology Corporation | High speed junction field effect transistor for use in bipolar integrated circuits |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1614861C3 (en) * | 1967-09-01 | 1982-03-11 | Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm | Process for the manufacture of a junction field effect transistor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL99536C (en) * | 1951-03-07 | 1900-01-01 | ||
FR1210880A (en) * | 1958-08-29 | 1960-03-11 | Improvements to field-effect transistors | |
FR1293699A (en) * | 1960-05-02 | 1962-05-18 | Westinghouse Electric Corp | Semiconductor device |
-
0
- NL NL288745D patent/NL288745A/xx unknown
-
1963
- 1963-01-16 GB GB198163A patent/GB997996A/en not_active Expired
- 1963-01-22 FR FR922155A patent/FR1347395A/en not_active Expired
- 1963-01-24 BE BE627499D patent/BE627499A/xx unknown
- 1963-02-18 DE DE1963M0055822 patent/DE1237693B/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0268426A2 (en) * | 1986-11-17 | 1988-05-25 | Linear Technology Corporation | High speed junction field effect transistor for use in bipolar integrated circuits |
EP0268426A3 (en) * | 1986-11-17 | 1989-03-15 | Linear Technology Corporation | High speed junction field effect transistor for use in bipolar integrated circuits |
US5012305A (en) * | 1986-11-17 | 1991-04-30 | Linear Technology Corporation | High speed junction field effect transistor for use in bipolar integrated circuits |
USRE34821E (en) * | 1986-11-17 | 1995-01-03 | Linear Technology Corporation | High speed junction field effect transistor for use in bipolar integrated circuits |
Also Published As
Publication number | Publication date |
---|---|
FR1347395A (en) | 1963-12-27 |
DE1237693B (en) | 1967-03-30 |
BE627499A (en) | 1963-05-15 |
NL288745A (en) |
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