GB9812850D0 - A method and apparatus for dechucking - Google Patents

A method and apparatus for dechucking

Info

Publication number
GB9812850D0
GB9812850D0 GBGB9812850.7A GB9812850A GB9812850D0 GB 9812850 D0 GB9812850 D0 GB 9812850D0 GB 9812850 A GB9812850 A GB 9812850A GB 9812850 D0 GB9812850 D0 GB 9812850D0
Authority
GB
United Kingdom
Prior art keywords
dechucking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB9812850.7A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Surface Technology Systems Ltd
Original Assignee
Surface Technology Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Surface Technology Systems Ltd filed Critical Surface Technology Systems Ltd
Priority to GBGB9812850.7A priority Critical patent/GB9812850D0/en
Publication of GB9812850D0 publication Critical patent/GB9812850D0/en
Priority to EP99926612A priority patent/EP1090421A1/en
Priority to KR1020007014213A priority patent/KR20010052875A/en
Priority to JP2000555290A priority patent/JP2002518847A/en
Priority to PCT/GB1999/001896 priority patent/WO1999066549A1/en
Priority to US09/719,500 priority patent/US6628500B1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GBGB9812850.7A 1998-06-16 1998-06-16 A method and apparatus for dechucking Ceased GB9812850D0 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GBGB9812850.7A GB9812850D0 (en) 1998-06-16 1998-06-16 A method and apparatus for dechucking
EP99926612A EP1090421A1 (en) 1998-06-16 1999-06-15 Method and apparatus for dechucking a substrate from an electrostatic chuck
KR1020007014213A KR20010052875A (en) 1998-06-16 1999-06-15 Method and apparatus for dechucking a substrate from an electrostatic chuck
JP2000555290A JP2002518847A (en) 1998-06-16 1999-06-15 A method and apparatus for removing a substrate from an electrostatic chuck.
PCT/GB1999/001896 WO1999066549A1 (en) 1998-06-16 1999-06-15 Method and apparatus for dechucking a substrate from an electrostatic chuck
US09/719,500 US6628500B1 (en) 1998-06-16 1999-06-15 Method and apparatus for dechucking a substrate from an electrostatic chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9812850.7A GB9812850D0 (en) 1998-06-16 1998-06-16 A method and apparatus for dechucking

Publications (1)

Publication Number Publication Date
GB9812850D0 true GB9812850D0 (en) 1998-08-12

Family

ID=10833770

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB9812850.7A Ceased GB9812850D0 (en) 1998-06-16 1998-06-16 A method and apparatus for dechucking

Country Status (6)

Country Link
US (1) US6628500B1 (en)
EP (1) EP1090421A1 (en)
JP (1) JP2002518847A (en)
KR (1) KR20010052875A (en)
GB (1) GB9812850D0 (en)
WO (1) WO1999066549A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7218503B2 (en) * 1998-09-30 2007-05-15 Lam Research Corporation Method of determining the correct average bias compensation voltage during a plasma process
US6852990B1 (en) * 2001-06-29 2005-02-08 Advanced Micro Devices, Inc. Electrostatic discharge depolarization using high density plasma
JP3910501B2 (en) * 2002-07-17 2007-04-25 浜松ホトニクス株式会社 Aerosol particle charger
US20060046506A1 (en) * 2004-09-01 2006-03-02 Tokyo Electron Limited Soft de-chucking sequence
CN100416758C (en) * 2005-12-09 2008-09-03 北京北方微电子基地设备工艺研究中心有限责任公司 Method for releasing chip static electricity thoroughly in chip etching equipment
JP4847909B2 (en) * 2007-03-29 2011-12-28 東京エレクトロン株式会社 Plasma processing method and apparatus
US8021723B2 (en) * 2007-11-27 2011-09-20 Asm Japan K.K. Method of plasma treatment using amplitude-modulated RF power
JP4786693B2 (en) * 2008-09-30 2011-10-05 三菱重工業株式会社 Wafer bonding apparatus and wafer bonding method
US8313612B2 (en) 2009-03-24 2012-11-20 Lam Research Corporation Method and apparatus for reduction of voltage potential spike during dechucking
US20150228524A1 (en) * 2014-02-12 2015-08-13 Varian Semiconductor Equipment Associates, Inc. Plasma resistant electrostatic clamp
EP3262677A1 (en) 2015-02-23 2018-01-03 M Cubed Technologies Inc. Film electrode for electrostatic chuck
JP6505027B2 (en) 2016-01-04 2019-04-24 株式会社日立ハイテクノロジーズ Sample detachment method and plasma processing apparatus
JP6708358B2 (en) * 2016-08-03 2020-06-10 株式会社日立ハイテク Plasma processing apparatus and sample separation method
CN108535620A (en) * 2017-03-02 2018-09-14 叶秀慧 The mechanism of semiconductor article is tested using electrostatic carrier

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06103683B2 (en) * 1990-08-07 1994-12-14 株式会社東芝 Electrostatic adsorption method
US5325261A (en) * 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
JPH0685045A (en) * 1992-08-31 1994-03-25 Fujitsu Ltd Separation of wafer
US5684669A (en) * 1995-06-07 1997-11-04 Applied Materials, Inc. Method for dechucking a workpiece from an electrostatic chuck
TW255839B (en) * 1993-05-20 1995-09-01 Hitachi Seisakusyo Kk
JPH0722498A (en) * 1993-06-21 1995-01-24 Oki Electric Ind Co Ltd Method and device for releasing electrostatic chuck from semiconductor wafer
US5459632A (en) * 1994-03-07 1995-10-17 Applied Materials, Inc. Releasing a workpiece from an electrostatic chuck
TW293231B (en) * 1994-04-27 1996-12-11 Aneruba Kk
US5491603A (en) * 1994-04-28 1996-02-13 Applied Materials, Inc. Method of determining a dechucking voltage which nullifies a residual electrostatic force between an electrostatic chuck and a wafer
JP3163973B2 (en) * 1996-03-26 2001-05-08 日本電気株式会社 Semiconductor wafer chuck device and semiconductor wafer peeling method
US5793192A (en) * 1996-06-28 1998-08-11 Lam Research Corporation Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system
US5818682A (en) * 1996-08-13 1998-10-06 Applied Materials, Inc. Method and apparatus for optimizing a dechucking period used to dechuck a workpiece from an electrostatic chuck

Also Published As

Publication number Publication date
KR20010052875A (en) 2001-06-25
EP1090421A1 (en) 2001-04-11
US6628500B1 (en) 2003-09-30
WO1999066549A1 (en) 1999-12-23
JP2002518847A (en) 2002-06-25

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)