GB9607369D0 - Amino resin composition for mold cleaning - Google Patents
Amino resin composition for mold cleaningInfo
- Publication number
- GB9607369D0 GB9607369D0 GBGB9607369.7A GB9607369A GB9607369D0 GB 9607369 D0 GB9607369 D0 GB 9607369D0 GB 9607369 A GB9607369 A GB 9607369A GB 9607369 D0 GB9607369 D0 GB 9607369D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- resin composition
- amino resin
- mold cleaning
- mold
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Detergent Compositions (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Lubricants (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22085394A JP3781445B2 (en) | 1994-08-24 | 1994-08-24 | Mold cleaning resin composition |
PCT/JP1995/001659 WO1996005954A1 (en) | 1994-08-24 | 1995-08-22 | Amino resin composition for mold cleaning |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9607369D0 true GB9607369D0 (en) | 1996-06-26 |
GB2298650A GB2298650A (en) | 1996-09-11 |
GB2298650B GB2298650B (en) | 1998-08-05 |
Family
ID=16757571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9607369A Expired - Fee Related GB2298650B (en) | 1994-08-24 | 1995-08-22 | Amino resin compositions for cleaning mold |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP3781445B2 (en) |
KR (1) | KR100305180B1 (en) |
CN (1) | CN1073499C (en) |
GB (1) | GB2298650B (en) |
HK (1) | HK1009697A1 (en) |
MY (1) | MY112167A (en) |
TW (1) | TW343171B (en) |
WO (1) | WO1996005954A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3783042B2 (en) * | 1995-08-23 | 2006-06-07 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
JP3270312B2 (en) * | 1995-10-24 | 2002-04-02 | 日本カーバイド工業株式会社 | Mold cleaning resin composition tablet |
JP3270315B2 (en) * | 1995-10-31 | 2002-04-02 | 日本カーバイド工業株式会社 | Mold cleaning resin composition tablet |
TW320600B (en) * | 1995-10-24 | 1997-11-21 | Nippon Denseki Kogyo Kk | |
DE10005574A1 (en) * | 2000-02-09 | 2001-08-23 | Reckitt Benckiser Nv | Detergent composition in tablet form |
KR20020006342A (en) * | 2000-07-12 | 2002-01-19 | 마이클 디. 오브라이언 | Removal method for plating chip of forming die |
KR100545249B1 (en) * | 2000-10-11 | 2006-01-24 | 닛뽕 카바이도 고교 가부시키가이샤 | Resin composition for mold cleaning |
WO2002090077A1 (en) * | 2001-04-25 | 2002-11-14 | Nippon Carbide Kogyo Kabushiki Kaisha | Resin composition for cleaning mold |
CN1319714C (en) * | 2002-01-21 | 2007-06-06 | 日本碳化物工业株式会社 | Resin composition for mold cleaning |
CN100408296C (en) * | 2002-12-06 | 2008-08-06 | 日本碳化物工业株式会社 | Cleaning material for molding metal die, and cleaning method |
JP2004323780A (en) * | 2003-04-28 | 2004-11-18 | Nippon Carbide Ind Co Inc | Thermoplastic resin composition for cleaning |
CN104066563B (en) * | 2012-01-23 | 2016-12-14 | 日本电石工业株式会社 | Resin composition for cleaning mold |
JP6803165B2 (en) * | 2015-08-07 | 2020-12-23 | 日本カーバイド工業株式会社 | Resin composition for mold cleaning |
JP6715627B2 (en) * | 2016-03-18 | 2020-07-01 | 日本カーバイド工業株式会社 | Mold cleaning resin composition |
JP2022190598A (en) * | 2021-06-14 | 2022-12-26 | Towa株式会社 | Mold maintenance member, resin molding apparatus, and method for manufacturing resin molded product |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55113517A (en) * | 1979-02-23 | 1980-09-02 | Nippon Carbide Ind Co Ltd | Resin composition for cleaning metallic mold |
JPS63246210A (en) * | 1988-02-19 | 1988-10-13 | Nippon Carbide Ind Co Ltd | Resin composition for mold cleaning |
JPH0381111A (en) * | 1989-08-24 | 1991-04-05 | Matsushita Electric Works Ltd | Molding material and method for cleaning of die |
-
1994
- 1994-08-24 JP JP22085394A patent/JP3781445B2/en not_active Expired - Lifetime
-
1995
- 1995-08-22 KR KR1019960702081A patent/KR100305180B1/en not_active IP Right Cessation
- 1995-08-22 GB GB9607369A patent/GB2298650B/en not_active Expired - Fee Related
- 1995-08-22 CN CN95190799A patent/CN1073499C/en not_active Expired - Fee Related
- 1995-08-22 MY MYPI95002473A patent/MY112167A/en unknown
- 1995-08-22 WO PCT/JP1995/001659 patent/WO1996005954A1/en active Application Filing
- 1995-08-23 TW TW084108783A patent/TW343171B/en not_active IP Right Cessation
-
1998
- 1998-09-08 HK HK98110534A patent/HK1009697A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100305180B1 (en) | 2001-11-22 |
KR960705667A (en) | 1996-11-08 |
CN1134129A (en) | 1996-10-23 |
JP3781445B2 (en) | 2006-05-31 |
HK1009697A1 (en) | 1999-09-10 |
GB2298650A (en) | 1996-09-11 |
JPH0857865A (en) | 1996-03-05 |
TW343171B (en) | 1998-10-21 |
CN1073499C (en) | 2001-10-24 |
MY112167A (en) | 2001-04-30 |
WO1996005954A1 (en) | 1996-02-29 |
GB2298650B (en) | 1998-08-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20090822 |