GB9100815D0 - Coplanar waveguide ribbon - Google Patents
Coplanar waveguide ribbonInfo
- Publication number
- GB9100815D0 GB9100815D0 GB919100815A GB9100815A GB9100815D0 GB 9100815 D0 GB9100815 D0 GB 9100815D0 GB 919100815 A GB919100815 A GB 919100815A GB 9100815 A GB9100815 A GB 9100815A GB 9100815 D0 GB9100815 D0 GB 9100815D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- coplanar waveguide
- waveguide ribbon
- ribbon
- coplanar
- waveguide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
- H01S5/06226—Modulation at ultra-high frequencies
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB919100815A GB9100815D0 (en) | 1991-01-15 | 1991-01-15 | Coplanar waveguide ribbon |
PCT/GB1992/000073 WO1992013369A1 (en) | 1991-01-15 | 1992-01-14 | Coplanar waveguide bridge |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB919100815A GB9100815D0 (en) | 1991-01-15 | 1991-01-15 | Coplanar waveguide ribbon |
Publications (1)
Publication Number | Publication Date |
---|---|
GB9100815D0 true GB9100815D0 (en) | 1991-02-27 |
Family
ID=10688447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB919100815A Pending GB9100815D0 (en) | 1991-01-15 | 1991-01-15 | Coplanar waveguide ribbon |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB9100815D0 (en) |
WO (1) | WO1992013369A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5402088A (en) * | 1992-12-03 | 1995-03-28 | Ail Systems, Inc. | Apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits |
FR2731308B1 (en) * | 1995-03-01 | 1997-05-30 | France Telecom | MODULAR ASSEMBLY INCLUDING TWO ELECTRONICALLY CONNECTED ELECTRONIC CIRCUITS FOR THE TRANSMISSION OF A MICROWAVE SIGNAL |
DE19641880A1 (en) * | 1996-10-10 | 1998-04-16 | Rosenberger Hochfrequenztech | Probe unit for contacting planar microwave circuits |
DE59901985D1 (en) * | 1998-05-26 | 2002-08-14 | Infineon Technologies Ag | High-frequency laser module and method for producing the same |
DE19823691A1 (en) | 1998-05-27 | 1999-12-02 | Siemens Ag | Housing arrangement for laser module |
GB0123475D0 (en) * | 2001-09-28 | 2001-11-21 | Agilent Technologies Inc | Flexible electrical interconnector for optical fibre transceivers |
CN109728391B (en) * | 2018-12-29 | 2024-05-07 | 中国科学院半导体研究所 | Defect ground structure coplanar waveguide-based laser |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4600907A (en) * | 1985-03-07 | 1986-07-15 | Tektronix, Inc. | Coplanar microstrap waveguide interconnector and method of interconnection |
-
1991
- 1991-01-15 GB GB919100815A patent/GB9100815D0/en active Pending
-
1992
- 1992-01-14 WO PCT/GB1992/000073 patent/WO1992013369A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO1992013369A1 (en) | 1992-08-06 |
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