GB8918867D0 - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
GB8918867D0
GB8918867D0 GB8918867A GB8918867A GB8918867D0 GB 8918867 D0 GB8918867 D0 GB 8918867D0 GB 8918867 A GB8918867 A GB 8918867A GB 8918867 A GB8918867 A GB 8918867A GB 8918867 D0 GB8918867 D0 GB 8918867D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8918867A
Other versions
GB2222721B (en
GB2222721A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP20976488A external-priority patent/JPH0258254A/en
Priority claimed from JP63209765A external-priority patent/JPH07120735B2/en
Application filed by Individual filed Critical Individual
Publication of GB8918867D0 publication Critical patent/GB8918867D0/en
Publication of GB2222721A publication Critical patent/GB2222721A/en
Application granted granted Critical
Publication of GB2222721B publication Critical patent/GB2222721B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thin Film Transistor (AREA)
GB8918867A 1988-08-23 1989-08-18 Cooling semiconductor devices Expired - Fee Related GB2222721B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP20976488A JPH0258254A (en) 1988-08-23 1988-08-23 Semiconductor element
JP63209765A JPH07120735B2 (en) 1988-08-23 1988-08-23 Semiconductor chip

Publications (3)

Publication Number Publication Date
GB8918867D0 true GB8918867D0 (en) 1989-09-27
GB2222721A GB2222721A (en) 1990-03-14
GB2222721B GB2222721B (en) 1993-07-28

Family

ID=26517641

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8918867A Expired - Fee Related GB2222721B (en) 1988-08-23 1989-08-18 Cooling semiconductor devices

Country Status (3)

Country Link
DE (1) DE3927866A1 (en)
FR (1) FR2636777B1 (en)
GB (1) GB2222721B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5057908A (en) * 1990-07-10 1991-10-15 Iowa State University Research Foundation, Inc. High power semiconductor device with integral heat sink
EP0520294B1 (en) * 1991-06-24 1998-08-26 Siemens Aktiengesellschaft Semiconductor device and method of manufacturing the same
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
FR2754390A1 (en) * 1996-10-07 1998-04-10 Gec Alsthom Transport Sa POWER MODULE WITH ELECTRICAL SEMICONDUCTOR POWER COMPONENTS AND HIGH POWER SWITCH COMPRISING AT LEAST ONE SUCH POWER MODULE
US6620045B2 (en) 2001-04-20 2003-09-16 King Show Games, Llc System and method for executing trades for bonus activity in gaming systems
US7704142B2 (en) 2001-04-20 2010-04-27 King Show Games, Inc. System and method for facilitating trades for bonus activity in gaming systems
JP2006229180A (en) 2005-01-24 2006-08-31 Toyota Motor Corp Semiconductor module and device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1265007A (en) * 1968-12-09 1972-03-01
US3609471A (en) * 1969-07-22 1971-09-28 Gen Electric Semiconductor device with thermally conductive dielectric barrier
US3686748A (en) * 1970-04-13 1972-08-29 William E Engeler Method and apparatus for providng thermal contact and electrical isolation of integrated circuits
DE2030809A1 (en) * 1970-06-23 1971-12-30 Semikron Gleichrichterbau Semiconductor arrangement
US4236167A (en) * 1978-02-06 1980-11-25 Rca Corporation Stepped oxide, high voltage MOS transistor with near intrinsic channel regions of different doping levels
EP0015053A1 (en) * 1979-01-27 1980-09-03 LUCAS INDUSTRIES public limited company A method of manufacturing a semi-conductor power device assembly and an assembly thereby produced
JPS56101777A (en) * 1980-01-18 1981-08-14 Futaba Corp Mos type semiconductor device
US4256792A (en) * 1980-01-25 1981-03-17 Honeywell Inc. Composite electronic substrate of alumina uniformly needled through with aluminum nitride
EP0040552A1 (en) * 1980-05-20 1981-11-25 De Beers Industrial Diamond Division (Proprietary) Limited Heat sinks
US4620215A (en) * 1982-04-16 1986-10-28 Amdahl Corporation Integrated circuit packaging systems with double surface heat dissipation
JPS6066843A (en) * 1983-09-22 1985-04-17 Hitachi Ltd Integrated circuit package
JPH0810710B2 (en) * 1984-02-24 1996-01-31 株式会社東芝 Method for manufacturing good thermal conductive substrate
US4659611A (en) * 1984-02-27 1987-04-21 Kabushiki Kaisha Toshiba Circuit substrate having high thermal conductivity
JPS61212045A (en) * 1985-03-18 1986-09-20 Hitachi Ltd Semiconductor device
GB8509439D0 (en) * 1985-04-12 1985-05-15 Artus R G C Heat sink
JPH07107921B2 (en) * 1985-11-15 1995-11-15 富士通株式会社 Plastic / Package type semiconductor device
KR880002260A (en) * 1986-07-09 1988-04-30 로버트 에스. 헐스 Thermally Enhanced Large Scale Integrated Circuit Packages and Mounting Integrated Circuit Dies
KR940000729B1 (en) * 1986-08-13 1994-01-28 히다찌 긴조꾸 가부시끼가이샤 Aluminum nitride sintered body and semiconductor substrate thereof
GB2214719B (en) * 1988-01-26 1991-07-24 Gen Electric Co Plc Housing for electronic device

Also Published As

Publication number Publication date
GB2222721B (en) 1993-07-28
GB2222721A (en) 1990-03-14
FR2636777A1 (en) 1990-03-23
FR2636777B1 (en) 1994-02-11
DE3927866A1 (en) 1990-03-08

Similar Documents

Publication Publication Date Title
EP0339912A3 (en) Semiconductor arrays
GB8805155D0 (en) Semiconductor assembly
IL85389A0 (en) Thermoelectric devices
GB8710359D0 (en) Semiconductor element
GB8803924D0 (en) Semiconductor devices
KR920007792B1 (en) Compound semiconductor element
GB2215125B (en) Semiconductor device
GB2242069B (en) Semiconductor element
GB8918867D0 (en) Semiconductor element
GB8819949D0 (en) Semiconductor devices
EP0334759A3 (en) Semiconductor device
EP0346120A3 (en) Semiconductor device
GB9126847D0 (en) Semiconductor element
KR910009358B1 (en) Semiconductor devices
KR930001219B1 (en) Semiconductor device
GB8829161D0 (en) Semiconductor device manufacture
GB8811583D0 (en) Semiconductor devices
GB9015141D0 (en) Semiconductor device
GB8918192D0 (en) Semiconductor devices
GB8915238D0 (en) Semiconductor devices
GB8824840D0 (en) Semiconductor arrangement
CS892788A1 (en) All-controlled semiconductor component
GB8827581D0 (en) Semiconductor devices
GB8807052D0 (en) Semiconductor processes
CA61191S (en) Sink

Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20040818