GB887568A - Improvements in or relating to mounting arrangements for semiconductor devices - Google Patents

Improvements in or relating to mounting arrangements for semiconductor devices

Info

Publication number
GB887568A
GB887568A GB1814058A GB1814058A GB887568A GB 887568 A GB887568 A GB 887568A GB 1814058 A GB1814058 A GB 1814058A GB 1814058 A GB1814058 A GB 1814058A GB 887568 A GB887568 A GB 887568A
Authority
GB
United Kingdom
Prior art keywords
duct
bar
bus
tube
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1814058A
Inventor
Nehemiah Herwald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Priority to GB1814058A priority Critical patent/GB887568A/en
Publication of GB887568A publication Critical patent/GB887568A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)

Abstract

887,568. Semi-conductor rectifiers. GENERAL ELECTRIC CO. Ltd. June 8, 1959 [June 6, 1958], No. 18140/58. Class 37. Semi-conductor devices, e.g. power rectifiers, of the kind having electrodes formed by blocks of high thermal and electrical conductivity and cooled by cooling fluid, are mounted in communication with apertures in a support comprising a duct for cooling fluid, and removable inserts direct the cooling fluid from the duct to the base electrodes and back into the duct. As shown, one electrode of a rectifier 6 is constituted by a hollow cylindrical block of copper closed at the end bearing the semi-conductor, e.g. germanium, body, and is clamped by means of a captive nut 7 on to a tube 4 of brass or copper which is brazed or screwed to a hollow copper bus-bar 1, the bore of the tube 4 communicating with the duct 2 in the bus-bar 1 by means of an aperture in the latter. A tubular insert 9 extending from the duct 2 into tube 4 is fixed in the latter by a screw-threaded sleeve 17 bearing down on a perforated circumferential fin 14 on the insert 9. The end of the insert 9 within the duct 2 is closed, and a side opening 13 faces upstream of the flow of cooling fluid in the duct so that the fluid passes up the bore 10 of the insert 9 to cool the base electrode and back to the duct 2 via an annular passage 11 between tube 4 and insert 9. In this way, a plurality of rectifiers mounted on bus-bar 1 are cooled in series. In a modification, the hollow bus-bar 1 is replaced by a solid bus-bar brazed to a pipe ; alternatively, the bus-bar, pipe, and tube 4 are cast together as an integral unit. Reference has been directed by the Comptroller to Specification 859,849.
GB1814058A 1958-06-06 1958-06-06 Improvements in or relating to mounting arrangements for semiconductor devices Expired GB887568A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1814058A GB887568A (en) 1958-06-06 1958-06-06 Improvements in or relating to mounting arrangements for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1814058A GB887568A (en) 1958-06-06 1958-06-06 Improvements in or relating to mounting arrangements for semiconductor devices

Publications (1)

Publication Number Publication Date
GB887568A true GB887568A (en) 1962-01-17

Family

ID=10107332

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1814058A Expired GB887568A (en) 1958-06-06 1958-06-06 Improvements in or relating to mounting arrangements for semiconductor devices

Country Status (1)

Country Link
GB (1) GB887568A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3389305A (en) * 1966-08-01 1968-06-18 Gen Motors Corp Mounting and cooling apparatus for semiconductor devices
US3400543A (en) * 1966-10-31 1968-09-10 Peter G. Ross Semi-conductor cooling means
US4576224A (en) * 1983-09-21 1986-03-18 Plessey Overseas Limited Diamond heatsink assemblies

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3389305A (en) * 1966-08-01 1968-06-18 Gen Motors Corp Mounting and cooling apparatus for semiconductor devices
US3400543A (en) * 1966-10-31 1968-09-10 Peter G. Ross Semi-conductor cooling means
US4576224A (en) * 1983-09-21 1986-03-18 Plessey Overseas Limited Diamond heatsink assemblies

Similar Documents

Publication Publication Date Title
US3366171A (en) Heat sink for semi-conductor elements
SE441047B (en) Semi-conductor valve for high voltage with voltage divider sections including resistance
GB1029171A (en) A semiconductor arrangement
GB1191887A (en) Semiconductor Rectifier Assemblies
US2252365A (en) Die holder
GB1353529A (en) Semiconductor rectifier assemblies
GB1060891A (en) Compression connected semiconductor device
GB887568A (en) Improvements in or relating to mounting arrangements for semiconductor devices
US3173061A (en) Cooled semi-conductor rectifier assembly
GB1014557A (en) Improvements in or relating to devices for use in high frequency electric current welding
GB881167A (en) Electrolytic machining apparatus
US3626079A (en) Electrical bushing with cooling means
GB872894A (en) Improvements in or relating to mounting arrangements for semiconductor devices
US2815473A (en) Semiconductor devices
US2726310A (en) Electric arc welding torch with a liquid-cooled nonconsuming electrode
JPS6451645A (en) Circuit device with a plurality of electric element to be cooled
FR2447084A1 (en) HIGH THERMAL DISSIPATION POWER CAPACITOR
US3192453A (en) Rectifier stack
GB886456A (en) Semiconductor rectifiers
GB806596A (en) Improvements in or relating to semi-conductor devices
ES251880A1 (en) Improvements relating to the cooling of semi-conductor devices
US4558257A (en) Travelling wave tube arrangements
JPH0295517A (en) Feeder die for wire cut electric discharge machining machine
GB859849A (en) Improvements in or relating to semiconductor devices
GB979579A (en) Device for cooling plural heat generators to a substantially uniform temperature