GB8815275D0 - Method of manufacturing printed circuit boards - Google Patents

Method of manufacturing printed circuit boards

Info

Publication number
GB8815275D0
GB8815275D0 GB888815275A GB8815275A GB8815275D0 GB 8815275 D0 GB8815275 D0 GB 8815275D0 GB 888815275 A GB888815275 A GB 888815275A GB 8815275 A GB8815275 A GB 8815275A GB 8815275 D0 GB8815275 D0 GB 8815275D0
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
manufacturing printed
manufacturing
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB888815275A
Other versions
GB2206541A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PSI Star Inc
Original Assignee
PSI Star Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PSI Star Inc filed Critical PSI Star Inc
Publication of GB8815275D0 publication Critical patent/GB8815275D0/en
Publication of GB2206541A publication Critical patent/GB2206541A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
GB08815275A 1987-07-02 1988-06-27 Manufacturing printed circuit boards Withdrawn GB2206541A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6938287A 1987-07-02 1987-07-02

Publications (2)

Publication Number Publication Date
GB8815275D0 true GB8815275D0 (en) 1988-08-03
GB2206541A GB2206541A (en) 1989-01-11

Family

ID=22088623

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08815275A Withdrawn GB2206541A (en) 1987-07-02 1988-06-27 Manufacturing printed circuit boards

Country Status (4)

Country Link
JP (1) JPS6489588A (en)
DE (1) DE3822403A1 (en)
FR (1) FR2617667B1 (en)
GB (1) GB2206541A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912733A (en) * 1989-03-27 1990-03-27 General Electric Company Steam-water separating system for boiling water nuclear reactors
EP0563744B1 (en) * 1992-03-30 1998-09-09 Seiko Instruments Inc. Method of electrochemical fine processing
EP3518631A1 (en) 2018-01-29 2019-07-31 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Anisotropic etching using highly branched polymers
CN110927422B (en) * 2019-02-22 2021-11-02 宁波三星医疗电气股份有限公司 Electric energy meter bottom shell and injection molding process of bottom shell

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4961665A (en) * 1972-10-18 1974-06-14
JPS528473A (en) * 1975-07-08 1977-01-22 Hirotoshi Nomura Method of manufacturing printed wiring board using tinnnickel alloy plated on substrate as etching gist
JPS5999793A (en) * 1982-11-29 1984-06-08 山下サーキテック株式会社 Printed circuit board
JPS59175189A (en) * 1983-03-23 1984-10-03 株式会社　サト−セン Method of producing printed circuit board
US4497687A (en) * 1983-07-28 1985-02-05 Psi Star, Inc. Aqueous process for etching cooper and other metals
US4482425A (en) * 1983-06-27 1984-11-13 Psi Star, Inc. Liquid etching reactor and method
US4543153A (en) * 1984-05-17 1985-09-24 Psi Star Process and apparatus for etching copper masked by a nickel-gold mask
US4545850A (en) * 1984-08-20 1985-10-08 Psi Star Regenerative copper etching process and solution
JPS61226997A (en) * 1985-03-30 1986-10-08 株式会社東芝 Manufacture of printed wiring board
US4605471A (en) * 1985-06-27 1986-08-12 Ncr Corporation Method of manufacturing printed circuit boards
US4632727A (en) * 1985-08-12 1986-12-30 Psi Star Copper etching process and solution

Also Published As

Publication number Publication date
DE3822403A1 (en) 1989-01-12
FR2617667A1 (en) 1989-01-06
GB2206541A (en) 1989-01-11
FR2617667B1 (en) 1991-04-26
JPS6489588A (en) 1989-04-04

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)