GB8715744D0 - Printed circuit boards - Google Patents

Printed circuit boards

Info

Publication number
GB8715744D0
GB8715744D0 GB878715744A GB8715744A GB8715744D0 GB 8715744 D0 GB8715744 D0 GB 8715744D0 GB 878715744 A GB878715744 A GB 878715744A GB 8715744 A GB8715744 A GB 8715744A GB 8715744 D0 GB8715744 D0 GB 8715744D0
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
boards
printed
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB878715744A
Other versions
GB2193730A (en
GB2193730B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Publication of GB8715744D0 publication Critical patent/GB8715744D0/en
Publication of GB2193730A publication Critical patent/GB2193730A/en
Application granted granted Critical
Publication of GB2193730B publication Critical patent/GB2193730B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
  • Materials For Photolithography (AREA)
GB8715744A 1986-07-11 1987-07-03 Production of printed circuit boards Expired - Lifetime GB2193730B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61163097A JPS6318692A (en) 1986-07-11 1986-07-11 Manufacture of printed wiring board

Publications (3)

Publication Number Publication Date
GB8715744D0 true GB8715744D0 (en) 1987-08-12
GB2193730A GB2193730A (en) 1988-02-17
GB2193730B GB2193730B (en) 1991-04-03

Family

ID=15767122

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8715744A Expired - Lifetime GB2193730B (en) 1986-07-11 1987-07-03 Production of printed circuit boards

Country Status (4)

Country Link
JP (1) JPS6318692A (en)
KR (1) KR900003848B1 (en)
DE (1) DE3722749C2 (en)
GB (1) GB2193730B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004672A (en) * 1989-07-10 1991-04-02 Shipley Company Inc. Electrophoretic method for applying photoresist to three dimensional circuit board substrate
US5352326A (en) * 1993-05-28 1994-10-04 International Business Machines Corporation Process for manufacturing metalized ceramic substrates
TW290583B (en) * 1993-10-14 1996-11-11 Alpha Metals Ltd
JP4126793B2 (en) * 1998-10-09 2008-07-30 チッソ株式会社 Resin composition for color filter
JP4715234B2 (en) * 2005-02-28 2011-07-06 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, printed wiring board manufacturing method, and photocured product removing method
DE102020215812A1 (en) 2020-12-14 2022-06-15 Robert Bosch Gesellschaft mit beschränkter Haftung power module

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1548401A (en) * 1967-08-16 1968-12-06
GB1414453A (en) * 1971-09-03 1975-11-19 Ici Ltd Recording material
DE2406400B2 (en) * 1973-02-14 1977-04-28 Hitachi Chemical Co., Ltd., Tokio LIGHT-SENSITIVE RESIN COMPOSITIONS ON THE BASIS OF COMPOUNDS WITH EPOXY OR. PHOTOPOLYMERIZABLE ACRYLIC GROUPS
US4089686A (en) * 1976-04-19 1978-05-16 Western Electric Company, Inc. Method of depositing a metal on a surface
JPS5619752A (en) * 1979-07-27 1981-02-24 Hitachi Chemical Co Ltd Photosensitive resin composition laminate
US4394434A (en) * 1980-12-08 1983-07-19 Minnesota Mining And Manufacturing Company Plating resist with improved resistance to extraneous plating
US4454219A (en) * 1981-04-27 1984-06-12 Hitachi Chemical Company, Ltd. Photosensitive resin composition comprised of a polymer obtained from an aliphatic amino group-containing monomer as a comonomer
US4411980A (en) * 1981-09-21 1983-10-25 E. I. Du Pont De Nemours And Company Process for the preparation of flexible circuits
JPS5888741A (en) * 1981-11-20 1983-05-26 Hitachi Chem Co Ltd Photosensitive resin composition and its laminate
US4448804A (en) * 1983-10-11 1984-05-15 International Business Machines Corporation Method for selective electroless plating of copper onto a non-conductive substrate surface
GB2150596A (en) * 1983-11-30 1985-07-03 Pa Consulting Services Mesh structures especially for use in television camera tubes
JPH0642073B2 (en) * 1984-04-10 1994-06-01 三菱レイヨン株式会社 Photopolymerizable resin composition
JPH0731399B2 (en) * 1984-12-21 1995-04-10 三菱化学株式会社 Photopolymerizable composition

Also Published As

Publication number Publication date
GB2193730A (en) 1988-02-17
KR900003848B1 (en) 1990-06-02
KR880002416A (en) 1988-04-30
DE3722749C2 (en) 1994-09-15
JPH0344432B2 (en) 1991-07-05
GB2193730B (en) 1991-04-03
JPS6318692A (en) 1988-01-26
DE3722749A1 (en) 1988-01-21

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19990703