GB864004A - Improvements relating to semi-conductor rectifiers - Google Patents
Improvements relating to semi-conductor rectifiersInfo
- Publication number
- GB864004A GB864004A GB39184/58A GB3918458A GB864004A GB 864004 A GB864004 A GB 864004A GB 39184/58 A GB39184/58 A GB 39184/58A GB 3918458 A GB3918458 A GB 3918458A GB 864004 A GB864004 A GB 864004A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cup
- tube
- conductor
- pin
- germanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 4
- 239000004020 conductor Substances 0.000 abstract 4
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 abstract 3
- 229910052732 germanium Inorganic materials 0.000 abstract 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 3
- 239000011521 glass Substances 0.000 abstract 2
- 229910052738 indium Inorganic materials 0.000 abstract 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 2
- 239000008188 pellet Substances 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 abstract 1
- 229910001128 Sn alloy Inorganic materials 0.000 abstract 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract 1
- 239000011324 bead Substances 0.000 abstract 1
- 239000005388 borosilicate glass Substances 0.000 abstract 1
- 230000005496 eutectics Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 abstract 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
864,004. Semi-conductor devices. ASSOCIATED ELECTRICAL INDUSTRIES Ltd. Dec. 3,1959 [Dec. 4, 1958], No. 39184/58. Class 37. An hermetically-sealed rectifier has a wafer of semi-conducting material in the bottom of a cup joined at its flanged rim to a similar flanged rim of another cup, a lead which makes connection to the wafer passing through a tube sealed in vitreous material in the base of the other cup. In the arrangement shown in Fig. 1 a wafer 4 of germanium is soldered to the base of cup 2 which is of a cobalt-nickel iron alloy and which carries a butt-welded conductor 7, by a lead-tin eutectic solder containing 1% by weight of antimony. A pellet 10 of indium is alloyed to the germanium at about 500‹ C. to form the junction and a nickel wire 6 is fused to conductor 10. Cup 1 which contains a seal 9 of a borosilicate glass whose coefficient of expansion is compatible with that of the cup is presented to the lower cup so that nickel wire 6 passes through nickel tube 8. The flanges of the two cups are resistance-welded together at 3 and tube 8 pinched off to seal the housing. In a further embodiment (Fig. 3) where the whole device is so small that threading the conductor through tube 8 would be difficult, a flat headed pin 6 is used instead of conductor 1. The head of the pin is coated with an indium tin alloy (50: 50 by weight). Initially the two housings are sealed together with cup 1 below cup 2 so that the head of the pin rests on tube 8. The arrangement is then inverted so that the head of the pin contacts the indium pellet. Further heating to 150‹ C. solders them together and tube 8 is then pinched off. The Specification states that the rectifier may be silicon instead of germanium and that instead of the glass filling shown in cup 1, a small glass bead may be provided in the base of the cup.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB39184/58A GB864004A (en) | 1958-12-04 | 1958-12-04 | Improvements relating to semi-conductor rectifiers |
| FR812033A FR1241700A (en) | 1958-12-04 | 1959-12-03 | Improvements to rectifiers in semiconductor materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB39184/58A GB864004A (en) | 1958-12-04 | 1958-12-04 | Improvements relating to semi-conductor rectifiers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB864004A true GB864004A (en) | 1961-03-29 |
Family
ID=10408148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB39184/58A Expired GB864004A (en) | 1958-12-04 | 1958-12-04 | Improvements relating to semi-conductor rectifiers |
Country Status (2)
| Country | Link |
|---|---|
| FR (1) | FR1241700A (en) |
| GB (1) | GB864004A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3237063A (en) * | 1962-01-10 | 1966-02-22 | Bbc Brown Boveri & Cie | Connection for the control electrode of a semiconductor rectifier |
-
1958
- 1958-12-04 GB GB39184/58A patent/GB864004A/en not_active Expired
-
1959
- 1959-12-03 FR FR812033A patent/FR1241700A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3237063A (en) * | 1962-01-10 | 1966-02-22 | Bbc Brown Boveri & Cie | Connection for the control electrode of a semiconductor rectifier |
Also Published As
| Publication number | Publication date |
|---|---|
| FR1241700A (en) | 1960-09-16 |
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