Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
  • H01L2223/544—Marks applied to semiconductor devices or parts
  • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
  • H01L2223/544—Marks applied to semiconductor devices or parts
  • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
  • H01L2223/544—Marks applied to semiconductor devices or parts
  • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
  • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Packaging Frangible Articles (AREA)
• Drying Of Solid Materials (AREA)
• Control And Other Processes For Unpacking Of Materials (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
• Die Bonding (AREA)
• Printing Methods (AREA)

Applications Claiming Priority (1)

Publications (2)

Family

ID=6263253

Family Applications (1)

Country Status (4)

Families Citing this family (2)

Family Cites Families (4)

• 1985
  • 1985-02-22 DE DE19853506172 patent/DE3506172A1/en not_active Withdrawn
• 1986
  • 1986-02-21 FR FR8602442A patent/FR2578098A1/en not_active Withdrawn
  • 1986-02-21 GB GB8604332A patent/GB2171359A/en not_active Withdrawn
  • 1986-02-21 JP JP3540086A patent/JPS61194853A/en active Pending

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