GB8511346D0 - Forming ceramic films - Google Patents

Forming ceramic films

Info

Publication number
GB8511346D0
GB8511346D0 GB8511346A GB8511346A GB8511346D0 GB 8511346 D0 GB8511346 D0 GB 8511346D0 GB 8511346 A GB8511346 A GB 8511346A GB 8511346 A GB8511346 A GB 8511346A GB 8511346 D0 GB8511346 D0 GB 8511346D0
Authority
GB
United Kingdom
Prior art keywords
forming ceramic
ceramic films
films
forming
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8511346A
Other versions
GB2158463A (en
GB2158463B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB8210135A external-priority patent/GB2117795A/en
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB8511346A priority Critical patent/GB2158463B/en
Publication of GB8511346D0 publication Critical patent/GB8511346D0/en
Publication of GB2158463A publication Critical patent/GB2158463A/en
Application granted granted Critical
Publication of GB2158463B publication Critical patent/GB2158463B/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/02—Electrophoretic coating characterised by the process with inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
GB8511346A 1982-04-06 1985-05-03 Forming ceramic films Expired GB2158463B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8511346A GB2158463B (en) 1982-04-06 1985-05-03 Forming ceramic films

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8210135A GB2117795A (en) 1982-04-06 1982-04-06 Fabricating capacitors; forming ceramic films
GB8511346A GB2158463B (en) 1982-04-06 1985-05-03 Forming ceramic films

Publications (3)

Publication Number Publication Date
GB8511346D0 true GB8511346D0 (en) 1985-06-12
GB2158463A GB2158463A (en) 1985-11-13
GB2158463B GB2158463B (en) 1986-11-19

Family

ID=26282481

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8511346A Expired GB2158463B (en) 1982-04-06 1985-05-03 Forming ceramic films

Country Status (1)

Country Link
GB (1) GB2158463B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1326467C (en) * 1987-04-22 1994-01-25 Kouichi Iwata Process for producing a superconducting article
EP0316143A3 (en) * 1987-11-09 1989-07-26 Ametek Inc. Formation of superconducting articles by electrodeposition
EP0316275A3 (en) * 1987-11-10 1989-08-09 Ciba-Geigy Ag Process for manufacturing superconducting materials with a desired shape
DE19919818C1 (en) * 1999-04-30 2000-05-04 Bosch Gmbh Robert Nanocrystalline metal oxide electrophoretic deposition bath, for producing green ceramic bodies, is prepared by kneading and then diluting a metal oxide concentrate
US8216006B2 (en) * 2009-06-09 2012-07-10 Tyco Electronics Corporation Composite assembly for an electrical connector and method of manufacturing the composite assembly
US8784147B2 (en) 2009-06-09 2014-07-22 Tyco Electronics Corporation Composite assembly for an electrical connector and method of manufacturing the composite assembly
US8790144B2 (en) 2010-06-07 2014-07-29 Tyco Electronics Corporation Contact assembly for an electrical connector and method of manufacturing the contact assembly

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA918599A (en) * 1969-05-19 1973-01-09 Ford Motor Company Of Canada Electrodeposition of particulate material
US3629086A (en) * 1969-12-12 1971-12-21 Ford Motor Co Anodic deposition of ceramic frit with cationic envelope
US3622486A (en) * 1969-12-12 1971-11-23 Ford Motor Co Anodic deposition of frit in dual envelope
NL7500492A (en) * 1975-01-16 1976-07-20 Philips Nv PROCESS FOR THE MANUFACTURE OF SEMI-GUIDE DEVICES, IN WHICH A GLASS COVER IS APPLIED, AND SEMI-GUIDE DEVICES MANUFACTURED ACCORDING TO THIS PROCESS.

Also Published As

Publication number Publication date
GB2158463A (en) 1985-11-13
GB2158463B (en) 1986-11-19

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee