GB8409453D0 - Housing for electrical component - Google Patents
Housing for electrical componentInfo
- Publication number
- GB8409453D0 GB8409453D0 GB848409453A GB8409453A GB8409453D0 GB 8409453 D0 GB8409453 D0 GB 8409453D0 GB 848409453 A GB848409453 A GB 848409453A GB 8409453 A GB8409453 A GB 8409453A GB 8409453 D0 GB8409453 D0 GB 8409453D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- housing
- electrical component
- electrical
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/20—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08409453A GB2157487B (en) | 1984-04-12 | 1984-04-12 | Housing for an electrical component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08409453A GB2157487B (en) | 1984-04-12 | 1984-04-12 | Housing for an electrical component |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8409453D0 true GB8409453D0 (en) | 1984-05-23 |
GB2157487A GB2157487A (en) | 1985-10-23 |
GB2157487B GB2157487B (en) | 1987-11-18 |
Family
ID=10559550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08409453A Expired GB2157487B (en) | 1984-04-12 | 1984-04-12 | Housing for an electrical component |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2157487B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2665817B1 (en) * | 1990-08-07 | 1996-08-02 | Auxilec | ELECTRODE AND HOUSING DIODE ASSEMBLED WITHOUT WELDING OR CRIMPING, AND RECTIFIER BRIDGE MADE WITH SUCH DIODES. |
GB9109542D0 (en) * | 1991-05-02 | 1991-06-26 | Semitron Ind Ltd | Semiconductor device assembly |
CN111146169B (en) * | 2018-11-06 | 2022-03-18 | 株洲中车时代半导体有限公司 | Conductive disc spring assembly for crimping module |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1140677A (en) * | 1965-05-07 | 1969-01-22 | Ass Elect Ind | Improvements relating to semi-conductor devices |
GB1157041A (en) * | 1966-04-29 | 1969-07-02 | Int Rectifier Corp | Improvements in Semiconductor Device Assemblies |
SE333197B (en) * | 1966-12-27 | 1971-03-08 | Asea Ab | SEMICONDUCTOR FOR GREAT CURRENTS |
DE2604722A1 (en) * | 1975-02-27 | 1976-09-09 | Bendix Corp | SEMICONDUCTOR ELEMENT |
-
1984
- 1984-04-12 GB GB08409453A patent/GB2157487B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2157487B (en) | 1987-11-18 |
GB2157487A (en) | 1985-10-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |