GB822826A - Printed circuitry laminates and production thereof - Google Patents

Printed circuitry laminates and production thereof

Info

Publication number
GB822826A
GB822826A GB3213956A GB3213956A GB822826A GB 822826 A GB822826 A GB 822826A GB 3213956 A GB3213956 A GB 3213956A GB 3213956 A GB3213956 A GB 3213956A GB 822826 A GB822826 A GB 822826A
Authority
GB
United Kingdom
Prior art keywords
resist
laminate
photo
pattern
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3213956A
Inventor
Cornelius Werberig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ST Regis Paper Co
Original Assignee
ST Regis Paper Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ST Regis Paper Co filed Critical ST Regis Paper Co
Priority to GB3213956A priority Critical patent/GB822826A/en
Publication of GB822826A publication Critical patent/GB822826A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0376Flush conductors, i.e. flush with the surface of the printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

822,826. Laminates; coating webs. ST. REGIS PAPER CO. Oct. 22, 1956, No. 32139/56. Class 140. [Also in Groups XV and XXXVI] A thermoset resinous laminate having pattern areas of thin sheetmetal, which may form an electric circuit or part thereof, embedded in at least one surface of the laminate, is produced by forming or providing on one surface of a thin sheet of metal a self-supporting, firmly adhering, insulating film, resist printing the opposite surface of said metal sheet to define said pattern areas, removing the unprinted portions of said metal sheet by etching, leaving only said metal pattern on said film, superimposing said film, with said metal pattern exposed, on to a stacked assembly of sheets of fibrous material impregnated with a thermosetting resin, and hot pressing said assembly and superimposed film between platens to consolidate the same into a unitary, thermo-set laminate having said metal pattern embedded flush with the laminate in a surface thereof. As shown, in Fig. 1, a continuous strip 10 of thin copper foil is fed from a roll 11 between rolls 13 and 14. Roll 14 is partially submerged in a bath 15 of liquid plastic material, e.g. a solution of an alkylated phenol-formaldehyde resin and a polyvinyl butyral resin in a solvent such as acetone, methyl iso-butyl ketone or other low-boiling ketone, and deposits a coating of this solution on the foil. The coated foil is conducted past a bank of infra-red lamps 17 to evaporate the solvent and then over a roll 18 where it is sprayed with a photo-sensitive resist, through a nozzle 20, mounted in a housing 19 and connected through a pipe-line 21 with a reservoir 22 filled with the photo-resist. The foil then passes a second bank of drying lamps 25 to dry the photo-resist. The foil then passes about a drum 26 having transparent areas in its periphery in the form of the metallic pattern required in the finished laminate, the remainder of the periphery being opaque. The drum is rotated and has a mercury arc or equivalent lamp 28 in its interior to produce a photographic image on the photo-resist coating. The foil then passes over guide rolls through successive tanks containing (a) a solvent to dissolve off the unexposed portions of the photo-resist, (b) an etching-agent (e.g. 40% solution of FeCl 3 ) to dissolve away the thus-exposed areas of the copper foil, and (c) water in each of two successive wash tanks. The material is passed between squeegee rolls as it emerges from each of the solvent and etching tanks and from the second wash tank. After washing, the material is fed over an inspection unit 51, provided with a light source 52 for indicating any flaws. It is then passed through a cutting-device which cuts the strip into lengths corresponding with the pattern areas, the cut lengths being stacked at 55. The plastic material may be applied as a preformed continuous film instead of in liquid form, or a suitable resist may be printed on in the required pattern by means of a print roll instead of using the photo-sensitive resist. A cut length of the etched strip is used as the surface sheet of a laminating assembly, the unetched metal being on the outside. The other surface sheet of the assembly may be a similar sheet bearing a different pattern. Between the two surface sheets is interposed an assembly of sheets of fibrous material (e.g. kraft paper) impregnated with thermosetting (e.g. phenolformaldehyde) resin. The complete assembly is pressed between the platens of a heated press to cure the resin and press the metal pattern flush with the surface of the laminate. To align the circuit patterns on the two faces, when two are employed, the patterned areas may include copper foil corner-tabs 65 (Fig. 3) and border outlines 66. When assembling the laminate the edges are clamped together, as by stapling, and holes punched through the corner tabs, as at 67, in which are inserted plastic aligning pins. After hot pressing the stapled edges of the laminate are sheared off. The photo-resist is removed after etching by means of toluene, xylene or similar solvent, either before or after laminating. Specification 639,178, [Group XXXVI], is referred to.
GB3213956A 1956-10-22 1956-10-22 Printed circuitry laminates and production thereof Expired GB822826A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3213956A GB822826A (en) 1956-10-22 1956-10-22 Printed circuitry laminates and production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3213956A GB822826A (en) 1956-10-22 1956-10-22 Printed circuitry laminates and production thereof

Publications (1)

Publication Number Publication Date
GB822826A true GB822826A (en) 1959-11-04

Family

ID=10333895

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3213956A Expired GB822826A (en) 1956-10-22 1956-10-22 Printed circuitry laminates and production thereof

Country Status (1)

Country Link
GB (1) GB822826A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912288A (en) * 1985-09-04 1990-03-27 Allen-Bradley International Limited Moulded electric circuit package
GB2246476A (en) * 1990-04-17 1992-01-29 Nippon Cmk Kk Forming carbon resistance on P.C.B.
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
WO1999029149A1 (en) * 1997-11-28 1999-06-10 Resco S.R.L. Method and machine for producing flexible and semirigid printed-circuit boards
US20170092913A1 (en) * 2015-09-30 2017-03-30 Sumitomo Chemical Company, Limited Film production method and film production device
CN108060437A (en) * 2018-02-05 2018-05-22 广东嘉元科技股份有限公司 A kind of copper foil production cutting integrated production line
CN108085719A (en) * 2018-02-05 2018-05-29 广东嘉元科技股份有限公司 A kind of copper foil produces cutting integrated machine
CN116321760A (en) * 2022-12-06 2023-06-23 世大新材料(深圳)有限公司 Compression molding method for high-frequency circuit board material layer

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912288A (en) * 1985-09-04 1990-03-27 Allen-Bradley International Limited Moulded electric circuit package
US5003693A (en) * 1985-09-04 1991-04-02 Allen-Bradley International Limited Manufacture of electrical circuits
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
GB2246476A (en) * 1990-04-17 1992-01-29 Nippon Cmk Kk Forming carbon resistance on P.C.B.
GB2246476B (en) * 1990-04-17 1993-11-17 Nippon Cmk Kk A method of forming a carbon resistance on a printed wiring board
WO1999029149A1 (en) * 1997-11-28 1999-06-10 Resco S.R.L. Method and machine for producing flexible and semirigid printed-circuit boards
US20170092913A1 (en) * 2015-09-30 2017-03-30 Sumitomo Chemical Company, Limited Film production method and film production device
CN108060437A (en) * 2018-02-05 2018-05-22 广东嘉元科技股份有限公司 A kind of copper foil production cutting integrated production line
CN108085719A (en) * 2018-02-05 2018-05-29 广东嘉元科技股份有限公司 A kind of copper foil produces cutting integrated machine
CN108085719B (en) * 2018-02-05 2023-06-23 广东嘉元科技股份有限公司 Copper foil production and slitting integrated machine
CN108060437B (en) * 2018-02-05 2023-06-23 广东嘉元科技股份有限公司 Integrated production line is cut in copper foil production
CN116321760A (en) * 2022-12-06 2023-06-23 世大新材料(深圳)有限公司 Compression molding method for high-frequency circuit board material layer
CN116321760B (en) * 2022-12-06 2023-11-24 世大新材料(深圳)有限公司 Compression molding method for high-frequency circuit board material layer

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