GB759012A - Semiconductor electric signal translating devices and methods of making them - Google Patents

Semiconductor electric signal translating devices and methods of making them

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Publication number
GB759012A
GB759012A GB2163451A GB2163451A GB759012A GB 759012 A GB759012 A GB 759012A GB 2163451 A GB2163451 A GB 2163451A GB 2163451 A GB2163451 A GB 2163451A GB 759012 A GB759012 A GB 759012A
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GB
United Kingdom
Prior art keywords
germanium
electrode
type
sept
impurity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2163451A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US184870A external-priority patent/US2950425A/en
Priority claimed from US184869A external-priority patent/US2792538A/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB759012A publication Critical patent/GB759012A/en
Expired legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01ELECTRIC ELEMENTS
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
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Abstract

759,012. Heat-treating semi-conductor material; coating by vapour deposition. WESTERN ELECTRIC CO., Inc. Sept. 14, 1951 [Sept. 14, 1950; Sept. 14, 1950], No. 21634/51. Classes 72 and 82(2). [Also in Group XXXVI] A signal translating device comprises a metallic electrode which is embedded in, or bonded to a germanium or silicon body, and the region of the body in the vicinity of the electrode has its significant impurity content modified. In one example, an electric current is passed through an unpointed gold wire 25 applied to the surface of an N-type germanium wafer 22 until the germanium fuses. The gold alloys with the germanium and Fig. 2 shows the resulting physical bond; a thin region P is converted to P-type conductivity by diffusion of the gold. The arrangement provides an improvised rectifying contact. The wire may be pressed into the fused body so that it is embedded in the germanium. Two adjoining electrodes of this type may be provided to form a transistor. Various embodiments are described. The electrode may include a significant impurity which is introduced into the semi-conductor body either during the embedding or bonding operation or by subsequent heat treatment. Alternatively, conductivity inversion or modification may be carried out by thermal treatment during, or after, bonding without introduction of impurity. Heating may be effected by passing current through the electrode or by an electric arc, and may be carried out in vacuo-inert gas or air. The electrode can also consist of an iron-nickel alloy, platinum, tantalum, or tungsten. Coating of the electrode with acceptor or donor material may be effected by heating a wire in a vapour, of for example antimony or phosphorus. It improves transistor properties if the emitter used on N-type material and/or the collector used on P-type material comprise a major portion of acceptor material and a minor portion of donor material so that the structure finally has an NPN formation. The conductivity types and acceptors and donors may be interchanged to achieve the same result. Silicon or germanium may be used as semiconductor material. Copper is included as an example of an acceptor impurity. Specifications 632,942, 632,980, 694,021, 700,231, 700,232 [Group XXXVI], and 721,671 are referred to.
GB2163451A 1950-09-14 1951-09-14 Semiconductor electric signal translating devices and methods of making them Expired GB759012A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US184870A US2950425A (en) 1950-09-14 1950-09-14 Semiconductor signal translating devices
US184869A US2792538A (en) 1950-09-14 1950-09-14 Semiconductor translating devices with embedded electrode

Publications (1)

Publication Number Publication Date
GB759012A true GB759012A (en) 1956-10-10

Family

ID=26880550

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2163451A Expired GB759012A (en) 1950-09-14 1951-09-14 Semiconductor electric signal translating devices and methods of making them

Country Status (6)

Country Link
BE (1) BE505814A (en)
CH (1) CH302296A (en)
DE (1) DE977615C (en)
FR (1) FR1038658A (en)
GB (1) GB759012A (en)
NL (2) NL162993B (en)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
US3525146A (en) * 1965-12-11 1970-08-25 Sanyo Electric Co Method of making semiconductor devices having crystal extensions for leads

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DE977596C (en) * 1952-03-13 1967-08-03 Siemens Ag Process for the production of an area p-n rectifier or area transistor
NL178757B (en) * 1952-06-02 British Steel Corp METHOD AND DEVICE FOR THE CONTINUOUS PRODUCTION OF A METAL STRIP FROM METAL POWDER.
GB805292A (en) * 1953-12-02 1958-12-03 Philco Corp Semiconductor devices
BE534311A (en) * 1953-12-23
CA563722A (en) * 1953-12-31 1958-09-23 N.V. Philips Gloeilampenfabrieken Semiconductor junction electrodes and method
US2829992A (en) * 1954-02-02 1958-04-08 Hughes Aircraft Co Fused junction semiconductor devices and method of making same
DE1109270B (en) * 1954-04-07 1961-06-22 Standard Elektrik Lorenz Ag Method for melting a power supply to an alloy electrode of a semiconductor arrangement
DE1032408B (en) * 1954-06-21 1958-06-19 Siemens Ag Process for the production of p-n junctions according to the alloy or diffusion process
US2846626A (en) * 1954-07-28 1958-08-05 Raytheon Mfg Co Junction transistors and methods of forming them
NL199836A (en) * 1954-08-23 1900-01-01
DE1107343B (en) * 1954-10-14 1961-05-25 Licentia Gmbh Method for manufacturing electrical semiconductor devices
NL200888A (en) * 1954-10-29
DE1027323B (en) * 1954-12-02 1958-04-03 Siemens Ag Surface transistor and method of manufacture
US2885608A (en) * 1954-12-03 1959-05-05 Philco Corp Semiconductive device and method of manufacture
US2941131A (en) * 1955-05-13 1960-06-14 Philco Corp Semiconductive apparatus
US2927222A (en) * 1955-05-27 1960-03-01 Philco Corp Polarizing semiconductive apparatus
NL106108C (en) * 1955-07-21
US2856320A (en) * 1955-09-08 1958-10-14 Ibm Method of making transistor with welded collector
US2862160A (en) * 1955-10-18 1958-11-25 Hoffmann Electronics Corp Light sensitive device and method of making the same
US2847336A (en) * 1956-01-30 1958-08-12 Rca Corp Processing semiconductor devices
US2916408A (en) * 1956-03-29 1959-12-08 Raytheon Co Fabrication of junction transistors
NL112317C (en) * 1956-05-15
US2845375A (en) * 1956-06-11 1958-07-29 Itt Method for making fused junction semiconductor devices
US3001895A (en) * 1957-06-06 1961-09-26 Ibm Semiconductor devices and method of making same
DE1100818B (en) * 1958-09-24 1961-03-02 Siemens Ag Process for the production of a semiconductor arrangement with a single-crystal, disk-shaped base body made of silicon

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DE518421C (en) * 1927-02-12 1931-10-03 Kurt Brodowski Process for the manufacture of rectifiers for alternating current
GB342643A (en) * 1929-07-11 1931-02-05 British Thomson Houston Co Ltd Improvements relating to electric rectifiers
US2504628A (en) * 1946-03-23 1950-04-18 Purdue Research Foundation Electrical device with germanium alloys
NL85857C (en) * 1948-02-26
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DE840418C (en) * 1949-05-30 1952-06-05 Licentia Gmbh Process for the production of semiconductors containing defects, in particular for dry rectifiers
DE968911C (en) * 1949-06-14 1958-04-10 Licentia Gmbh Electrically controllable dry rectifier and method for its manufacture
DE976468C (en) * 1949-08-15 1963-09-19 Licentia Gmbh Method for producing an excess semiconductor from a defect semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3525146A (en) * 1965-12-11 1970-08-25 Sanyo Electric Co Method of making semiconductor devices having crystal extensions for leads

Also Published As

Publication number Publication date
DE977615C (en) 1967-08-31
BE505814A (en) 1900-01-01
NL90092C (en) 1900-01-01
CH302296A (en) 1954-10-15
NL162993B (en)
FR1038658A (en) 1953-09-30

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