GB753135A - Improvements in or relating to dry rectifiers - Google Patents
Improvements in or relating to dry rectifiersInfo
- Publication number
- GB753135A GB753135A GB23810/53A GB2381053A GB753135A GB 753135 A GB753135 A GB 753135A GB 23810/53 A GB23810/53 A GB 23810/53A GB 2381053 A GB2381053 A GB 2381053A GB 753135 A GB753135 A GB 753135A
- Authority
- GB
- United Kingdom
- Prior art keywords
- rod
- metal
- plate
- bell
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 229910052732 germanium Inorganic materials 0.000 abstract 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000011261 inert gas Substances 0.000 abstract 1
- 229910000833 kovar Inorganic materials 0.000 abstract 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Abstract
753,135. Semi-conductor devices. STANDARD TELEPHONES & CABLES, Ltd. Aug. 28, 1953, No. 23810/53. Class 37. A rectifier assembly comprises a germanium die 3 having a PN junction parallel to the major faces mounted between a recessed copper plate 2 and a metal rod 6 normal to the plate, in an inert atmosphere contained by a metal bell 5 soldered in a circular groove 4 in plate 2 and forming the outer member of a metal-glassmetal seal to the rod 6. The die may be plated with nickel-tin and given the heat treatment described in Specification 753,131 and is tinned on both faces, and the recess and groove are tinned before assembly. The rod and bell are of the metal known by the Registered Trade Mark " Kovar " or of stainless steel and are sealed to a glass ring 8. A spring or spring-pressed terminal may be mounted on rod 6. After assembly the arrangement is heated in inert gas such as forming gas (90 per cent N 2 : 10 per cent H 2 ) and the bell is pressed on the plate so that on cooling all the soldered joints are completed.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB23810/53A GB753135A (en) | 1953-08-28 | 1953-08-28 | Improvements in or relating to dry rectifiers |
DEI8993A DE1083936B (en) | 1953-08-28 | 1954-08-05 | Greater performance semiconductor electric device and method of manufacturing such a device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB23810/53A GB753135A (en) | 1953-08-28 | 1953-08-28 | Improvements in or relating to dry rectifiers |
Publications (1)
Publication Number | Publication Date |
---|---|
GB753135A true GB753135A (en) | 1956-07-18 |
Family
ID=10201675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB23810/53A Expired GB753135A (en) | 1953-08-28 | 1953-08-28 | Improvements in or relating to dry rectifiers |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE1083936B (en) |
GB (1) | GB753135A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1079745B (en) * | 1957-11-02 | 1960-04-14 | Siemens Ag | Semiconductor device with a disk-shaped basic body and method for its manufacture |
DE1125553B (en) * | 1958-10-15 | 1962-03-15 | Siemens Ag | Method for producing a semiconductor device provided with alloyed electrodes |
DE1150154B (en) * | 1958-07-31 | 1963-06-12 | Texas Instruments Inc | Apparatus for enclosing a semiconductor device in a glass envelope |
DE1233949B (en) * | 1959-07-13 | 1967-02-09 | Siemens Ag | Method for producing a semiconductor rectifier arrangement with a single-crystal semiconductor body |
EP1915042A2 (en) | 2006-10-16 | 2008-04-23 | Ferroperm-Emc ApS | Hermetically sealed circuit |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1001269A (en) * | 1960-09-30 | 1900-01-01 | ||
DE1192323B (en) * | 1960-11-02 | 1965-05-06 | Siemens Ag | Method for producing welds between the parts of a housing enclosing a semiconductor element in a gastight manner and arrangements for carrying out this method |
DE1279852B (en) * | 1963-08-05 | 1968-10-10 | Semikron Gleichrichterbau | Process for the production of semiconductor devices |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2563613A (en) * | 1948-03-20 | 1951-08-07 | Translating means for ultra-short | |
FR1028268A (en) * | 1950-11-22 | 1953-05-20 | Philips Nv | Electrode system and manufacturing process |
-
1953
- 1953-08-28 GB GB23810/53A patent/GB753135A/en not_active Expired
-
1954
- 1954-08-05 DE DEI8993A patent/DE1083936B/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1079745B (en) * | 1957-11-02 | 1960-04-14 | Siemens Ag | Semiconductor device with a disk-shaped basic body and method for its manufacture |
DE1150154B (en) * | 1958-07-31 | 1963-06-12 | Texas Instruments Inc | Apparatus for enclosing a semiconductor device in a glass envelope |
DE1125553B (en) * | 1958-10-15 | 1962-03-15 | Siemens Ag | Method for producing a semiconductor device provided with alloyed electrodes |
DE1233949B (en) * | 1959-07-13 | 1967-02-09 | Siemens Ag | Method for producing a semiconductor rectifier arrangement with a single-crystal semiconductor body |
EP1915042A2 (en) | 2006-10-16 | 2008-04-23 | Ferroperm-Emc ApS | Hermetically sealed circuit |
EP1915042A3 (en) * | 2006-10-16 | 2009-09-02 | Ferroperm-Emc ApS | Hermetically sealed circuit |
Also Published As
Publication number | Publication date |
---|---|
DE1083936B (en) | 1960-06-23 |
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