GB753135A - Improvements in or relating to dry rectifiers - Google Patents

Improvements in or relating to dry rectifiers

Info

Publication number
GB753135A
GB753135A GB23810/53A GB2381053A GB753135A GB 753135 A GB753135 A GB 753135A GB 23810/53 A GB23810/53 A GB 23810/53A GB 2381053 A GB2381053 A GB 2381053A GB 753135 A GB753135 A GB 753135A
Authority
GB
United Kingdom
Prior art keywords
rod
metal
plate
bell
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB23810/53A
Inventor
Simon Ernst Mayer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB23810/53A priority Critical patent/GB753135A/en
Priority to DEI8993A priority patent/DE1083936B/en
Publication of GB753135A publication Critical patent/GB753135A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/54—Providing fillings in containers, e.g. gas fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)

Abstract

753,135. Semi-conductor devices. STANDARD TELEPHONES & CABLES, Ltd. Aug. 28, 1953, No. 23810/53. Class 37. A rectifier assembly comprises a germanium die 3 having a PN junction parallel to the major faces mounted between a recessed copper plate 2 and a metal rod 6 normal to the plate, in an inert atmosphere contained by a metal bell 5 soldered in a circular groove 4 in plate 2 and forming the outer member of a metal-glassmetal seal to the rod 6. The die may be plated with nickel-tin and given the heat treatment described in Specification 753,131 and is tinned on both faces, and the recess and groove are tinned before assembly. The rod and bell are of the metal known by the Registered Trade Mark " Kovar " or of stainless steel and are sealed to a glass ring 8. A spring or spring-pressed terminal may be mounted on rod 6. After assembly the arrangement is heated in inert gas such as forming gas (90 per cent N 2 : 10 per cent H 2 ) and the bell is pressed on the plate so that on cooling all the soldered joints are completed.
GB23810/53A 1953-08-28 1953-08-28 Improvements in or relating to dry rectifiers Expired GB753135A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB23810/53A GB753135A (en) 1953-08-28 1953-08-28 Improvements in or relating to dry rectifiers
DEI8993A DE1083936B (en) 1953-08-28 1954-08-05 Greater performance semiconductor electric device and method of manufacturing such a device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB23810/53A GB753135A (en) 1953-08-28 1953-08-28 Improvements in or relating to dry rectifiers

Publications (1)

Publication Number Publication Date
GB753135A true GB753135A (en) 1956-07-18

Family

ID=10201675

Family Applications (1)

Application Number Title Priority Date Filing Date
GB23810/53A Expired GB753135A (en) 1953-08-28 1953-08-28 Improvements in or relating to dry rectifiers

Country Status (2)

Country Link
DE (1) DE1083936B (en)
GB (1) GB753135A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1079745B (en) * 1957-11-02 1960-04-14 Siemens Ag Semiconductor device with a disk-shaped basic body and method for its manufacture
DE1125553B (en) * 1958-10-15 1962-03-15 Siemens Ag Method for producing a semiconductor device provided with alloyed electrodes
DE1150154B (en) * 1958-07-31 1963-06-12 Texas Instruments Inc Apparatus for enclosing a semiconductor device in a glass envelope
DE1233949B (en) * 1959-07-13 1967-02-09 Siemens Ag Method for producing a semiconductor rectifier arrangement with a single-crystal semiconductor body
EP1915042A2 (en) 2006-10-16 2008-04-23 Ferroperm-Emc ApS Hermetically sealed circuit

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1001269A (en) * 1960-09-30 1900-01-01
DE1192323B (en) * 1960-11-02 1965-05-06 Siemens Ag Method for producing welds between the parts of a housing enclosing a semiconductor element in a gastight manner and arrangements for carrying out this method
DE1279852B (en) * 1963-08-05 1968-10-10 Semikron Gleichrichterbau Process for the production of semiconductor devices

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2563613A (en) * 1948-03-20 1951-08-07 Translating means for ultra-short
FR1028268A (en) * 1950-11-22 1953-05-20 Philips Nv Electrode system and manufacturing process

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1079745B (en) * 1957-11-02 1960-04-14 Siemens Ag Semiconductor device with a disk-shaped basic body and method for its manufacture
DE1150154B (en) * 1958-07-31 1963-06-12 Texas Instruments Inc Apparatus for enclosing a semiconductor device in a glass envelope
DE1125553B (en) * 1958-10-15 1962-03-15 Siemens Ag Method for producing a semiconductor device provided with alloyed electrodes
DE1233949B (en) * 1959-07-13 1967-02-09 Siemens Ag Method for producing a semiconductor rectifier arrangement with a single-crystal semiconductor body
EP1915042A2 (en) 2006-10-16 2008-04-23 Ferroperm-Emc ApS Hermetically sealed circuit
EP1915042A3 (en) * 2006-10-16 2009-09-02 Ferroperm-Emc ApS Hermetically sealed circuit

Also Published As

Publication number Publication date
DE1083936B (en) 1960-06-23

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