GB724379A - A method for making a predetermined metallic pattern on an insulating base - Google Patents

A method for making a predetermined metallic pattern on an insulating base

Info

Publication number
GB724379A
GB724379A GB27856/53A GB2785653A GB724379A GB 724379 A GB724379 A GB 724379A GB 27856/53 A GB27856/53 A GB 27856/53A GB 2785653 A GB2785653 A GB 2785653A GB 724379 A GB724379 A GB 724379A
Authority
GB
United Kingdom
Prior art keywords
foil
plating
resistant coating
pattern
enamel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB27856/53A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB724379A publication Critical patent/GB724379A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

724,379. Ornamenting. GENERAL ELECTRIC CO. Oct. 9, 1953 [Oct. 10, 1952], No. 27856/53. Drawings to Specification. Class 93. [Also in Group XXXVI] A metallic pattern is formed on an electrically insulating support by bonding a relatively thin metal foil to one surface of the support, forming a plating-resistant coating over the foil except in selected areas where the pattern is to be formed, electroplating the selected areas with a lead-tin solder, removing the plating resistant coating and etching away all exposed portions of the foil not protected by the solder. The plating-resistant coating may comprise a lightsensitive channel, over which a transparency, having opaque portions corresponding to the desired pattern is placed. The assembly is exposed to light, after which the unexposed portions of the enamel are removed by a developing solution and the assembly is made the cathode in a plating circuit, the anode being a lead-tin rod. The enamel acts as a plating resistant coating, so that only the exposed portions of foil are plated. The enamel is then removed from the foil and the assembly immersed in an etching solution to remove the unplated parts of the metal foil. A pattern may be similarly formed on the other surface of the support.
GB27856/53A 1952-10-10 1953-10-09 A method for making a predetermined metallic pattern on an insulating base Expired GB724379A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US724379XA 1952-10-10 1952-10-10

Publications (1)

Publication Number Publication Date
GB724379A true GB724379A (en) 1955-02-16

Family

ID=22107556

Family Applications (1)

Application Number Title Priority Date Filing Date
GB27856/53A Expired GB724379A (en) 1952-10-10 1953-10-09 A method for making a predetermined metallic pattern on an insulating base

Country Status (1)

Country Link
GB (1) GB724379A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2861029A (en) * 1955-12-14 1958-11-18 Western Electric Co Methods of making printed wiring circuits
US2872391A (en) * 1955-06-28 1959-02-03 Ibm Method of making plated hole printed wiring boards
US2929769A (en) * 1955-07-07 1960-03-22 Isaac L Newell Electroplating anode
US2959525A (en) * 1957-10-11 1960-11-08 Melpar Inc Method for plating at least two different kinds of metals on printed circuits
US3171796A (en) * 1957-01-28 1965-03-02 Gen Dynamics Corp Method of plating holes
US3200020A (en) * 1963-12-23 1965-08-10 Gen Precision Inc Method of making a weldable printed circuit
US3302067A (en) * 1967-01-31 Modular circuit package utilizing solder coated
US3346689A (en) * 1965-01-29 1967-10-10 Philco Ford Corp Multilayer circuit board suing epoxy cards and silver epoxy connectors
US3456158A (en) * 1963-08-08 1969-07-15 Ibm Functional components
US3456159A (en) * 1963-08-08 1969-07-15 Ibm Connections for microminiature functional components
US3775218A (en) * 1971-03-04 1973-11-27 Ca Atomic Energy Ltd Method for the production of semiconductor thermoelements

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3302067A (en) * 1967-01-31 Modular circuit package utilizing solder coated
US2872391A (en) * 1955-06-28 1959-02-03 Ibm Method of making plated hole printed wiring boards
US2929769A (en) * 1955-07-07 1960-03-22 Isaac L Newell Electroplating anode
US2861029A (en) * 1955-12-14 1958-11-18 Western Electric Co Methods of making printed wiring circuits
US3171796A (en) * 1957-01-28 1965-03-02 Gen Dynamics Corp Method of plating holes
US2959525A (en) * 1957-10-11 1960-11-08 Melpar Inc Method for plating at least two different kinds of metals on printed circuits
US3456158A (en) * 1963-08-08 1969-07-15 Ibm Functional components
US3456159A (en) * 1963-08-08 1969-07-15 Ibm Connections for microminiature functional components
US3200020A (en) * 1963-12-23 1965-08-10 Gen Precision Inc Method of making a weldable printed circuit
US3346689A (en) * 1965-01-29 1967-10-10 Philco Ford Corp Multilayer circuit board suing epoxy cards and silver epoxy connectors
US3775218A (en) * 1971-03-04 1973-11-27 Ca Atomic Energy Ltd Method for the production of semiconductor thermoelements

Similar Documents

Publication Publication Date Title
ES209005A1 (en) Method of soldering printed circuits
ES443346A1 (en) Methods of forming conductors on substrates involving electroplating
GB1266000A (en)
GB724379A (en) A method for making a predetermined metallic pattern on an insulating base
GB1268317A (en) Improvements in or relating to the manufacture of conductor plates
US3695927A (en) Electrodeposition process for producing perforated foils with raised portions at the edges of the holes
SE7604917L (en) PROCEDURE FOR MAKING SCREEN MATERIAL
DE3586422D1 (en) ELECTRICALLY CONDUCTING COPPER LAYERS AND METHOD FOR PRODUCING THE SAME.
GB980468A (en) Improvements in and relating to electrical circuit elements
GB1013608A (en) Improvements in or relating to processes for the manufacture of printed circuits
GB2017416A (en) Circuit board manufacturing method
JPS5240968A (en) Process for production of semiconductor device
ES349275A1 (en) Method of making conductive circuit patterns by intaglio process
GB733022A (en) Method of making double-sided mosaic
GB830187A (en) Improvements in or relating to the manufacture of printed circuit panels
GB829263A (en) Method of making printed circuits
JPS56129349A (en) Method of manufacturing airtight terminal
GB795822A (en) Improvements in or relating to the production of printed electric circuits
GB842789A (en) Improvements in or relating to the manufacture of printed electric circuits
GB978793A (en) Improvements in and relating to printed circuits
JPS54160526A (en) Manufacture of printing distributing board embedded with metal core having contact plug
ES392134A1 (en) Electrodeposition of metals and cathodes therefor
ES232518A1 (en) A method of obtaining an electrically driving design that seadhiere to a permanently insulating support (Machine-translation by Google Translate, not legally binding)
JPS54148205A (en) Manufacture of moving member
GB1394062A (en) Semi-conductor devices