GB685912A - Method of manufacturing electrical circuits and circuit components - Google Patents

Method of manufacturing electrical circuits and circuit components

Info

Publication number
GB685912A
GB685912A GB26400/47A GB2640047A GB685912A GB 685912 A GB685912 A GB 685912A GB 26400/47 A GB26400/47 A GB 26400/47A GB 2640047 A GB2640047 A GB 2640047A GB 685912 A GB685912 A GB 685912A
Authority
GB
United Kingdom
Prior art keywords
sheet
sheets
slits
components
folded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB26400/47A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB26400/47A priority Critical patent/GB685912A/en
Publication of GB685912A publication Critical patent/GB685912A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/363Assembling flexible printed circuits with other printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/055Folded back on itself
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09081Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/091Locally and permanently deformed areas including dielectric material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10598Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10651Component having two leads, e.g. resistor, capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/10886Other details
    • H05K2201/10916Terminals having auxiliary metallic piece, e.g. for soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189Pressing leads, bumps or a die through an insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/162Testing a finished product, e.g. heat cycle testing of solder joints
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • H05K3/4015Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

685,912. Printed circuits; holders for thermionic valves. STRONG, H. V., and EISLER, P. Nov. 1, 1948 [Sept. 30, 1947], No. 26400/47. Classes 36 and 38 (i). An electric assembly comprises electrical components and a connecting circuit, at least part of the circuit being in the form of a flexible conductive pattern firmly adherent to a flexible insulating support, the support and the pattern being deformed into three-dimensional configuration, as by bending, folding or winding, but being capable of being brought back into flat form for testing purposes and re-deformed to three-dimensional form without breaking the conductive pattern or making any major disconnection of the components. The conductive pattern may be produced on the insulating support by the methods described in Specifications 639,111, 639,178, 639,179 or 639,658 and may be produced on two or more sheets of insulation such as paper or resin impregnated cloth which are subsequently superposed and interconnected as necessary. Additional layers of insulation may be interposed 'between the sheets where necessary, and parts of the circuit which are not required to open out when the unit is flattened may be permanently stuck together. Some of these sealed parts may carry portions of the conductive pattern which are arranged to form condensers. Figs. 1B and 2B show insulating support sheets on which the conductive patterns are deposited. Some of the smaller components such as condensers C2, C3 are attached to the upper sheet. The wire terminals of these components are secured to the appropriate points on the pattern by means of hot wire staples which are driven through blobs of solder previously applied to the pattern. The larger components such as the coil cans are positioned in a tray and held together mechanically to act as supports for the flexible circuit. The two sheets are folded independently to make various permanent connections, certain of which may be secured by adhesive. The lower sheet is then placed over the cans in the tray so that the terminal taps of the cans project either through slits G or clearance holes H (Fig. 2B). Those terminals projecting through slits G are bent down and soldered to the conductive pattern. The condensers C1, C4-C9 and resistances R3- R5 and R7-R13 are stapled to the lower sheet and the sheet is further folded, forming various small capacitors. The upper sheet is then laid over the lower sheet so that the remaining coilcan terminals protrude through slits G therein. The areas F in this sheet are folded back to make necessary connections between the two sheets which are then bonded together and the areas around G and F on the upper sheet are solder-sprayed through a mask and hot staples are applied through the blobs of solder thus formed, thus clamping the sheets together. The composite sheet is further folded and valves V1-V5 are placed in position. The sheet with components thereon is then finally folded so that the various parts take up the positions as shown, for example, in Fig. 15. The tray in which the assembly is fitted is itself hinged and may be folded. Specification 634,202 is referred to. Holders for valves of the miniature type suitable for use with the assembly comprise two moulded plastic parts (Fig. 6). The lower part VH1 has grooves a and metal clips s. When pressed against the underside of a patterned sheet the sharp ridges protrude through slits J (Figs. 1B and 2B) previously made therein so that the strips of patterned sheet between the slits rest in the grooves a, The clips s protrude through holes K in the sheets. The valves are arranged with their pins in the grooves a and are held in position by the upper part VH2 of the holder which is provided with grooves a<SP>1</SP>, a<SP>11</SP> and projections t for engaging clips s. An alternative form of valve holder, Figs. 20 and 21 (not shown), is made by depositing relatively widelyspaced conducting strips on the sheet, which is then crimped so that the conductive portions, on which the valve pins are to rest, lie at the bottom of the crimps. The pins are insulated from one another by the non-conductive portions of the sheet which lie between them.
GB26400/47A 1947-09-30 1947-09-30 Method of manufacturing electrical circuits and circuit components Expired GB685912A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB26400/47A GB685912A (en) 1947-09-30 1947-09-30 Method of manufacturing electrical circuits and circuit components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB26400/47A GB685912A (en) 1947-09-30 1947-09-30 Method of manufacturing electrical circuits and circuit components

Publications (1)

Publication Number Publication Date
GB685912A true GB685912A (en) 1953-01-14

Family

ID=10243042

Family Applications (1)

Application Number Title Priority Date Filing Date
GB26400/47A Expired GB685912A (en) 1947-09-30 1947-09-30 Method of manufacturing electrical circuits and circuit components

Country Status (1)

Country Link
GB (1) GB685912A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE975642C (en) * 1953-03-06 1962-03-22 Blaupunkt Werke Gmbh Method for contacting two-dimensional circuits or switching elements that are printed or copied on carrier plates or carrier foils, preferably made of thermoplastics, and covered with an electrically insulating layer
US3152288A (en) * 1962-04-06 1964-10-06 Mittler Sheldon Circuit assembly
GB2147749A (en) * 1983-10-05 1985-05-15 Hewlett Packard Co Soldered flexible circuit connections
GB2279907A (en) * 1993-07-02 1995-01-18 Gec Avery Ltd Flexible mountings for electronic components in smart cards.
WO2002055904A2 (en) * 2000-12-15 2002-07-18 Siemens Vdo Automotive Corporation Method for assembling mechatronics sensor
CN111319512A (en) * 2018-12-14 2020-06-23 维洛西门子新能源汽车法国简式股份公司 Electrical device and electrical apparatus including the same

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE975642C (en) * 1953-03-06 1962-03-22 Blaupunkt Werke Gmbh Method for contacting two-dimensional circuits or switching elements that are printed or copied on carrier plates or carrier foils, preferably made of thermoplastics, and covered with an electrically insulating layer
US3152288A (en) * 1962-04-06 1964-10-06 Mittler Sheldon Circuit assembly
GB2147749A (en) * 1983-10-05 1985-05-15 Hewlett Packard Co Soldered flexible circuit connections
GB2279907A (en) * 1993-07-02 1995-01-18 Gec Avery Ltd Flexible mountings for electronic components in smart cards.
GB2279907B (en) * 1993-07-02 1996-11-06 Gec Avery Ltd An integrated circuit card
WO2002055904A2 (en) * 2000-12-15 2002-07-18 Siemens Vdo Automotive Corporation Method for assembling mechatronics sensor
WO2002057659A2 (en) * 2000-12-15 2002-07-25 Siemens Automotive Corporation Mechatronics sensor
WO2002057659A3 (en) * 2000-12-15 2003-07-10 Siemens Automotive Corp Lp Mechatronics sensor
US6612202B2 (en) 2000-12-15 2003-09-02 Siemens Vdo Automotive Corporation Mechatronics sensor
WO2002055904A3 (en) * 2000-12-15 2003-09-04 Siemens Vdo Automotive Corp Method for assembling mechatronics sensor
US6739042B2 (en) 2000-12-15 2004-05-25 Siemens Vdo Automotive Corporation Method for assembling a mechatronics sensor
CN111319512A (en) * 2018-12-14 2020-06-23 维洛西门子新能源汽车法国简式股份公司 Electrical device and electrical apparatus including the same

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