GB685912A - Method of manufacturing electrical circuits and circuit components - Google Patents
Method of manufacturing electrical circuits and circuit componentsInfo
- Publication number
- GB685912A GB685912A GB26400/47A GB2640047A GB685912A GB 685912 A GB685912 A GB 685912A GB 26400/47 A GB26400/47 A GB 26400/47A GB 2640047 A GB2640047 A GB 2640047A GB 685912 A GB685912 A GB 685912A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sheet
- sheets
- slits
- components
- folded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
685,912. Printed circuits; holders for thermionic valves. STRONG, H. V., and EISLER, P. Nov. 1, 1948 [Sept. 30, 1947], No. 26400/47. Classes 36 and 38 (i). An electric assembly comprises electrical components and a connecting circuit, at least part of the circuit being in the form of a flexible conductive pattern firmly adherent to a flexible insulating support, the support and the pattern being deformed into three-dimensional configuration, as by bending, folding or winding, but being capable of being brought back into flat form for testing purposes and re-deformed to three-dimensional form without breaking the conductive pattern or making any major disconnection of the components. The conductive pattern may be produced on the insulating support by the methods described in Specifications 639,111, 639,178, 639,179 or 639,658 and may be produced on two or more sheets of insulation such as paper or resin impregnated cloth which are subsequently superposed and interconnected as necessary. Additional layers of insulation may be interposed 'between the sheets where necessary, and parts of the circuit which are not required to open out when the unit is flattened may be permanently stuck together. Some of these sealed parts may carry portions of the conductive pattern which are arranged to form condensers. Figs. 1B and 2B show insulating support sheets on which the conductive patterns are deposited. Some of the smaller components such as condensers C2, C3 are attached to the upper sheet. The wire terminals of these components are secured to the appropriate points on the pattern by means of hot wire staples which are driven through blobs of solder previously applied to the pattern. The larger components such as the coil cans are positioned in a tray and held together mechanically to act as supports for the flexible circuit. The two sheets are folded independently to make various permanent connections, certain of which may be secured by adhesive. The lower sheet is then placed over the cans in the tray so that the terminal taps of the cans project either through slits G or clearance holes H (Fig. 2B). Those terminals projecting through slits G are bent down and soldered to the conductive pattern. The condensers C1, C4-C9 and resistances R3- R5 and R7-R13 are stapled to the lower sheet and the sheet is further folded, forming various small capacitors. The upper sheet is then laid over the lower sheet so that the remaining coilcan terminals protrude through slits G therein. The areas F in this sheet are folded back to make necessary connections between the two sheets which are then bonded together and the areas around G and F on the upper sheet are solder-sprayed through a mask and hot staples are applied through the blobs of solder thus formed, thus clamping the sheets together. The composite sheet is further folded and valves V1-V5 are placed in position. The sheet with components thereon is then finally folded so that the various parts take up the positions as shown, for example, in Fig. 15. The tray in which the assembly is fitted is itself hinged and may be folded. Specification 634,202 is referred to. Holders for valves of the miniature type suitable for use with the assembly comprise two moulded plastic parts (Fig. 6). The lower part VH1 has grooves a and metal clips s. When pressed against the underside of a patterned sheet the sharp ridges protrude through slits J (Figs. 1B and 2B) previously made therein so that the strips of patterned sheet between the slits rest in the grooves a, The clips s protrude through holes K in the sheets. The valves are arranged with their pins in the grooves a and are held in position by the upper part VH2 of the holder which is provided with grooves a<SP>1</SP>, a<SP>11</SP> and projections t for engaging clips s. An alternative form of valve holder, Figs. 20 and 21 (not shown), is made by depositing relatively widelyspaced conducting strips on the sheet, which is then crimped so that the conductive portions, on which the valve pins are to rest, lie at the bottom of the crimps. The pins are insulated from one another by the non-conductive portions of the sheet which lie between them.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB26400/47A GB685912A (en) | 1947-09-30 | 1947-09-30 | Method of manufacturing electrical circuits and circuit components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB26400/47A GB685912A (en) | 1947-09-30 | 1947-09-30 | Method of manufacturing electrical circuits and circuit components |
Publications (1)
Publication Number | Publication Date |
---|---|
GB685912A true GB685912A (en) | 1953-01-14 |
Family
ID=10243042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB26400/47A Expired GB685912A (en) | 1947-09-30 | 1947-09-30 | Method of manufacturing electrical circuits and circuit components |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB685912A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE975642C (en) * | 1953-03-06 | 1962-03-22 | Blaupunkt Werke Gmbh | Method for contacting two-dimensional circuits or switching elements that are printed or copied on carrier plates or carrier foils, preferably made of thermoplastics, and covered with an electrically insulating layer |
US3152288A (en) * | 1962-04-06 | 1964-10-06 | Mittler Sheldon | Circuit assembly |
GB2147749A (en) * | 1983-10-05 | 1985-05-15 | Hewlett Packard Co | Soldered flexible circuit connections |
GB2279907A (en) * | 1993-07-02 | 1995-01-18 | Gec Avery Ltd | Flexible mountings for electronic components in smart cards. |
WO2002055904A2 (en) * | 2000-12-15 | 2002-07-18 | Siemens Vdo Automotive Corporation | Method for assembling mechatronics sensor |
CN111319512A (en) * | 2018-12-14 | 2020-06-23 | 维洛西门子新能源汽车法国简式股份公司 | Electrical device and electrical apparatus including the same |
-
1947
- 1947-09-30 GB GB26400/47A patent/GB685912A/en not_active Expired
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE975642C (en) * | 1953-03-06 | 1962-03-22 | Blaupunkt Werke Gmbh | Method for contacting two-dimensional circuits or switching elements that are printed or copied on carrier plates or carrier foils, preferably made of thermoplastics, and covered with an electrically insulating layer |
US3152288A (en) * | 1962-04-06 | 1964-10-06 | Mittler Sheldon | Circuit assembly |
GB2147749A (en) * | 1983-10-05 | 1985-05-15 | Hewlett Packard Co | Soldered flexible circuit connections |
GB2279907A (en) * | 1993-07-02 | 1995-01-18 | Gec Avery Ltd | Flexible mountings for electronic components in smart cards. |
GB2279907B (en) * | 1993-07-02 | 1996-11-06 | Gec Avery Ltd | An integrated circuit card |
WO2002055904A2 (en) * | 2000-12-15 | 2002-07-18 | Siemens Vdo Automotive Corporation | Method for assembling mechatronics sensor |
WO2002057659A2 (en) * | 2000-12-15 | 2002-07-25 | Siemens Automotive Corporation | Mechatronics sensor |
WO2002057659A3 (en) * | 2000-12-15 | 2003-07-10 | Siemens Automotive Corp Lp | Mechatronics sensor |
US6612202B2 (en) | 2000-12-15 | 2003-09-02 | Siemens Vdo Automotive Corporation | Mechatronics sensor |
WO2002055904A3 (en) * | 2000-12-15 | 2003-09-04 | Siemens Vdo Automotive Corp | Method for assembling mechatronics sensor |
US6739042B2 (en) | 2000-12-15 | 2004-05-25 | Siemens Vdo Automotive Corporation | Method for assembling a mechatronics sensor |
CN111319512A (en) * | 2018-12-14 | 2020-06-23 | 维洛西门子新能源汽车法国简式股份公司 | Electrical device and electrical apparatus including the same |
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