GB658485A - Improvements in and relating to electrolytic processing masks - Google Patents
Improvements in and relating to electrolytic processing masksInfo
- Publication number
- GB658485A GB658485A GB28602/49A GB2860249A GB658485A GB 658485 A GB658485 A GB 658485A GB 28602/49 A GB28602/49 A GB 28602/49A GB 2860249 A GB2860249 A GB 2860249A GB 658485 A GB658485 A GB 658485A
- Authority
- GB
- United Kingdom
- Prior art keywords
- frame
- opening
- electrolytic
- electrode
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002093 peripheral effect Effects 0.000 abstract 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract 1
- 239000005751 Copper oxide Substances 0.000 abstract 1
- 229910000431 copper oxide Inorganic materials 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
- H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
- H01L21/165—Reduction of the copper oxide, treatment of the oxide layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
658,485. Masks for electrolytic processes. BRITISH THOMSON-HOUSTON CO., Ltd. Nov. 8, 1949, No. 28602. Convention date, Nov. 12, 1948. [Class 41] A mask for electrolytic processing of substantially flat metallic plates comprises a peripheral frame 1 having a recessed opening therein which is undercut so that the frame partially overhangs the opening, means being provided for mounting an electrode plate 5 within the opening so that electrolytic action is retarded in a peripheral region of the plate. As shown, the frame 1 is U-shaped, and is formed of insulating material, for example, hardened rubber, and the sides of the frame are provided with mortises to receive tenons 9a formed on a detachable transverse member 9, held in position by rubber pins 10. The sides 2, 3 and end of the frame 1 are slotted to accommodate the electrode 5, and the side and end frame members 2, 3, 4 and 9 are undercut on both sides around the periphery of the opening, so that in electrolytic processing the electrolytic action is retarded at the peripheral region of the electrode plate. The member 4 is recessed to accommodate a cup 7 connecting the electrode to a mounting stud 8. The mask may be used in the production of copper oxide rectifier plates.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US658485XA | 1948-11-12 | 1948-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB658485A true GB658485A (en) | 1951-10-10 |
Family
ID=22065538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB28602/49A Expired GB658485A (en) | 1948-11-12 | 1949-11-08 | Improvements in and relating to electrolytic processing masks |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB658485A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2859166A (en) * | 1955-09-15 | 1958-11-04 | Pennsalt Chemicals Corp | Shielding means for effecting uniform plating of lead dioxide in the formation of lead dioxide electrodes |
| US3039951A (en) * | 1958-01-02 | 1962-06-19 | Hughes Aircraft Co | Electroplating fixture |
| US3457488A (en) * | 1965-12-30 | 1969-07-22 | Leesona Corp | Method of recharging an electrochemical cell |
-
1949
- 1949-11-08 GB GB28602/49A patent/GB658485A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2859166A (en) * | 1955-09-15 | 1958-11-04 | Pennsalt Chemicals Corp | Shielding means for effecting uniform plating of lead dioxide in the formation of lead dioxide electrodes |
| US3039951A (en) * | 1958-01-02 | 1962-06-19 | Hughes Aircraft Co | Electroplating fixture |
| US3457488A (en) * | 1965-12-30 | 1969-07-22 | Leesona Corp | Method of recharging an electrochemical cell |
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