GB652947A - The stabilization of synthetic linear polyamides against atmospheric degradation - Google Patents

Abstract

A synthetic linear polyamide is stabilized against the degradative action of heat by incorporating into 1 million parts thereof, 10-500 parts by weight of a copper salt of an organic compound. The copper compound may be added to the polyamide-forming reaction mixture. Copper salts mentioned are those of monocarboxylic acids particularly aliphatic monocarboxylic acids having 2-10 carbon atoms, and of b -diketones, e.g. acetyl acetone, diacetyl acetone, propionyl acetone and benzoyl acetone. In example (1) polyhexamethylene adipamide flakes are coated with copper stearate, melted and extruded as filaments. Example (2) employs polyhexamethylene sebacamide and cupric acetate. Example (3) uses an interpolymer from hexamethylenediammonium adipate, hexamethylenediammonium sebacate and capolactam and stabilizes with copper stearate. Example (4) uses polyhexamethylene sebacamide and copper propionyl acetonate and Example (5) polyhexamethylene sebacamide and copper resinate. In Example (6) aqueous hexamethylene diammonium sebacate is heated with acetic acid and cupric acetate to form a stabilized polyamide. Other polyamides are also mentioned. Other materials, e.g. plasticizers, resins, waxes, fillers, pigments, or light stabilizers may be included in the compositions. Specifications 461,236, 461,237 and 487,734 are referred to.