GB644436A - Improvements in or relating to solder - Google Patents
Improvements in or relating to solderInfo
- Publication number
- GB644436A GB644436A GB2590047A GB2590047A GB644436A GB 644436 A GB644436 A GB 644436A GB 2590047 A GB2590047 A GB 2590047A GB 2590047 A GB2590047 A GB 2590047A GB 644436 A GB644436 A GB 644436A
- Authority
- GB
- United Kingdom
- Prior art keywords
- per cent
- chloride
- solder
- aluminium
- sodium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/266—Cd as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A solder for bonding aluminium or aluminium alloys consists of 3 to 5 per cent of silver, 75 to 90 per cent of cadmium and 6 to 10 per cent of zinc. It may also contain .08 to 2 per cent of copper with or without 0.5 to 1.5 per cent of aluminium. The above solder may be used in conjunction with a flux having the following composition:-Sodium chloride 20-35 per cent, Potassium chloride 30-40 per cent, Lithium chloride 20-35 per cent, Sodium fluoride 0-10 per cent, Sodium biborate 0-5 per cent, Zinc chloride 0-10 per cent, Cadmium chloride 0-5 per cent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2590047A GB644436A (en) | 1947-09-24 | 1947-09-24 | Improvements in or relating to solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2590047A GB644436A (en) | 1947-09-24 | 1947-09-24 | Improvements in or relating to solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB644436A true GB644436A (en) | 1950-10-11 |
Family
ID=10235171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2590047A Expired GB644436A (en) | 1947-09-24 | 1947-09-24 | Improvements in or relating to solder |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB644436A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2919984A (en) * | 1959-04-16 | 1960-01-05 | Eutectic Welding Alloys | Brazing alloy |
| CN109384474A (en) * | 2018-11-28 | 2019-02-26 | 北京有色金属与稀土应用研究所 | Ceramic low-temp active metallization lotion, ceramic metallization method and the vacuum electron device according to this method preparation |
-
1947
- 1947-09-24 GB GB2590047A patent/GB644436A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2919984A (en) * | 1959-04-16 | 1960-01-05 | Eutectic Welding Alloys | Brazing alloy |
| CN109384474A (en) * | 2018-11-28 | 2019-02-26 | 北京有色金属与稀土应用研究所 | Ceramic low-temp active metallization lotion, ceramic metallization method and the vacuum electron device according to this method preparation |
| CN109384474B (en) * | 2018-11-28 | 2021-09-17 | 北京有色金属与稀土应用研究所 | Paste for ceramic low-temperature active metallization, ceramic metallization method and vacuum electronic device prepared according to method |
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