GB2603663A - Carrier release - Google Patents

Carrier release Download PDF

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Publication number
GB2603663A
GB2603663A GB2203806.1A GB202203806A GB2603663A GB 2603663 A GB2603663 A GB 2603663A GB 202203806 A GB202203806 A GB 202203806A GB 2603663 A GB2603663 A GB 2603663A
Authority
GB
United Kingdom
Prior art keywords
assembly
adhesive
carrier
adhesive layer
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB2203806.1A
Other versions
GB202203806D0 (en
GB2603663B (en
Inventor
Wild Barry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FlexEnable Ltd
Original Assignee
FlexEnable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FlexEnable Ltd filed Critical FlexEnable Ltd
Priority to GB2203806.1A priority Critical patent/GB2603663B/en
Priority to GB2211438.3A priority patent/GB2607247B/en
Priority claimed from GB1608279.4A external-priority patent/GB2554040B/en
Publication of GB202203806D0 publication Critical patent/GB202203806D0/en
Publication of GB2603663A publication Critical patent/GB2603663A/en
Application granted granted Critical
Publication of GB2603663B publication Critical patent/GB2603663B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B32B2309/022—Temperature vs pressure profiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

Method comprising: providing an assembly, adhered temporarily on opposite sides to carriers 16 by adhesive elements 14c, the assembly include at least one plastic support sheet; heating said assembly and said adhesive element under conditions at which gas 20 is generated within the adhesive element, while compressing the assembly and adhesive element at a pressure at which crinkling of said plastic support sheet by said heating is prevented, while retaining pockets of the generated gas at the interface between the carrier and the adhesive element and/or the interface between the assembly and the adhesive element. Thermal expansion of the adhesive element may break contact between the carrier and the adhesive in the location between gas pockets. Pockets of the gas maybe retained at the carrier, adhesive interface. Also included is a method of completely curing the adhesive and then expanding the adhesive layer. The assemblies may comprise liquid crystal display components.

Description

CARRIER RELEASE
The processing of an assembly may comprise temporarily supporting the asseanidy between two carriers releasaidy adhered to the assembly.
The inventors for the present application have worked on techniques for irnpwving the release of the carriers from the assembly after processing of the assemb The comprising; prising; prov adhered on opposite ski ective carriers by respective adhesive elements, the assembly including at least one plastic support sheet; heating the assembly while mechanically compressing the assembly between the carriers, wherein the strength of adhesion of one of said adhesive elements to the respective carrierand/orassembly is partially reduced dun said heating of the assembly under mechanical compression; and wherein the strength of adhesion of the said adhesive element to the car rand/or to the assembly is further reducible by further heating the said adhesive element after partially or completely relaxing the pressure biy is mechanic compressed between the two camr According to one embodiment, e method comprises: after partially or completely relaxing the pressure at which the assembly is mechanically compressed between the two carriers, further heating the adhesive element to further reduce the strength of adhesion of the adhesive element to ier and/or to the bl and release the adhesive element from the carrier end/or the assembly.
According to one embodiment: partially reducing the strength of adhesion of the adhesive element to the carrier and/or to the assembly while mechanically compressing the assembly etween the p: generating e the adhesive element contacts the and/or assembiy thereby reducing the area of contact between solid material of theadhesive element and the carrier and/or assembly; and wherein further reducing the strength of adhesion adheshie element and the carrier and/or assembly comprises: thermally expanding the solid material of the adhesive element to break contact between the solid meter the adhesivt. element and the carrier and/or assembly in location hi gas pockets.
According to one embodiment, the method further comprises comprising releasing one of the and the assembly from the adhesive element without releasing th her of th carrier and assembly from the adhesive element, According to one embodi:nent the assembl a liquid crystal display component inciud two plastic support sheets and;pacers for creating a space for receiving liquid crystal material between the two plastic support sheets.
According to one embodiment, said assembly comprises two plastic support sheets, and said carriers are used to support respective support sheets Our.ng a process of laminating said two support sheets together to form said assemhb According to one embodiment, adhesive element on at least one side of the assembly comprises a support sheet and two adhesive layers supported on opposite sides of the support sheet.
According embodiment, the assembly comprises a plastic support sheet upporting a stack of conductor, semiconductor and insulator layers defining an array of TM.
According co o. e embodiment, the method further comprises; releasing one of said carriers from ernbly with.out releasing the other of lers from the asse eafter peel" the assembly from the other of said carriers.
Accord in iment< said heating to partially reduce the strength of adhesion also comprises curing an adhesive inciuded withi According to one embodiment, heating said adhesive element to partially reduce the adhesion strength comprises establishing a temperature gradient. across the..rnent and assembly that is smaller than the smallest temperature gradient established across the said adhesn element and assembly during further heating said adhesive element to further reduce the strength of adhesion.
According to one embodiment, the method further comorises: after said heating while mechanicaily compressing the assembly between the carriers, cooling the assembly while continuing to mechanically compress the assembly between the carriers; 1 the strengthof of said adhesive leme o the respective carrier and/or to the assembly is partially reduced during said heating and cool!ng of the assemibly under m,echani G and wherein the slrength of adhes dhesve element to the carrier and/or to the assembly is further reducible by further heating the said adhesive element after partially or con ly relaxing the pressure at which the assembly is mechanically compressed between the two carriers.
There is also hereby provided a method, comprisin opposite to respective c iv:ding an assembly temporarily adhered on espective adhesive elements, the assembly including at least one plastic pport sheet; heating said assembly and said adhesive elementsconditionsat which gas is generated within at least one of the adhesive elements, while compressing the assembly between ee arriers at a pressure at which crinkling of said plastic support sheet by said heating is prevented, while retaining pockets of the generated gas interface between the carrier and the at least one adhesive element and/or the interface between the assembly ar * the least one adhesive element. ;o one embodiment1 said heating is done under condThc g art adhesive inckided within the e lbh, and said gas pockets remain at said) when adhesive is complete. ;According to on comprises: after at least partially reiaxin pressure at which the assembly is compressed between the two carriers, further heating the at least one adhesive element to reduce the strength of adhesion between (0 the carrier a assembly and (ii) solid mater least one adhesive in locations aroun a Ace c one embodiment, the method further comprises, comprising cooling said assembly and adhesive elements while continuing to mechanically compress the assembly between the two carriers, before at least partiahy relaxing the pressure at which the compressed between the two carrier dye elernen further reduce the strength of adhesion between the carrierassembly and scUd material of the at least one adhesive element in locations around said gas pockets. ;There is also hereby provided a method, comprising: g an assembly temporarily adhered on opposite sides to respective carriers by respective adh v lements, the assembly including at least one plastic support sheet; heating said assembly to completely cure an adhesive included within said assembly, wherein an adhesion strength of least one of said adhesive elements to the adjacent carrier and/or assembly is partially reduced during said heating, and is further reducible by further pietely curing said adhesive included within said assembly. ;According to one embodiment, said adhesion strength of said at least one adhesive element to the adjacent carrier and/or assembly is further reducible by first cooling and then further heating aftet completely curing said adhesive included within said assembly, According to one embodiment, said ithin said asserrhiy secures two components together within said assembly. ;Erni imnenis of the invention d hereunder, y of example reference to the accompanying drawings, which: Figure! illustrates an example of a technique according to an embodiment of the and Figure s an example of a process by which an adhesive layer is released from a carrier. ;The following description is for the example of laminating two sheet carmen assembly providin quid crystaldisplay (LCD) devices, but the same technique is equally applicable to the lamination of compone ri bly providing a single LCD dev or one or more other types of devices, such as e,g, one or more encapsulated emitting device COLEDI displays comprising pixels of organic light-emissive materi& whose light emission ontrolled by an active matrix array. ;With reference to Figure 1, a first:flexible component 8 is re -ably secured to a rigid carrier 6, whose strength of adhesion to both the rigid carrier comoonent is igh during processing of the assemblyto resist excessive thermal expansion of the flexible component 8, but which either is (i) not too high to prevent peeling ofthe adhesive element 6 away from at least the assembly after processing or 0reduced after processing of the assembly to facilitate release the adhesive element 6 from at least the assembly. ;For example, this adhesive element 6 may be a single layer of pressure-sensitive adhesive a single layer of adhesive whose adhesion strength to one or more of the first flexible component 8 and rigid carder 8 can be reduced by increasing temperature (heat release), by reducing temperature (cold release) exposure to UV radiation (UV release), The adhesive element 6 may also comprise two layers of adhesive on opposite sides of a support film, which two layers may, for e, cornpris any Co bination of a oressureserrs adhesive, a heat release adhesive, cold rdl se adhesive and UV release adhesive. ;ln this example, the first flexible component 8 comprises a plastic su Film whch supports an cot film for controlling the orientation of ystal molecules in a part of the liquid crystal material immediately adacertt to the alignment may also support one or more her components such as a common electrode for the array of (LCD) devices, if the LCD devices are of a type that perate by generatmg an electric field in the iquh y means electrodes on opposite sides of the liquid crystal material. ;A second flexible component 12 is reieasably secured to ariothe.r rigid carrier:16 via a dual-sided adhesive unit 14 comprising a support film lelt supporting a layer of heat-reiease adhesive 14c adjacent to the carrier 16 and a second layer of adhesive a adjacent to the flexible component 12. ;In this example, the second adhesive 14a is one whose strength of adhesion to the second flexible component is nth; rocessing of the rnbly to res. ;thermal expansion of the assembly, but wh r (I) flog of the adhesive 1 away t the hi ter pro (0) can e reduced afte the assembly cilitat elease e adi sive element 14a from the assembly. The second layer of adhesive 1< ornpris 'a) (b) a layer of heat-release adhesive having:gner release temperature than the first layer of adhesive 14c, of cold-release adhesive, or (d) a layer of UV.release adhesive. The second flexible componen may comprise a plastic support film supportingt 0) a stack of conductor, semiconductor and insulat lc layers defining respective sets of active matrix circuitry, for the array of LCD devices for controlling the electric field within i yst and spacer structures 10 for creating a space between the first and second flexible components 8, 12 for receiving liquid crystal material for the tay of LCD devices. The plastic support film of the second flexible component 12 may be releasably secured to the carrier 16 before formation of the above-mentio ack, of layers and spacer structures on the plastic support film. ln other words, the carrier 16 may be used to support the plastic support film during the ation of said components on the plastic support film to produce the second flexible component 12, and the adhesive rent 14 then functions to resist excessive thermaldistortion of the plastic support film during the heating steps used for the formation of said nents on the plastic support film; and/or resture the plastic support film to its original iti the carder 1.6 when the plastic support film is cooled after a heating step, In this example, at least one of th omponents 8, 12 is provided with a heatcurabie adhesive for securing the two flexible components together. The two flexible then aligned to one another (e.g. means of alignment marks included as part of the second flexible component and observable from above via the optically transparent ss) 4, optically nt adhesive element 6, and opticay transparent first flexible component 8) and mechanically compressed together (Fie. 13) between the carriers 4, 16. While under mechanical compression, the assembly (and carriers 4, 16) are uniformly heated in an oven (so as to establish a zero temperature gradbm assembly) under conditions at which the adhesive between the two flexible components 8, 12 of the assembly becomes completely cured. Whether or not the e cc exibie components is completely cured can, for example, he determined by subjecting the assembly peel strength test and comparing the measured peel strength against a know maximum pee: strength For the specific adhesive being Also, where the uncured form of th has a damaging effect. on e.g. liquid crystal material to he contained within he assembly between the two flexible tence of uncured adhesive (i.e. a failure to completely cure the adhesive) rnanifes s a degradation in the performance of the liquid crystal display device. ;This heating may involve raising the temperature of the oven in a series of steps, and maintaining the oven at each step temperature for a respective period of time. The heating required to cure the adhesive involves raising the temperature of th inkling of the plastic support films within the assembly tends to occur, but a he pressure at which the assembly is mechanically compressed between the carriers is sufficiently high to prevent any s: After sufficient completelycure the adhesive between the two flexible components 8, 12, the temperature of the oven is reduced and the assembly and carriers inside the. oven are allowed to cool, while continuing to mechan -any compress the assernh between the two carriers to prevent crinkling of the plastic films during the cooUng process. In this example, the adhesives used for the adhesive element(between the first flexible component and the rigid carrier 4) and the adhesive used for adhesive layer 14a all retain their strength of adhesion to the assembly/carrier during the heating process to completely cure the adhesive between the two flexible components 8, 12. On the other hand, the heat-release adhesive for adhesive layer 14c is a material at which gas is generated during the process of heating the assembly to cure the adhesive between the two flexible components 8, 12. As described below, the generated gas forms pockets of gas at the interface of the adhesive layer 14c with the rigid carrier 16, and the formation of these gas pockets serves to partially reduce the strength of adhesion between the adhesive layer 14c and the carrier 16, The pressure at which the assembly is compressed between the two carriers 4, 16 is both (i) sufficiently low to retain the gas generated in the adhesive layer 14c as pockets of gas at the interface between the adhesive layer 14c and the carrier 16 (i.e. to prevent gas generated within the adhesive layer 14c from being expelled laterally out from between the adhesive layer 14c and the carrier 16, but (ii) sufficiently high to prevent crinkling, (distortion out of the plane) of the plastic support films within the assembly during the process of heating the assembly to cure the adhesive between the two flexible components. ;The generation of gas within the adhesive layer 14c and the retention of generated gas at the interface of the adhesive layer.14c with the carrier 16 can be detected by: performing the heating in a vacuum and monitoring changes in pressure within the vacuum chamber; and/or remotely analysing, by e.g spectroscopy, the interface between the adhesive layer 14c and the carrier 16, After cooling the assembly to a temperature at which the lastic support films within the assembly no longer tend to crinkle (during which cooling, the gas pockets continue to be retained at the interface of the adhesive layer 14c with the rigid carrier 16), mechanical compression of the assembly between the carriers is ended, and the combination of assembly and carriers 4, 16 is placed on a hotp/ate with the carrier 16 adjacent to adhesive layer 14c closest to the surface of the hat a temperature gradient is established across the combination of adhesive element 14 and assembly, Without mechanically compressing the assembly between the carriers 4, 16, the hotplate is used to r ature:L4c to a temperature at which, in the absence of mechanical compression, the adhesive layer 14c thermally expands to an extent sufficient to further reduce the strength of adhesion between the adhesive layer 14c and the rigid carrier 16. This further heating of the adhesive layer 14c: is done without r ing the temperature of the assembly to a temperature at which significant crinkling of the plastic support films within the assembly tends to occur, In one example, the temperature to which the adhesive layer 14c is raised may he above the maximum temperature that it reached during the heating process for curing the adhesive i le components 8, 12, However, release of the carrier 16 during this second heating stage can also he achieved at lower temperatures. The thermal expansion of the adhesive layer 14 during this second heating stage reduces the strength of adhesion between the adhesive material and the carrier 16 in the areas of contact around the gas pockets at the interface between the carrier 16 and the adhesive layer 14c; and this further reduction in the strength of adhesion between the carrier and the adhesi be released from the assembly without the pplication of of only minimal mecha C), forceWa Ii or with the The release of one rigid carrier 16 facilitates the peeling of the whole adhesive unit 14 from the assembly (HG. it)) and the subsequent peeling of the assembly away from adhesive unit 6 (FIG. 10). ;The liquid crystal materia r the lateral array of liquid crystal devices may be dispensed onto the lower flexible component 12 before lamination of the two flexible compon lay he injected into the space created by the spacer structures after lamination and curing of the adhesive between the two flexible conloonents 8, 12, By way of example: an adhesive product acquired froM Nitto Denko Corporation and identified by product name RAU-5l-li)1.SS was used for one of the adhesive units 14 in the technique described above; and an adhesive product acquire. itta Corporation and identified by product CX2325CA3 was used for the other adhesive unit Sin the technique described above, The adhesive product identified by product name RAU-SHEEL,SS comprises a heat-release adhesive and a UV r&ease adhesive on opposite sides of a flexible support film, andadhesive product identified by product name CX2325CA3 comprises a coidrelease adhesive and a pressure sensitive adhesve supported on.s of a flexihi In the above-described example, the adhesive layer 14c adjacent to the carrier is the layer whose strength of adhesion to an adjacent element is partially reduced under mechanical compression during the heating process to core the adhesive between the two carriers, and further reduced (without mechanical compression) after completion of the heating process to cure the adhesive between the two carriers alternative pi this layer may he the adhesive ye 14a adjacent to the assembly in the adhesive unit 14 (whereby the adhesive unit 14 is first released from the assembly), or this layer may be singlelayer of adhesive contact with both the assembly and the carrier, In the example described above, a heat-corabie, adhesive is used to secure the two flexible components together, an adhesive cum 's LJV radiation (UV-curable adhesive), (b) pressure-sensitivadhesive, or (c) an adhesive curable by laser, are other examples of adhesives that may be used to secure the two flexible comporienN together. ;application of heat is not required secure the two flexibie components together, heating the assembly to a temperature at which crinkling of the plastic support films within the assembly tends to occur may be used for other o and the abovedescribed technique is equallyd in such situations, In the example described above, the c* in the production of an array of fiquid crystal display devices, but the same technique can be used n the production of other devices such as e,g, the production of active matrix OLED displays for which the organic Ughternissive elements require encapsulation between moisture and oxygen barrier elements.
The above-described technique can be used to produce an assemby without significant crinkling of the plastic support films of either of the flexible omponents, even when the flexible components have a relatively large area.
In addition to any modifications explicitly mentioned above, it will be evident to a person skilled in the art thatvarious other modifications of the described embodiment may be made within he scope of the invention.

Claims (16)

  1. CLAIMS1. A method, comprising: providing an assembly temporarily adhered on at least one side to at least one carrier by at least one adhesive element, the assembly including at least one plastic support sheet; heating said assembly and said adhesive element under conditions at which gas is generated within the adhesive element, while compressing the assembly and adhesive element at a pressure at which crinkling of said plastic support sheet by said heating is prevented, while retaining pockets of the generated gas at the interface between the carrier and the adhesive element and/or the interface between the assembly and the adhesive element.
  2. 2. A method according to claim 1, wherein said heating is done under conditions for curing an adhesive included within the assembly, and wherein said gas pockets remain at said interface(s) when said curing of said adhesive is complete.
  3. 3. A method according to claim 1 or claim 2, further comprising: after at least partially relaxing the pressure at which the assembly and adhesive element is compressed, further heating the at least one adhesive element to reduce the strength of adhesion between (i) the carrier and/or assembly and (ii) solid material of the adhesive element in locations around said gas pockets.
  4. 4. A method according to claim 3, comprising cooling said assembly and adhesive element while continuing to compress the assembly and adhesive element, before at least partially relaxing the pressure at which the assembly and adhesive element is compressed and further heating the adhesive element to further reduce the strength of adhesion between the carrier and/or assembly and solid material of the adhesive element in locations around said gas pockets.
  5. 5. A method, comprising: providing an assembly temporarily adhered on at least one side to a carrier by at least one adhesive element, the assembly including at least one plastic support sheet, and the adhesive element including at least one adhesive layer; heating said assembly to completely cure an adhesive included within said assembly, wherein an adhesion strength of said adhesive layer to the carrier and/or assembly is partially reduced during said heating; and after heating said assembly to complete cure the adhesive included within the assembly, expanding the adhesive layer, and releasing the adhesive layer from the carrier and/or assembly.
  6. 6. The method according to claim 5, wherein partially reducing the adhesion strength of the adhesive layer to the carrier and/or assembly comprises generating gas within the adhesive layer, and retaining pockets of the gas at an interface of the adhesive layer.
  7. 7. The method according to claim 6, wherein retaining pockets of the gas at an interface of the adhesive layer comprises retaining the pockets of the gas at an interface of the adhesive layer with the carrier.
  8. 8. The method according to claim 5, wherein expanding the adhesive layer further reduces the adhesion strength of the adhesive layer to the carrier and/or assembly.
  9. 9. The method according to claim 5, wherein expanding the adhesive layer comprises placing the carrier and the assembly on a hotplate with the adhesive layer between the hotplate and the assembly.
  10. 10. The method according to claim 5, wherein expanding the adhesive layer comprises establishing a temperature gradient across the adhesive layer and the assembly; wherein the temperature gradient comprises the adhesive layer having a higher temperature than the assembly.
  11. 11. The method according to claim 5, wherein expanding the adhesive layer comprises: heating the adhesive layer to a temperature above a maximum temperature reached during heating the assembly to completely cure the adhesive included within the assembly.
  12. 12. The method according to claim 5, wherein expanding the adhesive layer comprises: heating the adhesive layer to a temperature below a maximum temperature reached during the heating to completely cure the adhesive included within the assembly.
  13. 13. The method according to any of claims 5 to 12, wherein releasing the adhesive layer from the carrier and/or assembly comprises releasing the adhesive layer from one of the carrier and the assembly, and thereafter peeling the other of the carrier and the assembly away from the adhesive element.
  14. 14. The method according to any of claims 5 to 12, wherein releasing the adhesive layer from the carrier and/or assembly comprises releasing the adhesive layer from one of the carrier and the assembly, without releasing the adhesive layer from the other of the carrier and assembly.
  15. 15. The method according to any of claims 5 to 12, wherein the assembly comprises a liquid crystal display component including two plastic support sheets and spacers for creating a space for receiving liquid crystal material between the two plastic support sheets.
  16. 16. The method according to any of claims 5 to 12, wherein the assembly comprises two plastic support sheets, and respective carriers are used to support respective ones of the plastic support sheets during a process of laminating the two support sheets together to form the assembly.
GB2203806.1A 2016-05-11 2016-05-11 Carrier release Active GB2603663B (en)

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GB2203806.1A GB2603663B (en) 2016-05-11 2016-05-11 Carrier release
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GB2203806.1A GB2603663B (en) 2016-05-11 2016-05-11 Carrier release
GB1608279.4A GB2554040B (en) 2016-05-11 2016-05-11 Carrier release

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Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2004182836A (en) * 2002-12-02 2004-07-02 Sekisui Chem Co Ltd Separating material, releasable sheet and method for transcribing ceramic green sheet
US20050173051A1 (en) * 2001-11-15 2005-08-11 Munehiro Hatai Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tape
WO2005087888A1 (en) * 2004-03-11 2005-09-22 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet and method of processing adherend with the heat-peelable pressure-sensitive adhesive sheet
JP2005255829A (en) * 2004-03-11 2005-09-22 Nitto Denko Corp Heat-releasable adhesive sheet and processing method of adherend
US20130306231A1 (en) * 2011-08-05 2013-11-21 Panasonic Corporation Method for manufacturing flexible device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050173051A1 (en) * 2001-11-15 2005-08-11 Munehiro Hatai Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tape
JP2004182836A (en) * 2002-12-02 2004-07-02 Sekisui Chem Co Ltd Separating material, releasable sheet and method for transcribing ceramic green sheet
WO2005087888A1 (en) * 2004-03-11 2005-09-22 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet and method of processing adherend with the heat-peelable pressure-sensitive adhesive sheet
JP2005255829A (en) * 2004-03-11 2005-09-22 Nitto Denko Corp Heat-releasable adhesive sheet and processing method of adherend
US20130306231A1 (en) * 2011-08-05 2013-11-21 Panasonic Corporation Method for manufacturing flexible device

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GB2603663B (en) 2023-01-25

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