GB2601798A

GB2601798A - Layered arrangement for liquid transfer printing

Info

Publication number: GB2601798A
Application number: GB2019523.6A
Authority: GB
Inventors: Dieudonne Addison
Original assignee: Safran Seats GB Ltd
Current assignee: Safran Seats GB Ltd
Priority date: 2020-12-10
Filing date: 2020-12-10
Publication date: 2022-06-15
Anticipated expiration: 2040-12-10
Also published as: GB202019523D0; GB2601798B

Abstract

An arrangement for liquid transfer printing onto an aircraft a component (e.g. table, door seat, armrest) has a layer structure with an RF shielded electronic system 114. The electronic system (e.g. PCB, LED lighting, heating or cooling system, display screen, sensor) 114 and an electrically conductive layer (e.g. conductive ink, mesh or film) 115 is provided between insulating layers (e.g. polycarbonate polymer) 113,116 which are provided between conductive RF shielding layers (e.g. copper mesh) 112,117. The RF shielding layers may be connected 51 to form an RF shielding envelope (Faraday cage) surrounding the electronic system 114 and conductive layer 115, blocking electromagnetic interference, EMI. A hydrophobic layer 14 and soluble sacrificial layer may be provided. A method of manufacturing an aircraft component may include applying a bonding adhesive layer 21 to a base part 20 before water transfer printing the layer structure onto base part 20.

Description

LAYERED ARRANGEMENT FOR LIQUID TRANSFER PRINTING

BACKGROUND OF THE INVENTION

[0001] The present invention concerns layered arrangements for water transfer printing. More particularly, but not exclusively, this invention concerns a layered arrangement comprising a radio frequency (RF) shielded portion for liquid transfer printing onto an aircraft component. The invention also concerns a method of manufacturing an aircraft component using a liquid transfer printing process, an aircraft component comprising an RF shielded portion, and a method of manufacturing a layered arrangement comprising an RF shielded portion for liquid transfer printing onto an aircraft component.

[0002] Some components found within an aircraft cabin comprise integrated electronic systems and circuitry. When manufacturing such components, systems and circuitry are typically installed during separate finishing steps which make up a significant portion of the total component manufacturing time. Furthermore, the separate finishing steps require specialist tooling, for example, for securing wiring and/or electronic components to a part finished component.

[0003] US 2016/0198577 Al discloses a liquid immersion transfer process for applying electronics to 3D objects. In one embodiment, the process comprises providing a foil on a solid carrier in a foil provision stage, providing electronic wiring and an electronic component to the foil in an electronics provision stage, removing the solid carrier and arranging the foil on or in a liquid in a liquid application stage, and transferring the electronics to the 3D object in a transfer stage.

[0004] It is well known that RF or electromagnetic interference can affect the operation of an aircraft. Emission of such interference on board an aircraft must therefore be kept to a minimum. Where aircraft components comprise electronic systems and circuitry, methods and apparatus for providing those systems and circuitry with RF shielding is therefore desirable.

[0005] The present invention seeks to mitigate the above-mentioned problems. Alternatively or additionally, the present invention seeks to provide improved arrangements for liquid transfer printing, aircraft components, and associated methods of manufacturing. -2 -

SUMMARY OF THE INVENTION

[0006] The present invention provides, according to a first aspect, layered arrangement for liquid transfer printing onto an aircraft component, the layered arrangement comprising an RF-shielded portion, the RF-shielded portion comprising the following layers in order: a first electrically conductive RF-shielding layer, a first electrically insulating inner layer, an electrically conductive inner layer in electrical connection with an electronic system, a second electrically insulating inner layer, a second electrically conductive RF-shielding layer.

[0007] The layered arrangement of the first aspect of the invention is suitable for providing a component with an RF-shielded electronic system using a liquid transfer printing process. The RF-shielding layers enclose the electronic system to form a Faraday cage around the electronic system. As such, the electronic system is shielded from RF interference from the outside environment, and the outside environment is shielded from RF interference from the electronic system.

[0008] The liquid transfer printing process may be water transfer printing. However, it will be understood by the skilled person that liquids other than water may be used. Such an arrangement can therefore eliminate separate manufacturing steps of installing wiring and electronic systems, and associated tooling.

[0009] The electrically conductive inner layer may be a conductive mesh or film. Alternatively, the electrically conductive inner layer may comprise a conductive ink. The electrically conductive inner layer may be configured to provide power and/or transmit data to or from the electronic system. The electrically insulating layers may comprise a polymer. The electrically insulating layers may comprise a polycarbonate.

[0010] The electrically conductive inner layer and electronic system may be formed by a single layer. Alternatively, the electronic system may be contained within an electronic system layer which is separate to the electrically conductive inner layer. The electronic system may comprise one or more of a control system, a lighting system, heating system, cooling system, display screen, sensor (such as an impact sensor, strain gauge, or temperature sensor), integrated cabling for data transmission, a printed circuit board (PCB), or a flexible PCB. The lighting system may comprise LEDs, for example, OLEDs or -3 -PLEDs. The lighting system may comprise quantum dots. The lighting system may be provided in a dual layer arrangement whereby LEDs or quantum dots are contained within an electronic system layer which is separate to the electrically conductive inner layer.

[0011] The layered arrangement may comprise an electrically conductive RF shielding envelope. The first and second electrically conductive RF-shielding layers may be formed by the RE-shielding envelope such that the RE-shielding envelope surrounds and encloses the electrically conductive inner layer and electronic system to provide RF-shielding to the electronic system and electrically conductive inner layer.

[0012] The manufacturing process for a component may be simplified by incorporating one or more layers in the layered arrangement in addition to the RF-shielding portion. For example, the layered arrangement may comprise one or more electrically insulating layers. The RE-shielding portion may be sandwiched between two electrically insulating outer layers. One of the two electrically insulating outer layers may be configured to form the outermost surface of a component that has been liquid transfer printed with the layered arrangement. By incorporating a layer for forming the outer layer of a component it is possible to use the arrangement to manufacture a component with the electronic systems and circuitry encapsulated within the component, thereby allowing for a better packaging and quality of finish. Furthermore, the circuitry and systems are shielded from the elements and wear and tear when encapsulated within a component, thereby improving component lifespan and passenger safety.

[0013] The layered arrangement may further comprise a hydrophobic ink layer adjacent to one of the two electrically insulating outer layers. The hydrophobic ink layer may be configured to be the outermost layer of a part that has been liquid transfer printed with the layered arrangement.

[0014] The layered arrangement may comprise a soluble sacrificial layer adjacent to one of the two electrically insulating outer layers. The liquid soluble layer may be water soluble. The layered arrangement may comprise a water soluble sacrificial layer adjacent a hydrophobic ink layer. The sacrificial layer may comprise a polyvinyl alcohol film, or any other soluble substrate that is available to the skilled person.

[0015] According to a second aspect, the present invention provides a method of manufacturing an aircraft component, the method comprising liquid transfer printing the -4 -layered arrangement of the first aspect of the invention onto an outer surface of a base part. The method may comprise a step of applying an adhesive layer to the base part prior to liquid transfer printing the layered arrangement onto the outer surface of the base part. Depending on the surface being liquid transfer printed on to, an adhesive layer may be required to ensure adhesion between the layered arrangement and base part.

100161 Following the step of liquid transfer printing the layered arrangement onto the outer surface of the base part, the method may comprise a subsequent step of connecting together the RF-shielding layers to form an electrically conductive RF-shielding envelope that surrounds and encloses the electrically conductive inner layer and electronic system to provide RE-shielding to the electronic system and electrically conductive inner layer.

[0017] According to a third aspect, the present invention provides an aircraft component comprising a base part and a layered surface structure attached to the base part, wherein the layered surface structure comprises an RF-shielded portion. The RF-shielded portion comprises an electrically conductive RF-shielding envelope that surrounds and encloses an electrically conductive inner layer and an electronic system. The layered surface structure may have been liquid transfer printed onto the base part. The layered surface structure may comprise any of the layers of the layered surface structure according to the first aspect of the invention. The aircraft component may be one of a meal table, a door, a storage cabinet, or an aircraft seat or part thereof, for example, an armrest.

[0018] According to a fourth aspect, the present invention provides a method of manufacturing a layered arrangement for liquid transfer printing onto an aircraft component. The method comprises the steps of depositing a first layer of polycarbonate onto a substrate to form a first outer insulating layer, wherein the substrate is one of a hydrophobic ink layer or a soluble layer, placing a copper mesh onto the first outer insulating layer to form a first RF-shielding layer, depositing a second layer of polycarbonate onto the first RE-shielding layer to create a first electrically insulating inner layer, placing an electronic system onto the first electrically insulating inner layer and electrically connecting the electronic system, depositing a third layer of polycarbonate onto the electronic system and electrical connections to form a second electrically insulating inner layer, placing a copper mesh onto the second electrically insulating inner layer to form a second RF-shielding layer, and depositing a fourth layer of polycarbonate onto the -5 -second RF-shielding layer to form a second outer insulating layer. One or more, or all of the polycarbonate layers may be formed by spraying liquid polycarbonate. One or more steps of the method may be performed using an additive manufacturing process.

[0019] It will of course be appreciated that features described in relation to one aspect of the present invention may be incorporated into other aspects of the present invention. For example, the method of the invention may incorporate any of the features described with reference to the apparatus of the invention and vice versa.

DESCRIPTION OF THE DRAWINGS

100201 Embodiments of the present invention will now be described by way of example only with reference to the accompanying schematic drawings of which: FIG. 1 is a schematic diagram of a layered arrangement according to a first embodiment of the invention for water transfer printing onto a base part; FIG. 2 is a schematic diagram of an RF-shielded portion of the layered arrangement shown in FIG. 1 with various layers cut away; FIG. 3 shows an electrical connector of an electrically conductive layer of the layered arrangement shown in FIG. I; FIG. 4 shows the layered arrangement of FIG. 1 being prepared for a water transfer printing process; FIG. 5 shows a finished aircraft part that has been water transfer printed with the layered arrangement of FIG. I; FIG. 6 shows a process of manufacturing the layered arrangement of FIG. 1; FIG 7A is a schematic diagram of a layered arrangement according to a second embodiment of the invention for water transfer printing onto a base part; FIG 7B is a schematic diagram of a layered arrangement according to a third embodiment of the invention for water transfer printing onto a base part; and FIG 7C is a schematic diagram of a layered arrangement according to a fourth embodiment of the invention for water transfer printing onto a base part. -6 -

DETAILED DESCRIPTION

[0021] FIG 1 depicts a layered arrangement 10 for liquid transfer printing onto a base part 20. In this case, the layered arrangement 10 is configured for water transfer printing. However, in other embodiments of the invention, layered arrangements may be configured for use with other liquids From bottom to top, as shown in Figure 1 the layered arrangement comprises a removable sacrificial backing paper layer 12, a sacrificial water soluble polyvinyl acetate film layer 13, a hydrophobic ink layer 14, a first electrically insulating outer polycarbonate film layer 15, an RF-shielded portion 11, and a second electrically insulating outer polycarbonate film layer 16.

[0022] The RF-shielded portion 11 comprises, from bottom to top as shown in FIG 1, a first electrically conductive RF-shielding copper mesh layer 112, a first electrically insulating inner polycarbonate layer 113, an electrically conductive inner layer 115 in electrical connection with an electronic system layer 114, a second electrically insulating inner polycarbonate layer 116, and a second electrically conductive RF-shielding copper mesh layer 117.

[0023] The first sacrificial layer 12 formed by the removable backing paper serves as a substrate upon which the other layers are laid-up during manufacture of the layered arrangement 10. The second sacrificial layer 13 formed by the water soluble polyvinyl acetate film serves as a water soluble substrate upon which the other layers are carried when the layered arrangement is floated upon the surface of a water tank during the water transfer printing process. The hydrophobic ink layer 14 is configured to form the outermost surface layer of a component that has been water transfer printed with the layered arrangement, and provides the component with an aesthetic quality. In some embodiments of the invention, the ink may be a coloured ink to provide the surface of a finished component with a particular colour. In other embodiments of the invention, the ink layer may comprise patterns, pictures, or logos for imparting upon the surface of a component. Not all components require an ink-based aesthetic finish. For some, the polycarbonate film layer 15 that serves as an electrically insulating outer layer may be suitable for forming the outermost layer of a water transfer printed component. Therefore, the hydrophobic ink layer may be omitted in some embodiments of the invention.

100241 The RF-shielded portion 1 I is configured to provide a component that has been water transfer printed with the layered arrangement with an integrated electronic system that is provided with RF-shielding. The RF-shielded portion 11 is shown in FIG. 2 with the various layers cut away. As can be seen, the electronic system layer 114 comprises an army of OLEDs 1141 that form a pattern and a lighting control system 1142 for controlling the OLEDs 1141. The electrically conductive inner layer 115 comprises conductive ink 1151 that has been applied to connect with the OLEDs 1141, the lighting control system 1142 and with an electrical connector 1152 at the edge of the layered arrangement 11, as shown in FIG. 3.

[0025] In FIG. 4 the layered arrangement 10 is shown as prepared for water transfer printing onto a base part 20. As can be seen, the backing paper layer 12 has been removed, and the layered arrangement 10 has been placed in a water tank 30 such that the layered arrangement 10 floats upon the surface 31 of the water with the polyvinyl acetate film layer 13 in contact with the surface 31 of the water.

[0026] In order to water transfer print the layered arrangement 10 onto the base part 20, an activating agent 40 is first applied to the layered arrangement 10 to soften the ink layer 14. A layer of bonding agent 21 is applied to the base part 20, which in this case is a tray table, to improve adhesion between the base part 20 and the uppermost polycarbonate layer. The base part is moved vertically downwards into contact with the layered arrangement 10 so that the layered arrangement 10 sticks to the bonding agent 21, the base part 20 is then moved vertically upwards, away from the water tank with the layered arrangement 10 stuck to the base part 20.

[0027] The finished water transfer printed component 50 is shown in FIG. 5 with the remains of the polyvinyl acetate film layer 13 having been washed away. The finished component 50 comprises the following layers in bottom to top order as shown in FIG. 5: an outermost hydrophobic ink layer 14, a first outer polycarbonate film layer 15, a first RFshielding copper mesh layer 1 12, a first inner polycarbonate layer I 13, an electronic system layer 114 in electrical connection with an electrically conductive inner layer 115, second inner polycarbonate layer 116, a second RF-shielding copper mesh layer 117, a second outer polycarbonate film layer 16, and finally the layer of bonding agent 21 and base part 20.

100281 The part 50 is finished by connecting the RF-shielding layers 112, 177 with electrically conductive connectors 51 so that the RF shielding layers 112, 177, and conductive connectors form an RF-shielding envelope that surrounds and encloses the electronic system 115 layer. Power can be supplied to the electronic system layer 114 via a power supply 52 connected to electrical connector 1152.

100291 The process used to manufacture the layered arrangement is depicted schematically in FIG. 6. In step 1001, a layer of polyvinyl acetate film 13 is applied to a removable backing paper 12. In step 1002, a hydrophobic ink layer 14 is printed onto the polyvinyl acetate film 13. In step 1003, the ink layer 14 is cured. In step 1004, the first insulating outer layer 15 is created by spraying a layer of polycarbonate onto the ink layer 14. In this case, the entirety of the ink layer 14 is covered with polycarbonate to create the first insulating outer layer 15. However, in other embodiments of the invention, the first insulating outer layer may be provided on a more localised area on the ink layer, depending on the size of the RF-shielded layer to be created. In step 1005, a copper mesh which forms the first RF-shielding layer 112 is placed on top of the polycarbonate layer 15. In step 1006, the first RF-shielding layer 112 is sprayed with a layer of polycarbonate to create the first electrically insulating inner layer 113. In step 1007, an array of OLEDs 1141 and lighting control system 1142 are put in place, thereby forming the electronic system layer 114. In step 1008, the electrically conductive inner layer is created by applying a conductive ink to electrically connect the OLEDs 1141 and lighting control system 1142. In step 1009 the electrically conductive inner layer is sprayed with a layer of polycarbonate to create the second electrically insulating inner layer 116. In step 1010 a copper mesh which forms the second RF-shielding layer 117 is placed on top of the polycarbonate layer 15. Finally, in step 1011, the second insulating outer layer 16 is created by spraying a layer of polycarbonate onto the second RF-shielding layer 117.

[0030] FIG. 7A depicts a layered arrangement 210 according a second embodiment of the invention. Where the layered arrangement 210 comprises the identical layers to the layered arrangement 10 of the first embodiment of the invention, those layers have been assigned the same reference numeral as the first embodiment of the invention but with the prefix "2". For example, the layered arrangement 210 according to the second embodiment of the invention comprises an RF-shielded portion 211 whereas the layered arrangement 10 of -9 -the first embodiment of the invention comprises an RF-shielded portion II. As can been seen in FIG. 7A, the only difference between the layered arrangement 210 of the second embodiment of the invention and the layered arrangement 10 of the first embodiment of the invention is that the positions of the electronic system layer 2115 and electrically conductive layer 2114 within the RF shielded portion 211 have been swapped so that the electronic system layer 2114 will be the innermost layer of the electronic system layer 2115 and electrically conductive layer 2114 when the arrangement 210 is water transfer printed onto a part.

100311 FIG. 7B depicts a layered arrangement 310 according a third embodiment of the invention. Where the layered arrangement 310 comprises identical layers to the layered arrangement 10 of the first embodiment of the invention, those layers have been assigned the same reference numeral as the first embodiment of the invention in but with the prefix "3". For example, the layered arrangement according to the third embodiment of the invention comprises an RE-shielded portion 311 whereas the layered arrangement 10 of the first embodiment of the invention comprises an RF-shielded portion 11. As can been seen in FIG. 7B, the only difference between the layered arrangement 310 of the third embodiment of the invention and the layered arrangement ID of the first embodiment of the invention is that the electronic system layer 114 and electrically conductive layer 115 of the RF-shielded portion 11 of the first embodiment of the invention have been replaced with a single combined electronic system electrically conductive layer 319.

[0032] FIG. 7C depicts a layered arrangement 410 according a fourth embodiment of the invention. Where the layered arrangement 410 comprises the identical layers to the layered arrangement 10 of the first embodiment of the invention, those layers have been assigned the same reference numeral as the first embodiment of the invention but with the prefix "4". For example, the layered arrangement according to the fourth embodiment of the invention comprises an RE-shielded portion 411 whereas the layered arrangement 10 of the first embodiment of the invention comprises an RF-shielded portion II. In the arrangement 410 according to the fourth embodiment of the invention the separate RFshielding layers 112, 117 of the RF-shielding portion I I of the first embodiment of the invention have been replaced by a single preformed RF-shielding envelope 4200. Such an arrangement eliminates the need for the post-processing steps of connecting connectors 5 I -10 -between the RF-shielding layers 112, 117 that are needed after water transfer printing a part with the arrangement 1 1 according to the first embodiment of the invention.

[0033] Whilst the present invention has been described and illustrated with reference to particular embodiments, it will be appreciated by those of ordinary skill in the art that the invention lends itself to many different variations not specifically illustrated herein By way of example only, certain possible variations will now be described.

[0034] In some embodiments of the invention, a layered arrangement may comprise multiple RF-shielding portions configured to form components comprising multiple spaced-apart RF-shielded electronic systems. In other embodiments, a layered arrangement may comprise electronic systems without RF-shielding.

[0035] Where in the foregoing description, integers or elements are mentioned which have known, obvious or foreseeable equivalents, then such equivalents are herein incorporated as if individually set forth. Reference should be made to the claims for determining the true scope of the present invention, which should be construed so as to encompass any such equivalents. It will also be appreciated by the reader that integers or features of the invention that are described as preferable, advantageous, convenient or the like are optional and do not limit the scope of the independent claims. Moreover, it is to be understood that such optional integers or features, whilst of possible benefit in some embodiments of the invention, may not be desirable, and may therefore be absent, in other embodiments.

Claims

CLAIMS1 A layered arrangement for liquid transfer printing onto an aircraft component, the layered arrangement comprising an RF-shielded portion, the RF-shielded portion comprising the following layers in order: a first electrically conductive RF-shielding layer, a first electrically insulating inner layer, - an electrically conductive inner layer in electrical connection with an electronic system, - a second electrically insulating inner layer, a second electrically conductive RF-shielding layer.
2 A layered arrangement according to claim 1, wherein the electrically conductive inner layer and electronic system are formed by a single layer.
3 A layered arrangement according to claim I, wherein the electronic system is contained within an electronic system layer which is separate to the electrically conductive inner layer.
4 A layered arrangement according to any preceding claim, wherein the electronic system comprises one of a lighting system, heating system, cooling system, or display screen.
A layered arrangement according to any preceding claim, further comprising an electrically conductive RF-shielding envelope, wherein the first and second electrically conductive RF-shielding layers are formed by the RF-shielding envelope, and the RF-shielding envelope surrounds and encloses the electrically conductive inner layer and electronic system to provide RF-shielding to the electronic system and electrically conductive inner layer.
-12 - 6 A layered arrangement according to any preceding claim, wherein the RF-shield ng portion is sandwiched between two electrically insulating outer layers.
7. A layered arrangement according to claim 6, further comprising a hydrophobic ink layer adjacent one of the two electrically insulating outer layers.
8 A layered arrangement according to claim 6 or claim 7, further comprising a soluble sacrificial layer adjacent one of the two electrically insulating outer layers, or, when present, adjacent the hydrophobic ink layer.
9 A method of manufacturing an aircraft component, the method comprising liquid transfer printing a layered arrangement according to any of claims 1 to 8 onto an outer surface of a base part.
10. A method according to claim 9 comprising the step of applying an adhesive layer to the base part prior to liquid transfer printing the layered arrangement onto the outer surface of the base part.
11 A method according to claim 9 or claim 10 when the layered arrangement is that of any of claims Ito 4 or 6 to 8, wherein, following the step of liquid transfer printing the layered arrangement onto the outer surface of the base part, the method comprises the subsequent step of connecting together the RF-shielding layers to form an electrically conductive RF-shielding envelope that surrounds and encloses the electrically conductive inner layer and electronic system to provide RFshielding to the electronic system and electrically conductive inner layer.
12. An aircraft component comprising a base part and a layered surface structure attached to the base part, wherein the layered surface structure comprises an RE-shielded portion, the RF-sh i el ded portion comprising an electrically conductive RFshielding envelope that surrounds and encloses an electrically conductive inner layer and an electronic system.-13 - 13 A method of manufacturing a layered arrangement for liquid transfer printing onto an aircraft component, the method comprising the steps of: depositing a first layer of polycarbonate onto a substrate to form a first outer insulating layer, wherein the substrate is one of a hydrophobic ink layer or a soluble layer, placing a copper mesh onto the first outer insulating layer to form a first RF-shielding layer, depositing a second layer of polycarbonate onto the first RF-shielding layer to create a first electrically insulating inner layer, placing an electronic system onto the first electrically insulating inner layer and electrically connecting the electronic system, depositing a third layer of polycarbonate onto the electronic system and electrical connections to form a second electrically insulating inner layer, placing a copper mesh onto the second electrically insulating inner layer to form a second RF-shielding layer, depositing a fourth layer of polycarbonate onto the second RF-shield ng layer to form a second outer insulating layer.