GB2579833A - Electrical device - Google Patents

Electrical device Download PDF

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Publication number
GB2579833A
GB2579833A GB1820520.3A GB201820520A GB2579833A GB 2579833 A GB2579833 A GB 2579833A GB 201820520 A GB201820520 A GB 201820520A GB 2579833 A GB2579833 A GB 2579833A
Authority
GB
United Kingdom
Prior art keywords
electrical
modules
outputs
optical
platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB1820520.3A
Other versions
GB201820520D0 (en
Inventor
Ariesen Jan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technetix BV
Original Assignee
Technetix BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technetix BV filed Critical Technetix BV
Priority to GB1820520.3A priority Critical patent/GB2579833A/en
Publication of GB201820520D0 publication Critical patent/GB201820520D0/en
Publication of GB2579833A publication Critical patent/GB2579833A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40Transceivers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0295Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R29/00Coupling parts for selective co-operation with a counterpart in different ways to establish different circuits, e.g. for voltage selection, for series-parallel selection, programmable connectors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/25Arrangements specific to fibre transmission
    • H04B10/2575Radio-over-fibre, e.g. radio frequency signal modulated onto an optical carrier
    • H04B10/25751Optical arrangements for CATV or video distribution
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/029Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/222Completing of printed circuits by adding non-printed jumper connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09254Branched layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Optical Communication System (AREA)

Abstract

There is provided an electrical device suitable for use in electrical communication networks and comprising: a platform (10) comprising an input (12), a plurality of outputs(14, 16, 18, 20) and a plurality of separate electrical tracks (22, 24, 26, 28, 30, 32, 34) unconnected to each other; and a plurality of electrical and optical modules (130, 132, 134, 136, 138, 140, 142, 144, 150, 160). The platform may be formed of a printed circuit board (PCB). The electrical modules are replaceably disposable to connect one or more of the electrical tracks so as to form completed electrical paths between the input (12) and at least one of the outputs (14, 16, 18, 20). The arrangement of the electrical modules with respect to the electrical tracks may be chosen to produce selected device functionality. The optical modules are replaceably disposable to connect to one or more optical fibres so as to form a completed path between the input and at least one of the outputs.

Description

Title: Electrical device
Field of the invention
This invention relates to an electrical device suitable for use in electrical 5 communication networks, such as broadband and/or CATV networks.
Background to the invention
In communication networks such as broadband and/or CATV networks amplifiers and nodes are used in the centralized access architecture (CAA) With the introduction of DOCSIS-3.1 as a communication specification, new technologies are being developed to offer data speeds up to 1 GHz. Parts like QAM modulators are put into the network as a distributed access architecture (DAA). The DAA network uses devices in the network like Remote PHY (RPD) or Remote Mac PHY (RMPD) which are put into amplifiers and will turn a digital data stream into QAM and OFDM signals to communicate to devices in the home.
In addition to these developments with Remote PHY or Remote Mac PHY, Full Duplex DOCSIS (FDx) is being introduced where the bandwidth is not divided between upstream or downstream but used simultaneous in both directions.
To put these developments into effect, devices have to be changed in the networks which involves large capital expenditure costs as the existing device needs to be removed and new equipment installed. This increases the investments costs and technical risks as this new device needs to be re-connected.
Summary of the invention
In accordance with the present invention there is provided an electrical device suitable for use in electrical communication networks, such as for example broadband and/ or CATV networks, comprising: a platform comprising an input, a plurality of outputs and a plurality of separate electrical tracks unconnected to each other; a plurality of electrical modules; and a plurality of optical modules; wherein the electrical modules are replaceably disposable to connect one or more of the electrical tracks so as to form completed electrical paths between the input and at least one of the outputs, and the optical modules are replaceably disposable to connect one or more optical fibres so as to form completed optical paths between the input and at least one of the outputs, the arrangement of the electrical modules and optical modules with respect to the electrical tracks chosen to produce a required functionality of the device. This allows the functionality of the device to be selected as required and in particular a device can migrate from an amplifier to node, then to a o remote PHY device and then to a Full Duplex DOCSIS (FDx) node as a network develops. This means the device does not need to be replaced when the network is upgraded, rather the device can be upgraded in the field so avoiding problems with disconnecting and reconnecting the device. The electrical modules can be removed and placed in different configurations with respect to the tracks as different functionality is required.
Preferably each electrical module provides a specific electrical function, for example at least one module may be a bridge, at least one module may be a splitter, at least one module may be a two-way splitter or combiner, at least one module may be a four-way splitter or combiner, at least one module may be an upstream amplifier, at least one module may be an optical receiver module, at least one module may be an output diplex filter, at least one module may be a remote PHY device, at least one module may be a remote PHY device with FDx, at least one module may be an optical transmitter, at least one module may be a tap. As will be appreciated by those in the art, modules with other functionality may be provided and generally a plurality of modules will be used in different combinations depending on the device functionality required, for example two bridges may be combined with a four-way combiner and combined with four output diplex filters.
The electrical modules are preferably manually disposable in the platform, to allow manual placement in the platform and manual removal and repositioning.
Preferably the electrical tracks further comprise connection regions into which the electrical modules are manually disposable.
The electrical tracks may further comprise electrical components, such as drivers, devices to produce interstage settings, amplifiers, hybrids, level equalizers.
The platform and electrical modules may further comprise cooperating formations for securing the electrical modules to the platform, such as cooperating push fit connections.
Preferably completed electrical paths are provided at least between the input and four outputs for RF signals.
The device is readily customisable and upgradeable and its characteristics can be altered as network configuration changes over time with technological developments.
By having a future-proofed device, the device itself does not need to be disconnected and replaced for upgrade to occur, rather modules will be manually rearranged to create different functionality and allow the networks to function for the upgraded configuration.
The invention will now be described, by way of example, with reference to the following drawings in which: Figure 1 shows a platform forming part of the electrical device; Figure 2 shows examples of modules for use with the platform; Figure 3 shows the platform and selected modules used to create an RF amplifier; Figure 4 shows the platform and selected modules used an electrical device being a lx1 optical node to four RF outputs; Figure 5 shows the platform and selected modules used to create an electrical device being a 2x2 optical node to four RF outputs; Figure 6 shows the platform and selected modules used to create an electrical device being a 4x4 optical node to four RF outputs; Figure 7 shows the platform and selected modules used to create an electrical device being a 1 xl remote PHY with four RF outputs; Figure 8 shows the platform and selected modules used to create an electrical device being a 2x2 remote PHY with four RF outputs; Figure 9 shows the platform and selected modules used to create an electrical device being a lx1 Full Duplex DOCSIS (FDx) remote PHY with four RF outputs; and Figure 10 shows the platform and selected modules used to create an electrical device being a 2x2 FDx remote PHY with four RF outputs.
o Description
Platform 10 shown in Figure 1 and modules, examples of which are shown in Figure 2, are combined together to form different types of electrical devices, examples of which are shown in Figures 3 to 10, these being non-limiting examples of the types of electronic devices that might be configured using the platform and suitable modules.
The invention particularly resides in configurations using optical modules.
Platform 10 is formed from a printed circuit board on which a plurality of tracks and connections are formed to create a structure of separate unconnected tracks. Platform 10 comprises a single input 12, a plurality of outputs 14, 16, 18, 20, fixed sections of track shown by solid lines, see for example 22, 24, 26, 28, 30, 32, 34, with some of the track sections, for example 30 and 26, containing electronic elements such as driver 40 and amplifier 42. Connection regions 50, 50', 54, 54', 56, 56', 60, 60', 62, 62', 64, 64', 66, 66', 70, 72, 74, 80, 82, 84, 86, 90, 92, 94, 96, 100, 102, 104, 106 provide corresponding connection points or connectors for receiving modules which connect separated non-connected parts of tracks together. Equivalent connection points, i.e. those corresponding in location to another connection point on a track disposed above or below the first connection point, are aligned in linear arrays to make it easier to identify where modules should be placed. The outputs are generally aligned as linear arrays on each side of the PCB. The connection regions and modules are provided with cooperating formations, typically being push fit connections, to allow manual placement of the modules into the connection regions and to allow removal of the modules, and if necessary positioning of the module at a different location on a track.
A variety of active electrical devices can be built by placing suitable electrical modules in chosen configurations to connect different sections of track together.
Typically downstream modules such as RF pre-stage or optical receivers will be placed at connection regions 50, 50', 52, 52', 54, 54', 56, 56' Typically upstream modules such as RF end amplifiers or optical transmitters will be positioned at connection regions 60, 60', 62, 62', 64, 64', 66, 66'.
Connection region 74 is used for upstream selection in relation to RF or remote PHY devices with connection point 72 used for the downstream selection of RF or remote PHY devices.
Connection regions 80, 82, 84, 86 are used for downstream splitting, with connection regions 90, 92, 94, 96 used for upstream combining. Connection regions 100, 102, 104, 106 are used for output diplex filters or remote PHY combining blocks/taps with connection region 70 used for input diplex filters.
The modules can consist of one or multiple electronic components or devices so as to give the desired electronic processing required between the connection regions. Example modules are shown in Figure 2, these being optical receiver 130, pre-stage amplifier 132, upstream amplifier with attenuators and/or equalisers 134, optical transmitter 136, bridge B to C 138, bridge A to C 140, two-way splitter/combiner 142, four-way splitter combiner 144, upstream/downstream splitting block or tap with remote PHY/ DPD output 146, output diplex filter 148, remote PHY device 150 comprising upstream amplifier 152, downstream amplifier 154 digital processor 156 and analogue demodulator 158, and remote PHY device with FDx 160 comprising additional echo cancellation 162. This list of modules with is not exhaustive but represents a preferred selection for putting into effect many electronic devices using the platform and modules with examples of such devices given in Figures 3 to 10.
Figure 3 shows an RF amplifier 166 with one input and four RF outputs formed on platform 10 using diplex filter module 170 positioned at connection point 70, B to C bridge 138 positioned at connection point 72, pre-stage amplifier 132 positioned across connection points 50, 50', four-way splitter 144 positioned across connection points 80, 82, 84, 86 so as to split the input signal into four, four output diplex filters 148, one of each filter positioned at each of connection points 100, 102, 104, 106, combiner 144 positioned so as to contact points 90, 92, 94 and 96, upstream amplifier 134 positioned across connection points 60, 60' and a second B to C bridge 138 positioned at connection point 74. RF amplifier 166 splits a signal received at input 12 into four signals which leave the device through four outputs 20, with upstream signals being received at outputs 20, passing through filters 148 to be combined at four-way combiner 144 and then amplified before being sent upstream through input 12.
Figure 4 shows a configuration of modules and platform used to create electrical device 180 being a lx1 optical node to four RF outputs where incoming signal passes through input 12 through connection point 70 to reach connection point 72 and is then conveyed to optical receiver 134 splitting into four signals using splitter 144. In this particular embodiment, the pre-stage amplifier 132, upstream amplifier 134 and bridges 138 are omitted, with the upstream amplifier being replaced with optical transmitter 136 and the pre-stage amplifier being replaced with optical receiver 130.
Figure 5 shows an electrical device 190 being a 2x2 optical node to four RF outputs which is similar to the arrangement shown in Figure 4 although with two optical receivers 130 and two optical transmitters 136 and with two-way splitter/combiners used instead of four-way splitters/combiners. Figure 6 shows a device 200 being a 4x4 optical node to four RF outputs where an optical receiver is disposed across each of paired connection points 50, 50', 52, 52', 54, 54', 56, 56' and single optical transmitters 136 are each disposed across each pair of connection points 60, 60', 62, 62', 64, 64', 66, 66'. A to C bridges 140 are used across connection points 80, 82, 84, 86, 90, 92, 94, 96. Both the configurations shown in Figures 4 and 5 enable optical fibres at an input and at outputs to be connected together to form completed optical paths.
Figure 7 shows a configuration where an electrical device 210 being a lx] remote PHY device with four RF outputs is provided. Remote PHY device 150 is connected via outputs 14', 18', A to C bridges 142, pre-stage amplifier 132, four-way splitter 144 and taps 146 to four outputs 20, with the upstream signal being returned through remote PHY device 150 via four-way combiner 144, upstream amplifier 134 and bridge 140.
Figure 8 shows a similar arrangement to Figure 7 where a 2x2 remote PHY device 220 with four RF outputs is provided with four-way combiner/splitter replaced with two-way combiner/splitter 142, a second remote PHY device introduced and an additional upstream amplifier 134 and pre-stage amplifier 132 included.
Figure 9 shows a 1 xl FDx remote PHY device 230 with four RF outputs where 15 remote PHY module 150 has been swapped for FDx module 160 and the device is filter independent due to swapping of the diplex filters for tap blocks 146.
Figure 10 shows a 2x2 FDx remote PHY device 240 with four RF outputs, being a similar arrangement to Figure 9 but with two FDx remote PHY modules 160, two pre-stage amplifiers 132 and two upstream amplifiers 134.
As a network develops and grows, an active device will generally need to migrate over time from an amplifier to a node, then to a R(M)PD node and then to a FDx node. For amplifier, node and Remote Phy Devices, the separation of upstream and downstream is done via diplex filters. With Full Duplex DOCSIS, these diplex filters cannot be used anymore as the upstream and downstream are both full bandwidth. The separation in this case needs taps and smart software. By providing a device that can migrate from an amplifier to a node to a Remote Phy Device to a Full Duplex DOCSIS device, there is no need to swap devices in the field when the network is upgraded which represents a huge saving in capital expenditure and reduces technical risks as the device does not need to be re-connected, merely have modules manually removed and repositioned or replaced with different modules or combinations of modules.
By making a modular device based on a platform and replaceable reconfigurable modules, parts of the active device can be swapped like building blocks.
With the use of the different modules and the diplex filters and tap-blocks, by way of example at least the following devices can be created: * 1 in 4 out RF amplifier * 1 x 1 optical node to 4 RF outputs * 2 x 2 optical node to 4 RF outputs o * 4 x 4 optical node to 4 RF outputs * 1 x 1 RPD with 4 RF outputs * 2 x 2 RPD with 4 RF outputs * 1 x 1 FDx RPD with 4 RF outputs * 2 x 2 FDx RPD with 4 RF outputs

Claims (8)

  1. Claims 1. An electrical device suitable for use in electrical communication networks and comprising: a platform comprising an input, a plurality of outputs and a plurality of separate electrical tracks unconnected to each other; a plurality of electrical modules; and a plurality of optical modules; wherein the electrical modules are replaceably disposable to connect one or more of the electrical tracks so as to form completed electrical paths between the input and at o least one of the outputs and the optical modules are replaceably disposable to connect one or more optical fibres so as to form completed optical paths between the input and at least one of the outputs.
  2. 2. An electrical device according to claim 1, wherein the electrical modules are manually disposable in the platform.
  3. 3. An electrical device according to claim 1 or claim 2, wherein the plurality of electrical modules comprise at least a separate optical receiver and an optical transmitter.
  4. 4. An electrical device according to any of the preceding claims, wherein the electrical tracks may further comprise electrical components.
  5. 5. An electrical device according to any of the preceding claims, wherein the electrical tracks further comprise connection regions into which the electrical modules are manually disposable.
  6. 6. An electrical device according to any of the preceding claims, wherein the platform and electrical modules further comprise cooperating formations for securing the electrical modules to the platform.
  7. 7. An electrical device according to any of the preceding claims, wherein each electrical module provides a specific electrical function.
  8. 8. An electrical device according to any of the preceding claims, wherein completed electrical paths are provided at least between the input and four outputs for RF signals.
GB1820520.3A 2018-12-17 2018-12-17 Electrical device Withdrawn GB2579833A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1820520.3A GB2579833A (en) 2018-12-17 2018-12-17 Electrical device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1820520.3A GB2579833A (en) 2018-12-17 2018-12-17 Electrical device

Publications (2)

Publication Number Publication Date
GB201820520D0 GB201820520D0 (en) 2019-01-30
GB2579833A true GB2579833A (en) 2020-07-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
GB1820520.3A Withdrawn GB2579833A (en) 2018-12-17 2018-12-17 Electrical device

Country Status (1)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4384755A (en) * 1981-02-02 1983-05-24 The United States Of America As Represented By The Secretary Of The Army Electrical harness interface system
US6305848B1 (en) * 2000-06-19 2001-10-23 Corona Optical Systems, Inc. High density optoelectronic transceiver module
US7470069B1 (en) * 2008-03-20 2008-12-30 International Business Machines Corporation Optoelectronic MCM package
WO2013163389A1 (en) * 2012-04-27 2013-10-31 Corning Cable Systems Llc Plug and play optical transceiver module for electronic devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4384755A (en) * 1981-02-02 1983-05-24 The United States Of America As Represented By The Secretary Of The Army Electrical harness interface system
US6305848B1 (en) * 2000-06-19 2001-10-23 Corona Optical Systems, Inc. High density optoelectronic transceiver module
US7470069B1 (en) * 2008-03-20 2008-12-30 International Business Machines Corporation Optoelectronic MCM package
WO2013163389A1 (en) * 2012-04-27 2013-10-31 Corning Cable Systems Llc Plug and play optical transceiver module for electronic devices

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GB201820520D0 (en) 2019-01-30

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