GB2570622B - Heat sink for liquid cooling - Google Patents
Heat sink for liquid cooling Download PDFInfo
- Publication number
- GB2570622B GB2570622B GB1714313.2A GB201714313A GB2570622B GB 2570622 B GB2570622 B GB 2570622B GB 201714313 A GB201714313 A GB 201714313A GB 2570622 B GB2570622 B GB 2570622B
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat sink
- liquid cooling
- cooling
- liquid
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (25)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1714313.2A GB2570622B (en) | 2017-09-06 | 2017-09-06 | Heat sink for liquid cooling |
EP18769441.9A EP3679603B1 (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
IL308679A IL308679A (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
EP23153453.8A EP4199076A1 (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
CN202111385072.9A CN114375131A (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink device and module for liquid immersion cooling |
CN201880058136.4A CN111095541B (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink device and module for liquid immersion cooling |
EP23153461.1A EP4203016A1 (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
TW111142513A TWI836706B (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
PCT/GB2018/052526 WO2019048864A1 (en) | 2017-09-06 | 2018-09-06 | Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling |
TW107131329A TWI786175B (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
KR1020237018653A KR102640723B1 (en) | 2017-09-06 | 2018-09-06 | Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling |
ES18769441T ES2943656T3 (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
US16/645,166 US11096313B2 (en) | 2017-09-06 | 2018-09-06 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
KR1020237018651A KR102639521B1 (en) | 2017-09-06 | 2018-09-06 | Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling |
JP2020513520A JP7183257B2 (en) | 2017-09-06 | 2018-09-06 | Immersion cooling heat sinks, heat sink devices and modules |
KR1020207009009A KR102541199B1 (en) | 2017-09-06 | 2018-09-06 | Heat sinks, heat sink arrays and modules for immersion cooling |
IL273104A IL273104B2 (en) | 2017-09-06 | 2018-09-06 | Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling |
US17/354,769 US11369040B2 (en) | 2017-09-06 | 2021-06-22 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
US17/354,781 US11470739B2 (en) | 2017-09-06 | 2021-06-22 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
US17/678,387 US11653472B2 (en) | 2017-09-06 | 2022-02-23 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
US17/902,747 US11596082B2 (en) | 2017-09-06 | 2022-09-02 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
JP2022186574A JP2023029880A (en) | 2017-09-06 | 2022-11-22 | cooling module |
JP2022186573A JP2023029879A (en) | 2017-09-06 | 2022-11-22 | cooling module |
US18/122,449 US20230240042A1 (en) | 2017-09-06 | 2023-03-16 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
US18/122,431 US11968802B2 (en) | 2017-09-06 | 2023-03-16 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1714313.2A GB2570622B (en) | 2017-09-06 | 2017-09-06 | Heat sink for liquid cooling |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201714313D0 GB201714313D0 (en) | 2017-10-18 |
GB2570622A GB2570622A (en) | 2019-08-07 |
GB2570622B true GB2570622B (en) | 2020-03-11 |
Family
ID=60050748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1714313.2A Active GB2570622B (en) | 2017-09-06 | 2017-09-06 | Heat sink for liquid cooling |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2570622B (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04196155A (en) * | 1990-11-26 | 1992-07-15 | Nec Corp | Method for cooling integrated circuit |
US20060007656A1 (en) * | 2004-07-09 | 2006-01-12 | Symons Robert S | Integrated liquid cooling device with immersed electronic components |
US20100103620A1 (en) * | 2008-10-23 | 2010-04-29 | International Business Machines Corporation | Open Flow Cold Plate For Liquid Cooled Electronic Packages |
US20100103614A1 (en) * | 2008-10-23 | 2010-04-29 | International Business Machines Corporation | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow |
US20110149517A1 (en) * | 2006-09-06 | 2011-06-23 | Airbus Operations Gmbh | Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System |
US20150109728A1 (en) * | 2013-10-21 | 2015-04-23 | International Business Machines Corporation | Field-replaceable bank of immersion-cooled electronic components |
WO2016076882A1 (en) * | 2014-11-14 | 2016-05-19 | Hewlett Packard Enterprise Development Lp | Cooling rack |
-
2017
- 2017-09-06 GB GB1714313.2A patent/GB2570622B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04196155A (en) * | 1990-11-26 | 1992-07-15 | Nec Corp | Method for cooling integrated circuit |
US20060007656A1 (en) * | 2004-07-09 | 2006-01-12 | Symons Robert S | Integrated liquid cooling device with immersed electronic components |
US20110149517A1 (en) * | 2006-09-06 | 2011-06-23 | Airbus Operations Gmbh | Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System |
US20100103620A1 (en) * | 2008-10-23 | 2010-04-29 | International Business Machines Corporation | Open Flow Cold Plate For Liquid Cooled Electronic Packages |
US20100103614A1 (en) * | 2008-10-23 | 2010-04-29 | International Business Machines Corporation | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow |
US20150109728A1 (en) * | 2013-10-21 | 2015-04-23 | International Business Machines Corporation | Field-replaceable bank of immersion-cooled electronic components |
WO2016076882A1 (en) * | 2014-11-14 | 2016-05-19 | Hewlett Packard Enterprise Development Lp | Cooling rack |
Also Published As
Publication number | Publication date |
---|---|
GB2570622A (en) | 2019-08-07 |
GB201714313D0 (en) | 2017-10-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20200109 AND 20200115 |