GB2534317A - Display device and test line repair method therefor - Google Patents

Display device and test line repair method therefor Download PDF

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Publication number
GB2534317A
GB2534317A GB1604875.3A GB201604875A GB2534317A GB 2534317 A GB2534317 A GB 2534317A GB 201604875 A GB201604875 A GB 201604875A GB 2534317 A GB2534317 A GB 2534317A
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tft
section
line
display device
connection
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GB201604875D0 (en
GB2534317B (en
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Du Peng
Shih Minghung
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/08—Fault-tolerant or redundant circuits, or circuits in which repair of defects is prepared
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/10—Dealing with defective pixels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Liquid Crystal Display Device Control (AREA)

Abstract

A display device and a test line repair method therefor. The method comprises: respectively disconnecting a first input end and a first output end of a first thin-film transistor from a test signal input line (301) in a laser cutting manner; and connecting a first spare line (306) to a test signal output line (307) in a laser welding manner. The device and method therefor enable the width to length ratio of a display device not to be changed, so that no display exception will occur during lighting detection.

Description

DISPLAY DEVICE AND TESTING LINE REPAIRING
METHOD THEREOF
FIELD OF THE DISCLOSURE
[0001] The present invention relates to the field of flat panel display technology, and more particularly relates to a display device and testing line repairing method thereof.
BACKGROUND OF THE DISCLOSURE
[0002] Generally, the conventional display panel testing technique is illustrated in the following description. As shown in FIG 1, a thin film transistor (TFT) 100 is implemented as a switch. A drain 102 of the TFT 100 is connected with a testing signal generator, a source 103 of the TFT 100 is connected with a gate line/data line within the display panel, and a gate 101 of the TFT 100 is connected with a controlling signal generator [0003] During the testing procedure, the controlling signal generator outputs a high voltage level signal to the gate 101 to turn on the switch 100, and the source 103 and the drain 102 are conducted. After the testing procedure is done, the controlling signal generator outputs a low voltage level signal to the gate 101 to turn off the switch 100 and the connection between the source 103 and the drain 102 is cut off.
[0004] During the manufacture process, since the particle existed, a short circuit would have occurred between the source 103 and the drain 102 in the TFT 100. For example, as shown in FIG 2, the short circuit has occurred in the area 104. As in the aforementioned technical condition, the conventional repairing method is to cut in a cut-off position 105 by laser. However, practically, there are couple problems in the conventional techniques. For example: [0005] 1. If the short circuit is not going to be repaired, or the conventional method is used to repair the short circuit but the width-to-length ratio of the TFT 100 is varied, the light-on test for the display panel will show the abnormal display because of the difference of the line resistance or a line defect has occurred to cause error detection so as to cause an unnecessary waste and loss.
[0006] 2. When a curing procedure is implemented in the PSVA type display panel and the short circuit has occurred between the source 103 and the drain 102 in the TFT 100, there is permanent malfunction of the line in the display panel if it is not repaired or the conventional method is implemented to repair.
[0007] Therefore, it is necessary to provide a novel technical solution to solve the aforementioned problems.
SUMMARY OF THE DISCLOSURE
[0008] One object of the present invention is to provide a display device and a testing line repairing method thereof, and the width-to-length ration won't be varied so as to avoid the abnormal display during the light-on testing.
[0009] In order to solve the technical problem described above, one technical solution provided in the present invention is as follows.
[0010] A display device comprises a display panel comprising a first thin film transistor (TFT) array comprising at least one first TFT; a second TFT array comprising at least one second TFT; and at least one first dummy line, wherein the first TFT is adjacent to the second TFT and the second TFT is connected with a testing signal input line and the first dummy line; when a short circuit has occurred in the first TFT, a first connection between a first input end of the first TFT and the first dummy line is cut off by a laser cutting method, and a second connection between the first input end of the first TFT and a testing signal output line is cut off by the laser cutting method, the first dummy line is connected with the testing signal output line by a laser welding method; and the display panel further comprising a controlling signal line array comprising at least one controlling signal line; and a first controlling end of the first TFT is connected with a second controlling end of the second TFT and the controlling signal line, and when the short circuit has occurred in the lust TFT, a controlling signal is received in the second controlling end from the controlling signal line; the first output end is a drain or a source of the first TFT when the first input end is the source or the drain of the first TFT.
[0011] In the aforementioned display device, the second controlling end is implemented to turn on or off a switch corresponding to the second TFT in accordance with the controlling signal.
100121 In the aforementioned display device, a second input end of the second TFT is connected with the testing signal input line and a second output end of the second TFT is connected with the first dummy line.
100131 In the aforementioned display device, the first dummy line comprises a first section, a second section and a third section; the second section is disposed between the first section and the third section, and the second section is connected with the second output end. When the short circuit has occurred in the first TFT, the second section is connected with the testing signal output line by the laser welding method, a third connection between the first section and the third section is cut off by the laser cutting method, and a fourth connection between the third section and the second section is cut off by the laser cutting method.
100141 In the aforementioned display device, the first dummy line includes a first end and a second end and the first end is connected with the second output end and the second end is disposed in another side of the testing signal output line opposite the first end. When the short circuit has occurred in the first TFT, the first dummy line is connected with the testing signal output line by the laser welding method.
100151 In the aforementioned display device, the display device further comprises at least one second dummy line including a fourth section, a fifth section and a sixth section; the fifth section is disposed between the fourth section and the sixth section, and the fifth section is connected with the second input end. When the short circuit has occurred in the first TFT, the fifth section is connected with the testing signal input line by the laser welding method, a fifth connection between the fourth section and the fifth section is cut off by the laser cutting method, and a sixth connection between the sixth section and the fifth section is cut off by the laser cutting method.
100161 A display device comprises a display panel comprising a first thin film transistor (TFT) array comprising at least one first TFT; a second TFT array comprising at least one second TFT; and at least one first dummy line, wherein the first TFT is adjacent to the second TFT and the second TFT is connected with a testing signal input line and the first dummy line. When a short circuit has occurred in the first TFT, a first connection between a first input end of the first TFT and the first dummy line is cut off by a laser cutting method, and a second connection between the first input end of the first TFT and a testing signal output line is cut off by the laser cutting method, the first dummy line is connected with the testing signal output line by a laser welding method.
100171 Tn the aforementioned display device, the display panel further comprises a controlling signal line array comprising at least one controlling signal line; and a first controlling end of the first TFT is connected with a second controlling end of the second TFT and the controlling signal line, and when the short circuit has occurred in the first TFT, a controlling signal is received in the second controlling end from the controlling signal line.
100181 In the aforementioned display device, the second controlling end is implemented to turn on or off a switch corresponding to the second TFT in accordance with the controlling signal.
100191 In the aforementioned display device, a second input end of the second TFT is connected with the testing signal input line and a second output end of the second TFT is connected with the first dummy line.
100201 In the aforementioned display device, the first dummy line comprises a first section, a second section and a third section; and the second section is disposed between the first section and the third section and the second section is connected with the second output end. When the short circuit has occurred in the first TFT, the second section is connected with the testing signal output line by the laser welding method, a third connection between the first section and the third section is cut off by the laser cutting method, and a fourth connection between the third section and the second section is cut off by the laser cutting method.
100211 In the aforementioned display device, the first dummy line includes a first end and a second end and the first end is connected with the second output end and the second end is disposed in another side of the testing signal output line opposite the first end. When the short circuit has occurred in the first TFT, the first dummy line is connected with the testing signal output line by the laser welding method.
100221 In the aforementioned display device, the display device further comprises at least one second dummy line including a fourth section, a fifth section and a sixth section; the fifth section is disposed between the fourth section and the sixth section, and the fifth section is connected with the second input end. When the short circuit has occurred in the first TFT, the fifth section is connected with the testing signal input line by the laser welding method, a fifth connection between the fourth section and the fifth section is cut off by the laser cutting method, and a sixth connection between the sixth section and the fifth section is cut off by the laser cutting method.
100231 In the aforementioned display device, the first output end is a drain or a source of the first TFT when the first input end is the source or the drain of the first TFT.
100241 A testing line repairing method of the display device comprises: A. cutting the first connection and the second connection by the laser cutting method, and the first connection is between the first input end of the first TFT and the testing signal input line, and the second connection is between the first output end of the first TFT and the testing signal output line; and B. connecting the first dummy line with the testing signal output line by the laser welding method in the display device, wherein the second input end of the second TFT in the display device is connected with the testing signal input line, and the second output end of the second UT is connected with the first dummy line.
100251 Tn the aforementioned display device, step B comprises: B I connecting the second section of the first dummy line with the testing signal output line by the laser welding method; and the method further comprises: C. cutting off a third connection and a fourth connection by the laser cutting method, wherein the third connection is between the first section and the second section of the first dummy line and the fourth connection is between the third section and the second section of the first dummy line; wherein the second output end is connected with the second section and the second section is disposed between the first section and the third section.
100261 In the aforementioned display device, the method further comprises: D. connecting the first dummy line with the testing signal output line by the laser welding method; wherein the first dummy line includes a first end and a second end, and the first end is connected with the second output end and the second end is disposed at another side of the testing signal output line oppositethe first end.
[0027] In the aforementioned display device, the method further comprises: E. cutting off a fifth connection and a sixth connection by the laser cutting method, and the fifth connection is between a fourth section and a fifth section of a second dummy line and the sixth connection is between a sixth section and the fifth section of the second dummy line in the display device; F. connecting the fifth section with the testing signal input line by the laser welding method; wherein the fifth section is between the fourth section and the sixth section and the fifth section is connected with the second input end.
[0028] In the aforementioned display device, the first output end is a drain or a source of the first TFT when the first input end is the source or the drain of the first TFT.
[0029] In the aforementioned display device, the method further comprises: G. the second controlling end of the second TFT receives a controlling signal from a controlling signal line in the display device to turn on or off a switch corresponding to the second TFT.
[0030] The advantage of the present invention is that the width-to-length ratio of the display device will not be changed and the abnormal display won't happen in the light-on testing and error detection won't happen. The malfunction of the lines in the display panel during the curing process is reduced and the yield of the display panel is increased.
DESCRIPTION OF THE DRAWINGS
[0031] FIG 1 is a view of a conventional technical method to test the display panel; [0032] FIG. 2 is a view of a repairing method when a short circuit has occurred in a thin film transistor in FIG 1; [0033] FIG 3A is a view of the display device in a first embodiment of the present invention; [0034] FIG 3B is a view of the repairing method for the display device in FIG 3A; [0035] FIG 4A is a view of the display device in a second embodiment of the present invention; [0036] FIG 4B is a view of the repairing method for the display device in FIG 4A; [0037] FIG 5A is a view of the display device in a third embodiment of the present invention; and [0038] FIG 5B is a view of the repairing method for the display device in FIG 5A
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
100391 The above-mentioned description of the present invention can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings.
[0040] In drawings, the components with similar structure are represented by the same sign.
[0041] Referring FIG. 3A and FIG. 3B, FIG. 3A is a view of the display device in a first embodiment of the present invention. FIG. 3B is a view of the repairing method for the display device in FIG 3A. The dots "s" in FIG 3B are the laser welding positions and the crosses in FIG 3B are the laser cutting positions.
[0042] The display device in the present embodiment includes a display panel 300. The display panel 300 includes a first thin film transistor (TFT) array, a second TFT array, and at least one first dummy line 306. The first TFT array includes at least one TFT 303 and the second TFT array includes at least one TFT 304. The second TFT 304 is a backup TFT for the first TFT 303 and the second TFT 304 is configured for repairing the display device/the display panel 300 when a short circuit has occurred in the first TFT 303.
[0043] The first TFT 303 is adjacent to the second TFT 304 and the second TFT 304 is connected with the testing signal input line 301 and the first dummy line 306.
[0044] When the short circuit has occurred in the first TFT 303, a first connection between a first input end of the first TFT 303 and the testing signal input line 301 is cut off by a laser cutting method. A second connection between a first output end of the first TFT 303 and a testing signal output line 307 is cut off by a laser cutting method. The first dummy line 306 is connected with the testing signal output line 307 by the laser welding method. The first input end is a source/drain of the first TFT 303 and, correspondingly, the first output end is the drain/source of the first TFT:303.
[0045] The display panel 300 further includes a controlling signal line array and the controlling signal line array includes at least one controlling signal line 302.
[0046] A first controlling end of the first TFT 303 and a second controlling end of the second TFT 304 are connected with the controlling signal line 302. If the short circuit has occurred in the first TFT 303, the second controlling end is configured for receiving the controlling signal from the controlling signal line 302 and turns on or off the switch corresponding to TFT 304 in accordance with the controlling signal. A second input end of the second TFT 304 is connected with the testing signal input line 301, and a second output end of the second TFT 304 is connected with the first dummy line 306.
[0047] In the present embodiment, the first dummy line 306 includes a first section 3061, a second section 3062, and a third section 3063. The second section 3062 is disposed between the first section 3061 and the third section 3063. And the second section 3062 is connected with the second output end.
[0048] When the short circuit has occurred in the first TFT 303, the second section 3062 is connected with the testing signal output line 307 by the laser welding method. The third connection between the first section 3061 and the second section 3062 is cut off by the laser cutting method. The fourth connection between the third section 3063 and the second section 3062 is cut off by the laser cutting method.
[0049] In the present embodiment, the repairing method of the display device is to cut off the connection (the first connection and the second connection) between the damaged TFT (such as the first TFT 303 with the short circuit) and the testing signal line 301 and the data line/gate line (corresponding to the testing signal output line 307). The testing signal in the testing signal line 301 can transmit the testing signal to the display zone within the display panel from the backup TFT (the second TFT 304). Subsequently, the first dummy is cut off. After repairing, the transmitting path of the testing signal is shown as the arrows in FIG. 3B.
[0050] The repairing method of the display device in the present embodiment is required to process four times for laser cutting and one time for laser welding.
[0051] Please referring FIG 4A and FIG 4B, FIG 4A is a view of the display device in the second embodiment of the present invention. FIG 4B is a view of the repairing method for the display device in FIG 4A. The present embodiment is similar to the first embodiment and the difference therebetween is illustrated in the following description.
[0052] In the present embodiment, the first dummy line 306 includes a first end and a second end. The first end is connected with the second end and the second end is disposed at another side of the testing signal output line 307 opposite the first end.
[0053] When the short circuit is occurred in the first TFT 303, the first dummy line 306 is connected with the testing signal output line 307 by the laser welding method.
[0054] The testing method of the display device in the present embodiment is required to process two times for laser cutting and one time for laser welding.
[0055] Referring FIG 5A and FIG 5B, FIG 5A is a view of the display device in a third embodiment of the present invention. FIG 5B is a view of the repairing method for the display device in FIG 5A. The present embodiment is similar to the first or the second embodiment and the difference therebetween is illustrated in the following description.
[0056] In the present embodiment, the display panel 300 further includes at least one second dummy line 305 and the second dummy line 305 includes a fourth section 3051, a fifth section 3052, and a sixth section 3053. The fifth section 3052 is disposed between the fourth section 3051 and the sixth section 3053 and the fifth section 3052 is connected with the second input end.
[0057] When the short circuit is occurred in the first TFT 303, the fifth section 3052 is connected with the testing signal input line 301 by the laser welding method and the fifth connection between the fourth section 3051 and the fifth section 3052 is cut off by the laser cutting method. The sixth connection between the sixth section 3053 and the fifth section 3052 is cut off by the laser cutting method.
[0058] The repairing method of the display method in the present embodiment is required to process six times for laser cutting and two times for laser welding.
[0059] In any one of the aforementioned embodiments (the first embodiment, the second embodiment, or the third embodiment), preferably, the second TFT 304 is the same as the first TFT 303. For example, the size and the properties of the second TFT 304 are the same or mostly similar to the first TFT 303. Therefore, after the aforementioned technical method is used to repair the display device, the resistance of the all lines in the display device won't be varied.
[0060] In any one of the aforementioned embodiments, since the second TFT 304 (the backup TFT) is implemented to repair the display device, the width-to-length ratio of the display device will not be changed and the abnormal display won't happen in the light-on testing and error detection won't happen. The malfunction of the lines in the display panel 300 during the curing process is reduced and the yield of the display panel 300 is increased.
[0061] Referring FIG 3A and FIG 3B, FIG 3A is a view of the display device in a first embodiment of the present invention. FIG 3B is a view of the repairing method for the display device in FIG 3A. The dots "IV in FIG 3B are the laser welding positions and the crosses "X" in FIG 3B are the laser cutting positions.
[0062] A. The first connection and the second connection are cut off by the laser cutting method. The first connection is between the first input end of the first TFT 303 and the testing signal input line 301 and the second connection is between the first input end of the first TFT 303 and the testing signal output line 307.
[0063] B. The first dummy line 306 is connected with the testing signal output line 307 by the laser welding method in the display device. The second input end of the second TFT in the display device is connected with the testing signal input line 301 and the second input end of the second TFT 304 is connected with the first dummy line 306.
[0064] In the present embodiment, step B includes: [0065] Bl. The second section 3062 of the first dummy line 306 is connected with the testing signal output line 307 by the laser welding method.
[0066] In the present embodiment, the method further comprises: [0067] C. A third connection and a fourth connection are cutting off by the laser cutting method. The third connection is between the first section 3061 and the second section 3062 of the first dummy line 306 and the fourth connection is between the third section 3063 and the second section 3062 of the first dummy line 306.
[0068] The second output end is connected with the second section 3062 and the second section 3062 is disposed between the first section 3061 and the third section 3063. The second input end of the second TFT 304 is connected with the testing signal input line 301 and the second output end of the second TFT 304 is connected with the first dummy line 306 by the second section 3062. The first output end is a drain or a source of the first TFT 303 when the first input end is the source or the drain of the first TFT 303.
[0069] In the present embodiment, when the short circuit has occurred in the first TFT 303, the second controlling end of the second TFT 304 receives the controlling signal from the controlling signal line 302 of the display device and turns on or off the switch corresponding to the second TFT 304 in accordance with the controlling signal.
[0070] In the present embodiment, the second TFT 304 is the backup TFT for the first TFT 303 and the second TFT 304 is implemented to repair the display device/display panel 300 when the short circuit is occurred in the first TFT 303.
[0071] In the present embodiment, the repairing method of the display device is to cut off the damaged TFT (such as the first TFT 303 with the short circuit) and the testing signal line 301 and the data line/gate line (corresponding to the testing signal output line 307). The testing signal in the testing signal line 301 can transmit to the display area within the display panel from the backup TFT (the second TFT 304). Thereafter, the first dummy is cut off. After repairing, the transmitting path of the testing signal is shown as the arrows in FIG 3B.
[0072] The repairing method of the display device in the present embodiment is required to process four times for laser cutting and one time for laser welding.
[0073] In the present embodiment, the executing sequence of the steps is not limited herein. In other words, the aforementioned steps can be executed by any sequence.
[0074] Please referring FIG 4A and FIG 4B, FIG 4A and FIG 4B are views of the display device in the second embodiment of the present invention. The present embodiment is similar to the first embodiment and the difference therebetween is illustrated in the following description.
[0075] In the present embodiment, the method further includes: [0076] D. The first dummy line 306 is connected with the testing signal output line 307 by the laser welding method.
[0077] The first dummy line 306 includes a first end and a second end, and the first end is connected with the second output end and the second end is disposed at another side of the testing signal output line 307 opposite the first end.
[0078] The repairing method of the display device in the present embodiment is required to process two times for laser cutting and one time for laser welding.
[0079] In the present embodiment, the executing sequence of the steps is not limited herein. In other words, the aforementioned steps can be executed by any sequence.
[0080] Referring FIG. SA and FIG. 5B, FIG. SA and FIG. 5B are views of the display device in the third embodiment of the present invention. The present embodiment is similar to the first or the second embodiment and the difference therebetween is illustrated in the following description.
[0081] In the present embodiment, the method further includes: [0082] E. A fifth connection and a sixth connection are cut off by the laser cutting method. The fifth connection is between a fourth section 3051 and a fifth section 3052 of a second dummy line 305 and the sixth connection is between a sixth section 3053 and the fifth section 3052 of the second dummy line 305 in the display device.
[0083] F. The fifth section 3052 is connected with the testing signal input line 301 by the laser welding method.
[0084] The fifth section is between the fourth section and the sixth section and the fifth section is connected with the second input end.
100851 The repairing method of the display device in the present embodiment is required to process six times for laser cutting and two times for laser welding.
[0086] In the present embodiment, the executing sequence of the steps is not limited herein. In other words, the aforementioned steps can be executed by any sequence.
[0087] In any one of the aforementioned embodiments (the first embodiment, the second embodiment or the third embodiment), preferably, the second TFT 304 is the same as the first TFT 303. For example, the size and the properties of the second TFT 304 are the same or mostly similar to the first TFT 303. Therefore, after the aforementioned technical method is used to repair the display device, the resistance of the all lines in the display device won't be varied.
[0088] Tn any one of the aforementioned embodiments, since the second TFT 304 (the backup TFT) is implemented to repair the display device, the width-to-length ratio of the display device will not be changed and the abnormal display won't happen in the light-on testing and error detection won't happen. The malfunction of the lines in the display panel 300 during the curing process is reduced and the yield of the display panel 300 is increased.
[0089] As described above, the present invention has been described with preferred embodiments thereof and it is understood that many changes and modifications to the described embodiments can be carried out without departing from the scope and the spirit of the disclosure that is intended to be limited only by the appended claims.
GB1604875.3A 2013-12-17 2013-12-30 Display device and testing line repairing method thereof Expired - Fee Related GB2534317B (en)

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CN103680370A (en) 2014-03-26
KR101894523B1 (en) 2018-09-04
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KR20160060106A (en) 2016-05-27
GB2534317B (en) 2020-12-09

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