GB2453560A - Wafer electroplating apparatus - Google Patents

Wafer electroplating apparatus Download PDF

Info

Publication number
GB2453560A
GB2453560A GB0719805A GB0719805A GB2453560A GB 2453560 A GB2453560 A GB 2453560A GB 0719805 A GB0719805 A GB 0719805A GB 0719805 A GB0719805 A GB 0719805A GB 2453560 A GB2453560 A GB 2453560A
Authority
GB
United Kingdom
Prior art keywords
wafer
providing
liquid
power supply
holding devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0719805A
Other versions
GB0719805D0 (en
Inventor
Erik Sauar
Karl Ivar Lundahl
Robertus Antonius Steeman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renewable Energy Corp ASA
Original Assignee
Renewable Energy Corp ASA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renewable Energy Corp ASA filed Critical Renewable Energy Corp ASA
Priority to GB0719805A priority Critical patent/GB2453560A/en
Publication of GB0719805D0 publication Critical patent/GB0719805D0/en
Priority to CN200880119132.9A priority patent/CN101883880B/en
Priority to PCT/NO2008/000359 priority patent/WO2009048338A1/en
Priority to DE112008002725T priority patent/DE112008002725T5/en
Priority to JP2010528823A priority patent/JP2011500960A/en
Priority to US12/682,473 priority patent/US20100307926A1/en
Publication of GB2453560A publication Critical patent/GB2453560A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

Wafers 3 are mounted onto a conveyor 3 and are transported through an electrodeposition bath. Electrical contact to the wafers is provided through carriers having grooves which support a wafer at its edge or via wire brushes 42 brought into contact with one of the faces of the wafer (see figure 5).

Description

Method and device for supplying electrical power
FIELD OF INVENTION
The present invention is related to a method and device for supplying electrical power to a wafer. More specifically, the invention is related to a method and device for supplying electrical power to a wafer at least partially submerged in a liquid.
BACKGROUND OF THE INVENTION
A device and method for exposing wafers to a liquid are described in GB patent application 0709619.1 filed on 18th of May, 2007. This application is hereby incorporated by reference.
In some processes there is a need to supplying electrical power to the wafer while the wafer is at least partially submerged in the liquid. One example of such a process is electroplating, where for example Ni, Cu, Sn and/or Ag is applied to the wafer. A challenge in this process is to provide electrical contact to the wafer without applying strong mechanical forces to the wafer, which may cause breakage of the wafer. Another disadvantage in such processes is that the metal or other materials are deposited on other parts of the production equipment, and this has to be removed periodically, which increases the non-productive time for the equipment.
The object of the invention is to provide a method and device for supplying electrical power to a wafer, where these disadvantages are avoided.
SUMMARy OF THE INVENTiON
The present invention is defined in the enclosed independent claims. Further embodiments are described in the dependent claims.
DETAILED DESCRIPTION
In the following, embodiments of the invention will be described with reference to the enclosed drawings, where: Fig 1 illustrates an overview of an embodiment of the invention; Fig. 2 illustrates an enlarged view of the left side of fig. 1; Fig. 3 shows a perspective view of the holding device in fig. 2; Fig. 4 shows a side view of the holding device in fig. 2; Fig. 5 illustrates another embodiment of the invention; Fig. 6a and 6b illustrate two cross sectional views of the holding device.
In fig. I it is shown a device comprising a transportation device 10 over a liquid container 2 containing a liquid The transportation device 10 comprises wafer carrier devices 12 mounted between two transportation bands l4a and 14b.
The transportation device is further comprising a drive system (not shown) for moving the transportation bands and consequently also the wafer carrier devices 12 over the liquid container 2 as illustrated by arrows A. Wafers 3 are picked up or are in other ways fastened to the wafer carrier device 12 near a first end of the container 2 (on the left in fig. 1) and is being held by the transportation device 10 during transport to the second side of the container 2 (on the right in fig. I), where the wafers are released and for example transported to a next subprocess facility. During the transportation, the wafers 3 are completely or partially submerged into the liquid In fig. I it is shown that three wafers 3 are transported in parallel. The transportation device 10 may in this embodiment comprise separation means 16 to keep the parallel wafers 3 separated from each other. It should be noted that not all separations means 16 are shown in the drawings, some of them are omitted for clarity.
Of course, it would be possible to transport only one wafer 3, or it would be possible to transport more than three wafers 3 in parallel.
The wafer carrier devices 12 comprises holding devices 18 with a cross section substantially formed as a dove tail joint (as shown in detail in fig. 3 and 4), i.e. the holding device 18 comprises wedge- shaped grooves 19 in the longitudinal direction of both sides of the holding device. The end of the wafer 3 is received in the wedge-shaped grove 19. As shown in fig. 2, a wafer 3 is held between two holding devices 18 of respective wafer carrier devices 12.
There are several ways of arranging and designing such a transportation device 10 and wafer carrier devices 12, and many such arrangements are shown in GB patent application 0709619.1 filed on 18th of May, 2007 which is hereby incorporated by reference The holding device 18 further comprises electrical contacts 20 localized for example in or near the grooves 19 to provide electrical contact with the wafer while the wafer is being held by the holding device 18. The electrical contacts 20 are placed at intervals along the grooves 19, and can be applied either on the top side of the wafer, bottom side or both. It is also in principle possible to establish a different voltage on the two surfaces of the two wafers if desired from a process point of view, for example for plating. Further, the electrical contacts are connected to a power supply 32 by means of electrical wires 30, as illustrated in fig. 2 (indicated by dashed lines) In fig. 2 it is shown that the electrical contacts 20 are connected to the negative terminal of the power supply 32, while the positive terminal is connected by means of an electrical wire 34 to an electrical conductor or anode 36 submerged in the liquid.
It should be noted that since the transportation device rotates, means should be provided to avoid winding of the electrical wires 30 between the power supply and the holding devices. For example could bus bars connected to the negative terminal of the power supply be provided over the liquid. In this case, the holding devices 18 would be adapted to get in contact with the bus bars over the liquid for the desired contacting time, and consequently also provide electrical contact between the wire and the electrical contacts 20.
It is important to achieve good electrical contact between the wafers and electrical contacts of the holding device. One possibility is to use spring loaded electrical contacts or electrical contacts comprising soft brushes inside or around the grooves in the holding device. Another possibility is to direct the liquid flows over and below the wafers so that the total flow pattern creates an automatic upward or downward pressure on the wafer. In the above-mentioned GB patent application 0709619 it is described how channels or carve-outs in the holding devices may be used to distribute liquid flows between the two sides of the wafer. Such channels are denoted with reference number 50 in fig. 3 and fig. 6a and 6b. "Upward" channels (fig. 6a) is leading the liquid from the bottom part of the bath to the top side of the next wafer will create a higher liquid level on the top side of the wafer than in the open areas between the wafers, and consequently create a downward pressure on the wafer. "Downward" oriented channels (fig. 6b) will increase the pressure on the bottom side of the wafers and create an up-lift on all wafers The liquid can be flowing through the channels by means of the movement of the holding device through the liquid bath, or by means of pumping means.
Another option for providing a downward acting force on the wafer could for instance be to provide a system where the liquid in the vessel is pumped from below the wafers and transferred via piping with outlets or nozzles above the wafers. Such an arrangement would create a small difference in pressure between the liquid on top of the wafers and the liquid below the wafers. The pressure difference will result in a net force on the wafers acting downwards. The required force for enabling a good mechanical and electrical contact to the wafers could then be adjusted by the velocity of the liquid flow.
Surface tensions may furthermore cause partially submerged wafers with dry top side to have an uplift relative to the holding devices while the same wafers with a wet top side will resist being lifted. Both mechanisms can be used to ensure a good electrical contact.
Moreover, it would be possible to provide several bus bars over the liquid, where the respective bus bars are having a different potential or voltage level in relation to the anode 36.
The electroplating process will now be described with reference to fig. 2. Here, the liquid container is omitted for clarity, but it should be mentioned that the rightmost wafer 3a is at least partially submerged in the liquid. The vessel contains a liquid in which metal ions, are present. The aim with the invention is to use prior art referred to as electroplating for depositing metals thorough an aqueous solution Onto the surface of Silicon wafers for producing contacts for collection of current generated in the wafers when illuminated (solar cells). The metal ions in the solution is reduced to solid metal, M(s) at the surface of the wafer by applying the negative pole (cathode) ala power supply to the wafer. The positive pole (anode) of the power supply is submerged into the liquid, which in electroplating commonly is referred to as the plating bath or the electrolyte. The anode typically Consists of the same metal that is dissolved in the electrolyte When applying a current through the electrolyte two main reactions occur; one at the anode and one at the cathode: (1) Cathode Reaction: + ne 4 M(s) (2) Anode reaction: M(s) 4 M + Hence, the anode goes into solution into the electrolyte via an oxidation reaction while the same time metal ions are being reduced to solid metal at the cathode.
In the first embodiment the holding devices are made of an insulating material e.g. PP, PVDF or PTFE or other suitable material. Inside the holding devices there are smaller pins of a conductive material e.g. stainless steel or titanium. Those pins are designed in such a way that they act as support to the wafer while at the same time providing an electrical contact to the side of the wafer facing downside towards the bottom of the vessel. The contacting devices could have the shape of needles, balls, rods, discs or any other geometrical dimension that enables a good contact interface and maintaining low mechanical impact on the wafer.
The contacting devices are via a conductive material such as copper connected to the negative terminal of a power supply (cathode). The positive terminal (anode) of the power supply is connected to a piece of metal that is submerged in the liquid vessel that contains the electrolyte. When switching on the power Supply, there will be a circuit Created where the wafer is the cathode (reaction 1).
In this way some relevant metals for solar cell manufacturing, including e.g. Ag, Cu, Sn and Ni, could be deposited in a cost efficient way from aqueous solutions commercially available. The wafer handling system can be designed in such a way that it would not be necessary to change to another transport system ( no new holding device) for each metal that you want to deposit.
it should be mentioned that during the process, metal will deposit on the electrical contacts 20. The metal could be removed physically (for example by means of a brush) or chemically (for example by means of an acid), as previously known.
However, the present invention provides a novel way of improving this. The metal could be removed electrically for example by reversing the current direction or connecting the holding device to a bus bar with a suitable (opposite) potential, for example after the wafer has been removed from the holding device. The electrical contacts 20 would in this case be submerged into a suitable liquid (the same or a second liquid bath). The removal of the metal can then be integrated as part of the process, and consequently the non-productive time for the production equipment will be reduced.
Another embodiment of the invention would be to have a brush-like contacting arrangement 40 (shown in fig. 5) comprising current conducting wires 42 electrically connected to the power supply and in contact with the upper surface of the wafer during transportation. In this way the different areas of the surface of the wafer will be closer to the current conductor. The current conducting wires can be flexible to avoid damage on the wafer. The method is primarily relevant when or if the electrical conductivity of the wafer surface between the two holding devices on the edges is not sufficiently good for edge contacting alone.
Common features The abovernentioned detailed description is especially provided to illustrate and to describe embodiments of the invention. However, the description is by no means limiting the invention to the specific embodiments.
It would of course be possible to change the polarities of the power supply device 34, or to use a alternating current instead of a direct current power source.
In fact, in one application of the invention, it would be possible to use the above described configuration in a first liquid container, and thereafter use the reverse polarity in a second liquid container to remove metal remnants etc.

Claims (26)

  1. I. Device for supplying electrical power to a wafer that is at least partially submerged in a liquid, comprising: -a liquid container filled with the liquid; -a transportation device comprising a wafer carrier device for transporting the wafer at least partially submerged through the liquid; -a power supply device for supplying electrical power to the wafer.
  2. 2. Device according to claim 1, where the wafer carrier device comprises holding devices for holding the wafer.
  3. 3. Device according to claim 2, where the power supply device is electrically Connected to the holding devices.
  4. 4. Device according to claim 3, where a first terminal of the power supply device is connected to the holding device and a second terminal of the power supply device is connected to the liquid.
  5. 5. Device according to claim 2, where the holding devices comprises wedge-shaped grooves for reception of the edge of a wafer.
  6. 6. Device according to claim 5, where the wedge-shaped grooves comprises electrical contacts in electrical connection with the power supply device.
  7. 7. Device according to claim 6, where the electrical contacts are spring-loaded to improve the electrical contact with the wafer.
  8. 8. Device according to claim 2, where the holding devices comprises channels over or under the wedgeshaped grooves, for providing a force to the wafer by means of liquid flowing through the channels.
  9. 9. Device according to claim 2, where the device âirther comprises a system comprising inlets, pumping means, pipings and nozzles, for pumping liquid from the inlets located below the wafers out through to the nozzles located above the wafers, via the pumping means and the pipings.
  10. 10. Device according to claim 1 or 2, wherein the device comprises a brush-like arrangement comprising current conducting wires electrically connected to the power supply for contacting the substantially the fill surface of the wafer.
  11. 11. Device according to claim 1, wherein the device comprises bus bars for providing contact between the wafer and the power supply.
  12. 12. Device according to claim 11, wherein the bus bars can have different voltage potentials for different wafer positions.
  13. 13. Device according to claim 1, wherein the device comprises a second liquid container for providing a reverse-plating process to remove deposited metal.
  14. 14. Method for supplying electrical power to a wafer that is at least partially submerged in a liquid, comprising the following steps: a) fastening the wafer to a wafer carrier device; b) transporting the wafer at least partially submerged through the liquid by means of a transportation device; c) supplying an electrical power to the wafer.
  15. 15. Method according to claim 14, further comprising the step of providing that the wafer carrier device with holding devices for holding the wafer.
  16. 16. Method according to claim 15, further comprising the step of providing that the power supply device is electrically connected to the holding devices.
  17. 17. Method according to claim 14, further comprising the step of providing that a first terminal of the power supply device is connected to the holding device and a second terminal of the power supply device is connected to the liquid.
  18. 18. Method according to claim 15, further comprising the step of providing that the holding devices comprises wedge-shaped grooves for reception of the edge of a wafer.
  19. 19. Method according to claim 18, further comprising the step of providing that the wedge-shaped grooves comprises electrical contacts in electrical connection with the power supply device.
  20. 20. Method according to claim 19, further comprising the step of providing the electrical contacts as spring-loaded electrical contacts to improve the electrical contact with the wafer.
  21. 21. Method according to claim 15, further comprising the step of providing the holding devices with channels over or under the wedge-shaped grooves, for providing a force to the wafer by means of liquid flowing through the channels.
  22. 22. Method according to claim 15, further comprising the step of providing a spraying arrangement for pumping liquid through nozzles directed towards the surface of the wafer.
    S
  23. 23. Method according to claim 14 on 5, further comprising the step of providing a brush-like arrangement comprising current conducting wires electrically connected to the power supply for contacting the substantially the full surface of the wafer.
  24. 24. Method according to claim 1, further comprising the step of providing bus bars for providing contact between the wafer and the power supply.
  25. 25. Method according to claim 11, further comprising the step of providing the bus bars with different voltage potentials for different wafer positions.
  26. 26. Method according to claim 1, further comprising the step of providing a second liquid container for providing a reverse-plating process to remove deposited metal.
GB0719805A 2007-10-10 2007-10-10 Wafer electroplating apparatus Withdrawn GB2453560A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB0719805A GB2453560A (en) 2007-10-10 2007-10-10 Wafer electroplating apparatus
CN200880119132.9A CN101883880B (en) 2007-10-10 2008-10-09 Method and device for supplying electrical power
PCT/NO2008/000359 WO2009048338A1 (en) 2007-10-10 2008-10-09 Method and device for supplying electrical power
DE112008002725T DE112008002725T5 (en) 2007-10-10 2008-10-09 Method and apparatus for supplying electricity
JP2010528823A JP2011500960A (en) 2007-10-10 2008-10-09 Method and apparatus for supplying power
US12/682,473 US20100307926A1 (en) 2007-10-10 2008-10-09 Method and device for supplying electrical power

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0719805A GB2453560A (en) 2007-10-10 2007-10-10 Wafer electroplating apparatus

Publications (2)

Publication Number Publication Date
GB0719805D0 GB0719805D0 (en) 2007-11-21
GB2453560A true GB2453560A (en) 2009-04-15

Family

ID=38787940

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0719805A Withdrawn GB2453560A (en) 2007-10-10 2007-10-10 Wafer electroplating apparatus

Country Status (6)

Country Link
US (1) US20100307926A1 (en)
JP (1) JP2011500960A (en)
CN (1) CN101883880B (en)
DE (1) DE112008002725T5 (en)
GB (1) GB2453560A (en)
WO (1) WO2009048338A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009126043A2 (en) * 2008-04-10 2009-10-15 Rec Solar As Contacting device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63117818A (en) * 1986-10-31 1988-05-21 Showa Electric Wire & Cable Co Ltd Plating device
US5893966A (en) * 1997-07-28 1999-04-13 Micron Technology, Inc. Method and apparatus for continuous processing of semiconductor wafers
US20030010643A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Method of processing wafers and other planar articles within a processing cell

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB709619A (en) 1951-12-14 1954-05-26 Metro Cutanit Ltd Improvements in or relating to securing a steel or other metallic part to another part of hard and difficult to work material, such as a shaft to a turbine wheel
DE3624481A1 (en) * 1986-07-19 1988-01-28 Schering Ag ARRANGEMENT FOR THE ELECTROLYTIC TREATMENT OF PLATE-SHAPED OBJECTS
JP3239534B2 (en) * 1993-04-28 2001-12-17 イビデン株式会社 Plating rack
JPH09195092A (en) * 1996-01-09 1997-07-29 Ibiden Co Ltd Continuous electrolytic device
US6261426B1 (en) * 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
US7022211B2 (en) * 2000-01-31 2006-04-04 Ebara Corporation Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
JP3284496B2 (en) * 2000-08-09 2002-05-20 株式会社荏原製作所 Plating apparatus and plating solution removal method
US20020097562A1 (en) * 2000-12-18 2002-07-25 Tdk Corporation Electronic device and manufacturing same
US6558750B2 (en) * 2001-07-16 2003-05-06 Technic Inc. Method of processing and plating planar articles
JP2004292907A (en) * 2003-03-27 2004-10-21 Fujitsu Ltd Electrolysis device, and method for manufacturing semiconductor device
US7172184B2 (en) * 2003-08-06 2007-02-06 Sunpower Corporation Substrate carrier for electroplating solar cells
DE102004025827B3 (en) * 2004-05-24 2005-06-30 Höllmüller Maschinenbau GmbH Electrical contacting device for circuit board or conductor foil passed through electrolytic cell using contacts alternating with transport rollers along each side edge

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63117818A (en) * 1986-10-31 1988-05-21 Showa Electric Wire & Cable Co Ltd Plating device
US5893966A (en) * 1997-07-28 1999-04-13 Micron Technology, Inc. Method and apparatus for continuous processing of semiconductor wafers
US20030010643A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Method of processing wafers and other planar articles within a processing cell

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009126043A2 (en) * 2008-04-10 2009-10-15 Rec Solar As Contacting device
WO2009126043A3 (en) * 2008-04-10 2009-12-23 Rec Solar As Contacting device

Also Published As

Publication number Publication date
CN101883880B (en) 2012-10-03
DE112008002725T5 (en) 2010-08-26
GB0719805D0 (en) 2007-11-21
US20100307926A1 (en) 2010-12-09
WO2009048338A1 (en) 2009-04-16
JP2011500960A (en) 2011-01-06
CN101883880A (en) 2010-11-10

Similar Documents

Publication Publication Date Title
US6309517B1 (en) Apparatus for inline plating
CN108179450B (en) Microelectronic substrate electrical processing system
US10774437B2 (en) Method and apparatus for electrolytically depositing a deposition metal on a workpiece
US20130025673A1 (en) Solar cells and method for producing same
RU2440444C2 (en) Device and method for electric contact of flat item in continuous action plants
CN217733298U (en) Horizontal electroplating device for battery piece
CN103710734B (en) Process electric deposition device and the method for thin film solar plate
KR20110008214A (en) Method and device for producing solar cells
JP6744646B2 (en) Surface treatment equipment
GB2453560A (en) Wafer electroplating apparatus
JP6737527B2 (en) Surface treatment equipment
EP3080018B1 (en) Transport member for transporting plate-shaped substrates which are to be electrolytically galvanized in a bath, and device for and method of electrolytically galvanizing such substrates
CN212247266U (en) A electrically conductive brush and move back tin equipment for moving back tin equipment
JP6166492B1 (en) Electroplating apparatus and electroplating method
US7922877B2 (en) Method and apparatus for plating a semiconductor package
CN110725001A (en) A move back tin equipment that is used for moving back tin equipment's conductive brush and contains it
CN201276602Y (en) Chip metal convex point electrode electroplating apparatus
CN220746133U (en) Electroplating equipment
KR100792338B1 (en) Electric chemical plating cell
FI115974B (en) Electrical connection of electrolysis pools
CN110725000A (en) A move back tin equipment that is used for moving back tin equipment's conductive brush and contains it
CN117305956A (en) Groove type electroplating equipment
TW201827655A (en) Continuous separator and assembly for such
GB2459124A (en) Wafer holder for electroplating apparatus

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)