GB2425897A - Retention module with EMI suppression - Google Patents

Retention module with EMI suppression Download PDF

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Publication number
GB2425897A
GB2425897A GB0521526A GB0521526A GB2425897A GB 2425897 A GB2425897 A GB 2425897A GB 0521526 A GB0521526 A GB 0521526A GB 0521526 A GB0521526 A GB 0521526A GB 2425897 A GB2425897 A GB 2425897A
Authority
GB
United Kingdom
Prior art keywords
retention
parts
pcb
contacting
grounding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0521526A
Other versions
GB0521526D0 (en
GB2425897B (en
Inventor
Chih-Ming Lai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giga Byte Technology Co Ltd
Original Assignee
Giga Byte Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giga Byte Technology Co Ltd filed Critical Giga Byte Technology Co Ltd
Priority to GB0521526A priority Critical patent/GB2425897B/en
Publication of GB0521526D0 publication Critical patent/GB0521526D0/en
Publication of GB2425897A publication Critical patent/GB2425897A/en
Application granted granted Critical
Publication of GB2425897B publication Critical patent/GB2425897B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A retention module with EMI suppression includes a retention frame 11 disposed on a PCB 2, metallic elastomers 12, a backboard 13 disposed on a bottom of the PCB and grounding elements 14 disposed between the PCB and the backboard. The retention frame is formed with a receiving space 111 for receiving an electronic element, such as a CPU, and connects to the backboard via two fasteners 15. The metallic elastomers have elastic parts 126 and first contacting parts 127. The grounding element has a second contacting part 142 and grounding parts 143. The first and second contacting parts contact conductors 21 formed on the PCB. EMI in the electronic element is guided to a host housing via the metallic elastomer and the grounding element. A heat sink 5 may be received in the retention frame.

Description

RETENTION MODULE WITH EMI SUPPRESSION
The present invention relates in general to a retention arrangement with EMI (electromagnetic interference) suppression, and particularly to a retention arrangement which can conduct away EMI that remains in an electronic element (such as a CPU) and reduces EMI influence on the operation of the electronic element.
Figs 1 to 3 show a prior art retention arrangement
for a CPU. A motherboard 101 has a socket 102 for receiving a Cpu ioo. The motherboard 101 usually has a retention frame 103 mounted on it. The retention frame 103 is a rectangular-shaped frame. The retention frame 103 surrounds the socket 102 and the CPU 100. A backboard 104 is disposed on a bottom surface of the motherboard 101 and is connected with the retention frame 103 via fasteners, such as fixing elements 105. Therefore, the retention frame 103 can be stably fixed onto the motherboard 101. A heatsink 106 and a fan 107 are assembled on the retention frame 103. A bottom surface of the heat sink 106 contacts a top surface of the CPU 100, so that the CPU 100 can conduct heat to the heatsink 106 and utilizes the heat sink 106 and the fan 107 to assist in heat dissipation.
However, the conventional retention frame 103 is disposed around the CPU 100, to protect and shelter the CPU 100. The retention frame 103 does not have any other functions - such as EMI suppression, and the operation of the CPU 100 is avoidably affected. Prior art computers are therefore commonly affected by EMI.
An object of the present invention is to provide a retention module with EMI suppression that protects an electronic element (such as a CPU) from the negative effects of EMI, and solves some of the EMI problems that commonly exist in conventional computers.
The invention is defined in the independent claims.
In one embodiment the present invention provides a retention module with EMI suppression including a retention frame, at least one resilient electrical connector, a backboard and at least one grounding element. The retention frame is disposed on a top surface of the PCB and defines a receiving space. The at least one resilient electrical connector is assembled on the retention frame and has a plurality of resilient parts and a plurality of first contacting parts. The resilient parts extend into the receiving space. The first contacting parts extend beyond a bottom of the retention frame. The backboard is disposed on bottom surface of the PCB. The backboard is connected with the retention frame via a pair of fasteners. The at least one grounding element is disposed between the PCB and the backboard. The grounding element has a second contacting part and a plurality of grounding parts for grounding. The PCB is formed with a plurality of conductors corresponding to the first contacting parts. Each of the first contacting parts contacts a corresponding top of the conductors. Each of the second contacting parts contacts a corresponding bottom of the conductors. Therefore, the resilient electrical connector electrically contacts the grounding elements.
The present invention utilizes the electrical connector and the grounding elements to conduct away any EMI that remains in the electronic element to a host housing, thereby providing a grounding function for the electronic element.
Therefore, the negative influences of EMI are alleviated when the electronic element is operating, and the problems commonly associated with EMI are solved effectively. The preferred embodiments of the present invention, moreover, guide EMI remaining in the electronic element outside from the bottom of the PCB, to more effectively suppress EMI.
Preferred embodiments are described below by way of example only with reference to Figures 1 to 8 of the accompanying drawings, wherein: FIG. 1 is an exploded perspective view of a prior art retention arrangement; FIG. 2 is an assembled perspective view of a prior art retention arrangement; FIG. 3 is a cross-sectional view of the above prior art arrangement; FIG. 4 is an exploded perspective view of a retention arrangement with EMI suppression according to the present invention; FIG. 5 is another exploded perspective view of the above retention arrangement; FIG. 6 is an assembled perspective view of the above retention arrangement; FIG. 7 is a cross-sectional view of the above retention arrangement; and FIG. 8 is an assembled perspective view of the above retention arrangement (without a heat sink and fan) Reference is made to Figs. 4 to 8. The preferred embodiment of the present invention provides a retention arrangement with EMI suppression, and particularly a retention arrangement 1 mounted on a PCB 2 (such as a motherboard) that guides out EMI remaining in an electronic element 3 (such as a CPU) . A socket 4 is mounted on the PCB 2 for receiving the electronic element 3 thereon. A heatsink 5 and a fan 6 are assembled on the socket 4. The heatsink 5 is mounted on the retention arrangement 1 by a clip 7. A bottom surface of the heatsink 5 contacts a top surface of the electronic element 3, so that the electronic element 3 conducts heat to the heatsink 5 and utilizes the heatsink 5 and the fan 6 to assist heat dissipation.
The retention arrangement 1 includes a retention frame 11, at least one resilient electrical connector 12, a backboard 13 and at least one grounding element 14. The retention frame 11 is made of an insulating material, such a as plastics, and is a rectangular-shaped frame that is formed with a receiving space 111 therein. The retention frame 11 is disposed on a top surface of the PCB 2 and surrounds the electronic element 3 and the socket 4. The metallic elastomer 12, the electronic element 3 and the socket 4 are received in the receiving space 111 of the retention frame 11. Two opposite sides of the retention frame 11 are each provided with a connecting hole 112 on a middle portion thereof and a supporting ledge 113 protruding from a bottom edge thereof for supporting the connector 12.
Two opposite sides of the retention frame 11 are also each provided with a protrusion 114 on outside walls thereof for clipping the clip 7 onto the heatsink 5.
The connector 12 is made of a metal with conductivity and elasticity, and there are two such connectors 12 in this embodiment. Each of the connectors 12 has a main part 121, a first fixing arm 122 and a second fixing arm 123. The main part 121 is substantially U-shaped. The first fixing arm 122 extends from an upper portion of the main part 121, and the second fixing arm 123 extends from a lower portion of the main part 121. The first, and second fixing arms 122 and 123 each have a free end that is formed with a through hole 124 and 125 and abut against the top surface and the bottom surface of two sides of the retention frame 11, respectively. The through holes 124 and 125 of the first and second fixing arms 122 and 123 match with the connecting holes 112 of the retention frame 11. The present embodiment uses two fasteners 15 plugging in the through holes 124 and and the connecting holes 112, so that the pair of connectors 12 can be fixed onto two sides of the retention frame 11 by the fixing arms 122 and 123 and the main part 121 can clip onto the sustaining parts 123 of the retention frame 11.
The main part 121 is formed with a plurality of elastic parts 126. The elastic parts 126 are spaced at intervals along the main part 121. In this embodiment, the elastic parts 126 are resilient tabs, which are slanted outwardly from the main part 121 and extended into the receiving space ill for abutting against the bottom of the heatsink 5.
Therefore, the connectors 12 contact the heatsink 5, and any EMI remaining in the electronic element 3 is guided to the connectors 12 via the heatsink 5. Two sides of the main part 121 extend downwardly to respective first contacting parts 127. The PCB 2 is formed with a plurality of conductors 21 corresponding to the first contacting parts 127, so that each of the first contacting parts 127 contacts a corresponding top of the conductors 21. The conductor can be a circuit or a conductive piece communicated from the top surface to the bottom surface of the PCB 2.
The backboard 13 is made of a metal and is a rectangular board. The backboard 13 is disposed on the bottom surface of the PCB 2. Two spigot portions (connecting cylinders) 131 protrude from respective sides of the top surface of the backboard 13, which correspond to two openings 22 formed on the PCB 2 and the two connecting holes 112 of the retention frame 11. Therefore, the present embodiment uses two fasteners (such as screws) 15 for penetrating through the connecting holes 112 of the retention frame 11, the through holes 124 and 125 of the first and second fixing arms 122 and 123 and the openings 22 of the PCB 2. Then, the two connecting cylinders 131 are screwed to fix the backboard 13 to the retention frame 11 by the two fasteners 15, and the retention frame 11 is mounted stably on the PCB 2. The fasteners 15 could be buckles or rivets, etc. The grounding element 14 is also made of a conductive and preferably resilient metallic material. In this embodiment, there are four grounding elements 14, which are disposed on two opposite sides of an insulating piece 16.
The insulating piece 16 is disposed between the PCB 2 and the backboard 13. The grounding elements 14 each have a fixing part 141, a second contacting part 142 and a grounding part 143. The fixing part 141 is fixed on the insulating piece 16. The second contacting part 142 extends from a top edge of the fixing part 141 and extends beyond a top surface of the insulating piece 16. The second contacting part 142 corresponds to the conductors 21 of the PCB 2, so that it contacts a corresponding bottom end of the conductors 21. Therefore, the grounding element 14 contacts the connectors 12 via the conductors 21. The grounding part 143 extends downwardly from a side of the fixing part 141, and extends beyond a bottom surface of the backboard 13 for contacting a host housing (not shown) . Therefore, any remaining EMI in the electronic element 3 is guided downwardly to the host housing via the heatsink 5, the connectors 12, the conductors 21 of the PCB 2 and the grounding elements 14 in that order. A retention arrangement with EMI suppression is thereby provided.
The above embodiment utilizes the connectors 12 and the grounding elements 14 to transmit EMI remaining in the electronic element 3 to the host housing, and accomplish the function of grounding. Therefore, the influence of EMI is prevented from affecting the operation of the electronic element 3 when it is operating. It thereby effectively overcomes the problems that commonly exist in computers caused by EMI. This embodiment moreover, guides EMI remaining in the electronic element 3 outside from the bottom of the PCB 2, so that it more effectively suppresses EMI.
Although the present invention has been described with reference to the preferred embodiments thereof, it will be understood that the invention it not limited to the details thereof.

Claims (10)

  1. CLJIMS: 1. A retention arrangement with EMI suppression, assembled on a
    PCB, comprising: a retention frame, disposed on a top surface of said PCB and defining a receiving space; at least one resilient electrical connector mounted on said retention frame, said electrical connector being provided with a plurality of resilient parts and a plurality of first contacting parts, said resilient parts extending into said receiving space, said first contacting parts extending below said retention frame; a backboard disposed on a bottom surface of said PCE, said backboard being connected with said retention frame via a pair of fasteners; at least one grounding element disposed between said P03 and said backboard, said grounding element having a second contacting part and a plurality of grounding parts for grounding, wherein said P03 has a plurality of conductors corresponding to said first contacting parts, each of said first contacting parts contacting the top of a corresponding one of said conductors, and each of said second contacting parts contacting the bottom of a corresponding one of said conductors, whereby in use said electrical connector makes a grounding connection with said at least one grounding element.
  2. 2. A retention arrangement according to claim 1, wherein said retention frame is formed with a pair of supporting parts on two opposite lower edges thereof, and said retention arrangement includes two such electrical connectors, each of said electrical connectors having a main part clipped onto a respective one of said supporting parts, said resilient parts of said electrical connectors being formed on said main parts.
  3. 3. A retention arrangement as claimed in claim 1, wherein said retention arrangement has a pair of such electrical connectors, each of said electrical connectors having a first fixing arm extended upwardly therefrom and a second fixing arm extended downwardly therefrom, each of said first and second fixing arms having a free end formed with a through hole, said fixing arms abutting against a top surface and a bottom surface respectively of either side of the retention frame, the backboard has spigot portions protruding from a top surface thereof, connecting holes are formed in the retention frame and openings are formed in the PCB, and wherein said fasteners are inserted into said connecting holes of said retention holes, said through holes of said fixing arms and said openings of said PCB and secured in said spigot portions.
  4. 4. A retention arrangement according to any preceding claim wherein said resilient parts are outwardly slanted tabs.
  5. 5. A retention arrangement according to any preceding claim, further comprising an insulating piece disposed between said PCB and said backboard, said grounding element having a fixing part fixed on said insulating piece, and said second contacting part being formed on a top edge of said fixing part and protruding beyond a top surface of said insulating piece.
  6. 6. A retention arrangement according to any preceding claim, wherein said grounding parts of the grounding element contact a host housing.
  7. 7. A retention arrangement according to any preceding claim, wherein said PCB is provided with a socket in which an electronic element is received, a heatsink is mounted on a top surface of said electronic element, said heatsink has a bottom surface contacting a top surface of said electronic element, and said resilient parts of said electrical connector abut against said heatsink.
  8. 8. A retention arrangement for retaining a heatsink on an electronic component of a PCB, the retention arrangement including a resilient electrical connector which in use is grounded and contacts the heatsink.
  9. 9. A retention arrangement according to claim 8 wherein said resilient electrical connector extends between said heatsink and grounded conductors extending from an upper side to an under side of said PCB.
  10. 10. A circuit arrangement comprising a retention arrangement as claimed in any preceding claim in combination with a CPU and heatsink in thermal contact. * *. * S S S... S... * * *5*S S. * . * S.. S.. S. * * * S..
    S
    *0SIS*
    S
    10. A retention arrangement substantially as described hereinabove with reference to Figures 4 to 8 of the accompanying drawings.
    11. A circuit arrangement comprising a retention arrangement as claimed in any preceding claim in combination with a Cpu in thermal contact with said heatsink.
    Amendments to the claims CLAIMS: 1. A retention arrangement with EMI suppression, assembled on a PCB, comprising: a retention frame, disposed on a top surface of said PCB and defining a receiving space for a heatsink; at least one resilient electrical connector mounted on said retention frame, said electrical connector being provided with a plurality of resilient parts extending into said receiving space for contacting said heatsink and being provided with a plurality of first contacting parts extending below said retention frame; a backboard disposed on a bottom surface of said PCB, and connected to said retention frame; and at least one grounding element disposed between said PCB and said backboard and arranged in use to make a grounding connectidn with said resilient electrical connector through said PCB.
    2. A retention arrangement according to claim 1 wherein said grounding element has a second contacting part * I. and a plurality of grounding parts for grounding; and **** S. said PCB has a plurality of conductors corresponding to said first contacting parts, each of said first contacting * parts contacting the top of a corresponding one of said S..
    * 25 conductors, and each of said second contacting parts contacting the bottom of a corresponding one of said conductors.
    S.....
    3. A retention arrangement according to claim 1 or claim 2, wherein said retention frame is formed with a pair of supporting parts on two opposite lower edges thereof, and said retention arrangement includes two such electrical connectors, each of said electrical connectors having a main part clipped onto a respective one of said supporting parts, said resilient parts of said electrical connectors being formed on said main parts.
    4. A retention arrangement as claimed in claim 1, wherein said retention arrangement has a pair of such electrical connectors, each of said electrical connectors having a first fixing arm extended upwardly therefrom and a second fixing arm extended downwardly therefrom, each of said first and second fixing arms having a free end formed with a through hole, said fixing arms abutting against a top surface and a bottom surface respectively of either side of the retention frame, the backboard has spigot portions protruding from a top surface thereof, connecting holes are formed in the retention frame and openings are formed in the PCB, and wherein fasteners are inserted into said connecting holes of said retention holes, said through holes of said fixing arms and said openings of said PCB and secured in said spigot portions to secure said backboard to said retention frame.
    5. A retention arrangement according to any preceding claim wherein said resilient parts are outwardly slanted tabs. * .. * * S 0*55
    5.55 6. A retention arrangement according to any preceding S...
    claim, further comprising an insulating piece disposed :. between said PCB and said backboard, said grounding element * S..
    * having a fixing part fixed on said insulating piece, and *SS said second contacting part being formed on a top edge of said fixing part and protruding beyond a top surface of said insulating piece.
    *..... S *
    7. A retention arrangement according to any preceding claim, wherein said grounding parts of the grounding element contact a host housing.
    8. A reter.J:ion arrangement according to any preceding claim, wherein said PCB is provided with a socket in which an electronic element is received, a heatsink is mounted on a top surface of said electronic element, said heatsink has a bottom surface contacting a top surface of said electronic element, and said resilient parts of said electrical connector abut against said heatsink.
    9. A retention arrangement substantially as described hereinabove with reference to Figures 4 to 8 of the accompanying drawings.
GB0521526A 2005-10-21 2005-10-21 Retention module with EMI suppression Expired - Fee Related GB2425897B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0521526A GB2425897B (en) 2005-10-21 2005-10-21 Retention module with EMI suppression

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0521526A GB2425897B (en) 2005-10-21 2005-10-21 Retention module with EMI suppression

Publications (3)

Publication Number Publication Date
GB0521526D0 GB0521526D0 (en) 2005-11-30
GB2425897A true GB2425897A (en) 2006-11-08
GB2425897B GB2425897B (en) 2007-06-13

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Family Applications (1)

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GB0521526A Expired - Fee Related GB2425897B (en) 2005-10-21 2005-10-21 Retention module with EMI suppression

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103855543A (en) * 2012-12-05 2014-06-11 莫列斯公司 Shielding cage and receptacle assembly

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6205026B1 (en) * 2000-01-31 2001-03-20 Intel Corporation Heat sink retention components and system
US6346672B1 (en) * 2000-07-03 2002-02-12 Chin Fu Horng Structure for preventing electromagnetic interference of central processing unit
US20030133248A1 (en) * 2002-01-08 2003-07-17 Asia Vital Components Co., Ltd. Structure for eliminating electromagnetic interference caused by central processing unit
US20040132331A1 (en) * 2003-01-07 2004-07-08 Osborn Jay Kevin Support and grounding structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6205026B1 (en) * 2000-01-31 2001-03-20 Intel Corporation Heat sink retention components and system
US6346672B1 (en) * 2000-07-03 2002-02-12 Chin Fu Horng Structure for preventing electromagnetic interference of central processing unit
US20030133248A1 (en) * 2002-01-08 2003-07-17 Asia Vital Components Co., Ltd. Structure for eliminating electromagnetic interference caused by central processing unit
US20040132331A1 (en) * 2003-01-07 2004-07-08 Osborn Jay Kevin Support and grounding structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103855543A (en) * 2012-12-05 2014-06-11 莫列斯公司 Shielding cage and receptacle assembly

Also Published As

Publication number Publication date
GB0521526D0 (en) 2005-11-30
GB2425897B (en) 2007-06-13

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PCNP Patent ceased through non-payment of renewal fee

Effective date: 20151021