GB2409346A - Stacked memory card - Google Patents

Stacked memory card Download PDF

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Publication number
GB2409346A
GB2409346A GB0329027A GB0329027A GB2409346A GB 2409346 A GB2409346 A GB 2409346A GB 0329027 A GB0329027 A GB 0329027A GB 0329027 A GB0329027 A GB 0329027A GB 2409346 A GB2409346 A GB 2409346A
Authority
GB
United Kingdom
Prior art keywords
memory card
substrate
heat sink
filled
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0329027A
Other versions
GB0329027D0 (en
Inventor
Jackson Hsieh
Jichen Wu
Abnet Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kingpak Technology Inc
Original Assignee
Kingpak Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE20319185U priority Critical patent/DE20319185U1/en
Application filed by Kingpak Technology Inc filed Critical Kingpak Technology Inc
Priority to GB0329027A priority patent/GB2409346A/en
Publication of GB0329027D0 publication Critical patent/GB0329027D0/en
Publication of GB2409346A publication Critical patent/GB2409346A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1094—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/043—Stacked PCBs with their backs attached to each other without electrical connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Credit Cards Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A stacked memory card comprises an upper memory card 20 and a lower memory card 22. The upper memory card and the lower memory card each comprise a heat sink 28, 50, at least one memory chip 26, 48 encapsulated by a glue layer 30, 52, a plurality of gold fingers 38, 60 in electrical contact with contacts 36, 58 and through holes 40, 62 filled with metal 42, 64. The heat sinks are stacked against each other. The gold fingers are used to connect the memory card to an electric device.

Description

STACKED SMALL MEMORY CARD
BACKGROUND OF THE INVENTION
Field of the invention
The present invention relates to a stacked small memory card, and in particular to a stacked small memory card that has a long lifetime and high durability.
Description of the Related Art
The prior method for producing a general memory card always packs chips to single integrated circuit, then mounts the IC onto a printed circuit board by the way of surface mount technique (SMT). The chip may be a memory element, such (Qlvi) as flash,memory. The golden fingers mounted on the printed circuit board for inserting into a slot of a computer main- board. In addition to some passive elements such as resistance, capacitor and inductor are mounted on the memory card.
Referring to FIG I showing a side schematic illustrate of a prior memory card, the golden finger 15 is used to insert into a slot of a computer main-board, there are active elements and passive elements on the module card, the active elements usually are packed to an integrated circuit 11. Each integrated circuit 11 encapsulates a chip 12, the chip 12 may be a memory chip, for example a flash memory chip. The pins 13 of integrated circuit 11 are mounted on the printed circuit board 14 of the memory card by SMT, the printed circuit board 14 has a solder point 17 connected to pin 13. The prior arts has the following disadvantages: A chip 12 must be packed then mounted on the circuit board 14, so more steps is unnecessary leads to the cost in manufacturing and packing will be increased.
A memory card always includes many ICs so that the integrated circuit 11 must be mounted on the PCB 14 one by one during manufacturing the module card.
The cost of SMT is expensive. Special manufacture devices such as a SMT machine and a solder furnace will extra the cost of equipment.
The memory card is manufactured separately so that the throughput is low.
As a result of integrated circuit 11 cannot be dispersed heat effectively, therefore the quality and durability of the small memory card is not excellent.
SUMMARY OF THE INVENTION
The object of the present invention is to provide a stacked small memory card may be manufactured conveniently, the manufacturing processes may be simplified and the manufacturing cost may decreased.
Another object of the present invention is to provide a stacked small memory card having high function of disperse heat to promote its durability and lifetime effectively.
To achieve the above-mentioned object, the present invention includes an upper memory card, and a lower memory card, the upper memory card includes a first substrate, at least one memory chip, a first heat sink, and a first glue layer.
The first substrate has an upper surface and a lower surface, the upper surface is formed with a plurality of the connected points and a plurality of golden fingers are electrically connected the plurality of connected points, and a plurality of the through holes, which filled with metal, penetrate the upper surface to the lower surface, the memory chip, that is mounted on the first substrate, electrically connected to the connected points of the first substrate, the first heat sink, which is mounted on the lower surface of the first substrate, contacted with the metal, which is filled within the through holes, the first glue layer is coated the memory chip, the upper memory card is arranged in the electric device, so that the golden finger of the first substrate may be electrically connected to the electric device, the lower memory card includes a second substrate, at least one memory chips, a second heat sink, and a second glue layer, the second substrate has an upper surface and a lower surface, the lower surface is formed with a plurality of connected points and a plurality of golden fingers electrically connected the plurality of connected points and a plurality of through holes, which filled with metal, penetrate upper surface to lower surface, the memory chip, that is mounted on the lower surface of the second substrate, electrically connect the connected points of the second substrate, the second heat sink, which is mounted on the upper surface of the second substrate, contacted with the metal, which is filled within the through holes, the second glue layer is coated on the memory chip, the upper memory card is used to set in an electric device to make the golden finger of the second substrate electrically connect to the electric device, the first heat sink of the upper memory card is mounted on the second heat sink of the lower memory card.
According to one aspect of the present invention, the heat from the memory chip of the upper memory chip and the bottom memory chip may be traveled to the heat sink via the metal, which are filled within the plurality of through holes.
Therefore, promoting the durability and dependability of the small memory card.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG I is a schematic illustrate showing a conventional small memory card 1 0 structure.
FIG 2 is the first schematic illustrates showing a stacked small memory card structure of the present invention.
FIG 3 is the second schematic illustrates showing a stacked small memory card structure of the present invention.
15DETAILED DESCRIPTION OF THE INVENTION
FIG2, and FIG3 are the schematic illustrates showing a stacked small memory card structure of the present invention, which include a upper memory card 20 and a lower memory card.
The upper memory card 20 includes a first substrate 24, at least one 20memory chip 26, a first heat sink 28, and a first glue layer 30, the first substrate 24 has an upper surface 32 and a lower surface 34, the upper surface 32 has a plurality of connected points 36, and a plurality of golden fingers 38 electrically connected with the plurality of connected points36, and a plurality of through holes 40, which filled with metal 42, penetrate the upper surface 32 to the lower surface 34, the metal 42 may be cooper, the memory chip 26 is mounted on the upper surface 32 of the first substrate 24, and a plurality of wires 44 electrically connected to the connected points 36 of the first substrate 24, the first heat sink 28, which may be cooper or aluminum, is mounted on the lower surface 34 of the first substrate 24 and contacted with the metal 42, which filled within the through holes 40, the first glue layer 30 coated the memory chip 26, the upper memory card 20 is used to arrange in an electric device, so that, the golden fingers 38 of the first substrate 24 may be electrically connected to the electric device.
The lower memory card 22 includes a second substrate 46, at least one memory chip 48, a second heat sink 50, and a second glue layer 52, the second substrate 46 has an upper surface 54 and a lower surface 56, the lower surface 56 formed with a plurality of connected points 58, and a plurality of golden fingers connected electrically to connected points 58, and a plurality of through holes 62, which filled with cooper metal 64, penetrate the upper surface 54 to the lower surface 56, the memory chip 48, which is mounted on the lower surface 56 of the second substrate 46, and the plurality of wires 66 electrically connected to the connected points of the second substrate, the second heat sink 50 is made of copper or aluminum, is mounted on the upper surface 54 of the second substrate and contacted with the metal 64, which filled within the through holes 62, the s second glue layer 52 coated the memory chip 48, the lower memory card 22 is used to arrange in the electric device, so that, the golden fingers 60 of the second substrate 46 may be electrically connected to the electric device, the first heat sink 28 of the top memory card 20 is packed on the second heat sink 50 of the bottom memory card 22.
Therefore, the packed small memory card of the present invention has the following advantages: Since the heat of the upper memory chip 26 of the upper memory card 20 may be traveled to the first heat sink 28 via the metal 42, which is filled within the through hole 40 of the first substrate 24, the heat can be rapidly spread out through first heat sink 28, and the heat of the memory chip 48 of the lower memory card 22 may be traveled to the second heat sink 50 via the metal 64 which is filled within the through hole 62 of the second substrate 46, the heat can be rapidly spread out through second heat sink 50, so that, proving the durability and dependability of the small memory card.
Since the upper memory chip 26 is arranged on the upper surface 32 of the first substrate 24, and the lower memory chip 48 is arranged on the lower surface 56 of the second substrate 46, then, the first glue layer 30 and the second glue layer 52 packed every upper memory chips 26 and every lower memory chips 48.
So as to the manufacturing processes can be simplified, and the manufacturing costs also can be lowered.
While the invention has been described by way of an example and in terms of a preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiment. To the contrary, it is intended to cover various modifications. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications.

Claims (7)

  1. WHAT IS CLAIMED IS: 1. A stacked small memory card to be set in an
    electric device, comprising: A upper memory card includes a first substrate, at least one memory chip, a first heat sink, and a first glue layer, the first substrate formed with an upper surface and a lower surface, the upper surface formed with a plurality of connected points, a plurality of golden fingers electrically connected to the plurality of connected points and a plurality of the through holes, which filled with metal, penetrated the upper surface to the lower surface, at least one memory chip, each of which is mounted on the upper surface of the first substrate, electrically connected to the connected points of the first substrate, the first heat sink, which is mounted on the lower surface of the first substrate, contacted with the metal, which is filled within the through holes, the first glue layer coated the memory chip, the top memory card is used to arranged in the electric device, so that, the golden fingers may be electrically connected to the electric device; and A lower memory card includes a second substrate, at least one memory chip, a second heat sink, and a second glue layer, the second substrate formed with an upper surface and a lower surface, the lower surface formed with a plurality of connected points, a plurality of golden fingers electrically connected to the connected points and a plurality of through holes, which filled with metal, penetrated the upper surface to the lower surface, the memory chip, which is mounted on the lower surface of the second substrate, electrically connected to the connected points of the second substrate, the second heat sink being mounted on the upper surface of the second substrate, contacted with the metal, which is filled within the through holes, the second glue layer coated the memory chip, which is used to arrange in the electric device, so that, the golden fingers of the second substrate may be electrically connected to the electric device, the first heat sink of the top memory card being mounted on the second heat sink of the bottom memory card.
  2. 2. The stacked small memory card according to claim 1, wherein the memory chip of the top memory card electrically connects to the plurality of the connected points of the first substrate via a plurality of wires.
  3. 3. The stacked small memory card according to claim 1, wherein the metal is filled within the each of through holes of the first substrate is copper.
  4. 4. The stacked small memory card according to claim 1, wherein the first heat sink is made of copper or aluminum.
  5. 5. The stacked small memory card according to claim 1, wherein the memory chip of the bottom memory card electrically connects to the connected points of the second substrate via a plurality of wires.
  6. 6. The stacked small memory card according to claim 1, wherein the metal, which is filled within the though holes of the second substrate, is cooper.
  7. 7. The stacked small memory card according to claim 1, wherein the second heat sink may be cooper or aluminum.
GB0329027A 2003-12-10 2003-12-15 Stacked memory card Withdrawn GB2409346A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE20319185U DE20319185U1 (en) 2003-12-10 2003-12-10 Small stack memory card
GB0329027A GB2409346A (en) 2003-12-10 2003-12-15 Stacked memory card

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE20319185U DE20319185U1 (en) 2003-12-10 2003-12-10 Small stack memory card
GB0329027A GB2409346A (en) 2003-12-10 2003-12-15 Stacked memory card

Publications (2)

Publication Number Publication Date
GB0329027D0 GB0329027D0 (en) 2004-01-14
GB2409346A true GB2409346A (en) 2005-06-22

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ID=34796591

Family Applications (1)

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GB0329027A Withdrawn GB2409346A (en) 2003-12-10 2003-12-15 Stacked memory card

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DE (1) DE20319185U1 (en)
GB (1) GB2409346A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106292961A (en) * 2016-08-17 2017-01-04 陈玮彤 A kind of memory bar radiator structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5563773A (en) * 1991-11-15 1996-10-08 Kabushiki Kaisha Toshiba Semiconductor module having multiple insulation and wiring layers
TW523719B (en) * 2000-02-29 2003-03-11 Kingpak Tech Inc Production method of modular card
JP2003282820A (en) * 2003-04-24 2003-10-03 Rohm Co Ltd Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5563773A (en) * 1991-11-15 1996-10-08 Kabushiki Kaisha Toshiba Semiconductor module having multiple insulation and wiring layers
TW523719B (en) * 2000-02-29 2003-03-11 Kingpak Tech Inc Production method of modular card
JP2003282820A (en) * 2003-04-24 2003-10-03 Rohm Co Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106292961A (en) * 2016-08-17 2017-01-04 陈玮彤 A kind of memory bar radiator structure

Also Published As

Publication number Publication date
GB0329027D0 (en) 2004-01-14
DE20319185U1 (en) 2004-03-11

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