GB2390227A - Heat sink retaining clip with several retaining holes - Google Patents
Heat sink retaining clip with several retaining holes Download PDFInfo
- Publication number
- GB2390227A GB2390227A GB0307359A GB0307359A GB2390227A GB 2390227 A GB2390227 A GB 2390227A GB 0307359 A GB0307359 A GB 0307359A GB 0307359 A GB0307359 A GB 0307359A GB 2390227 A GB2390227 A GB 2390227A
- Authority
- GB
- United Kingdom
- Prior art keywords
- engaging
- cpu
- frame
- sink
- juts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat sink retaining clip 2 for a CPU with a zero insertion force (ZIF) socket A has at least one connecting plate 23 to press the heat sink 1 against the CPU, and an engaging plate 21 at each end. Both engaging plates have a plurality of holes 22 which correspond to projections A1 on the CPU socket, and engage with them to hold the heat sink and CPU tightly in the socket. The connecting bars 23 may incline downwards towards the centre, to provide the engaging force. A holding clip 3 may be provided perpendicular to the connecting bars and pressing against them, which is U shaped and retained between heat sink fins. One of the engaging plates may extend upwards to provide a lever 24 to assist engagement / disengagement of the clip 2.
Description
CPU RADIATOR
BACKGROUND OF 1HE INVENTION
1. Field of the Invention:
The present invention relates to a CPU radiator.
5 2. Description of Related Art:
The computer has been used everywhere and the development of the computer makes the capacity thereof larger, the running speed thereof faster and the functions thereof stronger incessantly due to all industries' effort. The CPU being promoted contributes indelible merits.
10 In fact, every computer at least has a CPU and the function of CPU plays an important role for the effectiveness of the computer. It is why the manufacture conducts reach and development to intensify the function of the computer such that it makes the computer possible to meet the need of the users.
However, high heat usually generates during electronic components running in 15 a state of high speed so that CPU is incapable of exempting from the problem of high heat generation.
The conventional CPU heat dissipation is mostly performed by way of a sink being added on top of the CPU with a plurality of cooling fins on the sink such that the heat can be guided to the cooling fins via conduction due to the bottom of sink 20 contacting with the CPU and then the heat can be radiated and drawn out by the cooling fan. Of course, another way such as a lateral auxiliary heat dissipation can be utilized. But, basically, the currently used way with which the heat discharge is done above the CPU is typical and probably it can be thought as a standard way of heat dissipation for the CPU.
( Although the typical way can obtain the basic need and it is probably all right for old type CPU, the deficiency is in that in case of the sink at the lateral side thereof being attached with an auxiliary cooling device, the center of gravity may deviated such that a clearance between the sink and the CPU may create to result in 5 incomplete fight contact. Besides, two objects are not possible to contact to each other well without the aid of constant engagement with powerful fasteners. Moreover, it has to be helped by tools or joining components such as screws while assembling or disassembling work is conducted so that it is not convenient after all.
SUMMARY OF THE INVENTION
10 The crux of the present invention is to provide a CPU radiator, especially referring to a CPU radiator with a zero exertion force CPU frame, includes a sink and a retainer. The sink made of heat conduction metal provides multiple spaced cooling fins at the upper portion thereof and at least a positioning groove corresponding to engaging juts extending outward from two opposite lateral sides of the zero input 15 force CPL) frame. The retainer with an engaging plate at two lateral sides thereof respectively has at least a connecting bar corresponding to the positioning groove with two ends thereof being joined to the respective engaging plate and multiple engaging holes is provided at the respective engaging plate and correspond to the engaging juts of the zero input force CPU frame. The sink is placed on the zero input 20 force CPU frame and the retainer at the engaging plates thereof engages with the zero input force CPU frame by way of He engaging holes being engaged by the engaging juts and at the connecting bar thereof is received in the positioning groove such that the sink is joined to the zero input force CPU frame tightly.
BRIEF DESCRIPTION OF THE DRAWINGS
25 The present invention can be more fully understood by reference to the following description and accompanying drawings, in which:
Fig. 1 is a disassembled view of a CPU radiator of the present invention; and Fig. 2 is a front view of the CPU radiator shown in Fig. 1 after assembling.
DETAILED DESCRIPTION OF 1HE PREFERRED EMBODIMENT
Referring to Figs. 1 and 2, a CPU radiator of the present invention includes a 5 sink 1, a retainer 2 and a K7 type zero input force CPU frame A. The sink 1 can be engaged to the CPU frame A with the retainer 2 and a strap 3 can be utilized for fixedly positioning the sink 1.
Wherein, the CPIJ frame A is conventional with a standard specification, that is,
it is the so-called zero input force frame such that the CPU can be located in a preset 10 hole at me center of the frame A by way of operating a lateral push lever. The frame A at both lateral sides thereof extends a plurality of engaging juts A1 and these are belonged to prior art so that no detail will be explained further.
The sink 1 is made of heat conductive metal and the bottom thereof can contact with the CPU after assembling so that the bottom has a flat surface. In order 15 to facilitate radiation and guide the heat out wim a fan, a plurality of upright spaced cooling fins 11 are disposed above the sink 1. Besides, in order to accommodate the retainer 2, the cooing fins 11 are provided with at least a straight downward positioning groove 12 from top corresponding to the engaging juts A1. It can be seen in Fig. 1 that three sets of positioning grooves 12 are provided. Nevertheless, one, 20 two or more sets of engaging grooves also can be arranged instead and it has been mentioned that the locations of the engaging grooves are corresponding to the engaging juts A1. Meanwhile, in order to receive the strap 3, a holding groove 13 is provided all the way down from the top of the cooling fin 11 perpendicular to the engaging grooves 12 at the central area thereof the cooling fins 11.
25 The retainer 2 is made of heat conductive metal and it is preferable that the
( retainer 2 is formed by way of integrally stamping. The retainer 2 at both lateral sides thereof has an engaging plate 21 respectively and the respective engaging plate 21 is provided with engaging holes 22 corresponding to the engaging juts A1 with the number of engaging holes 22 identical with or less than that of the engaging juts A1.
S Meanwhile, at least one connecting bar 23 is provided to join the two engaging plates 21 and the connecting bar 23 inclines downward from two ends to the center thereof.
There are two connecting bars 23 illustrated in the preferred embodiment and it is noted that single or multiple connecting bars can be arranged and the number of connecting bars 23 is preferably identical with the number of engaging grooves 12.
10 Meanwhile, in order to facilitate operation, one of the engaging plates 21 at the top thereof may extend a section of turn plate 24 as a position of force exertion.
The strap 3 is made of heat Conduction metal with a curved cross section. The strap 3 has a length corresponding to the holding groove 13 and a width a little greater than the width of the holding groove 13. In practice, the strap 3 has a flexibility 15 or can elastically stretch outward during being exerted a force.
With reference to Figs. 1 and 2 again, while in use, the sink 1 is placed on the CPU frame A on which a CPU is and then the engaging holes 22 at a lateral side of the retainer 22 engage with engaging juts preset on the CPU frame A with the connecting bar 22 being received in the positioning groove 12. The engaging holes 22 20 of the retainer 2 at another lateral side thereof also engage with engaging juts A1 by way of the flexibility of me material itself. In this way, the fastening job of retainer 2 is completed. Right at this time, the strap 3 can be inserted into the engaging groove 13 and squeezed downward with the open side thereof facing upward to press the center lower portion such that a further press can be exerted to prevent from loosening.
25 When the retainer is to be disengaged, the strap 3 is held from top such that the strap 3 is taken out under a condition of being pressed inward. Then, press down and turn inward the turn plate 24 such that the engaging holes 22 at the same lateral
( side is detached from the engaging juts A1. As a result, the other lateral side can be detached too.
It is appreciated that the CPU radiator of the present invention is capable of having the sink 1 tightly contacting with the CPU completely with less labors or tools.
5 Hence, it is helpful that the heat can be guided out continuously and the CPU can keep contact with the sink even if the center of the gravity of the entire radiator deviates due to an auxiliary heat dissipation device being mounted to the sink. These advantages are not possible to be reached with the prior art.
While the invention has been described with reference to a preferred 10 embodiment thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the appended claims.
Claims (5)
1. A CPU radiator, especially referring to a CPU radiator with a zero exertion force CPU frame, comprising: a sink, being made of heat conduction metal, providing a plurality of spaced 5 cooling fins at an upper portion thereof and providing at least a positioning groove corresponding to engaging juts extending outward from two opposite lateral sides of the zero input force CPU frame; and a retainer, having an engaging plate at two lateral sides thereof respectively, having at least a connecting bar corresponding to the positioning groove with two 10 ends thereof being joined to me respective engaging plate and a plurality of engaging holes being provided at the respective engaging plate and corresponding to the engaging juts of the zero input force CPU frame; whereby, the sink is placed on the zero input force CPU frame and the retainer at the engaging plates thereof engages with the zero input force CPU frame by way of 15 the engaging holes being engaged by the engaging juts and at the connecting bar thereof is received in the positioning groove such that the sink is joined to the zero input force CPIJ frame tightly.
2. The CPU radiator as defined in claim 1, wherein three positioning grooves are arranged with corresponding to a pair of engaging juts, which are opposite to 20 each other and two connecting bars are arranged optionally.
3. The CPU radiator as defined in claim 1, wherein the connecting bar has a shape of inclining downward to a center thereof from both end thereof.
4. The CPU radiator as defined in claim 1, wherein the sink further provides a holding groove approximately perpendicular to the positioning groove for 25 accommodating a strap, which is integrally formed to have a bend shape with an open side, to press against the connecting bar in a way of the open end facing
l upward.
5. The CPU radiator as defined in claim 1, wherein one of the engaging plates at a top thereof may extend a turn plate.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91209840U TW537438U (en) | 2002-06-28 | 2002-06-28 | CPU heat dissipating device |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0307359D0 GB0307359D0 (en) | 2003-05-07 |
GB2390227A true GB2390227A (en) | 2003-12-31 |
GB2390227B GB2390227B (en) | 2005-12-07 |
Family
ID=21688573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0307359A Expired - Fee Related GB2390227B (en) | 2002-06-28 | 2003-03-28 | CPU radiator |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3096939U (en) |
DE (1) | DE20304779U1 (en) |
FR (1) | FR2841664B3 (en) |
GB (1) | GB2390227B (en) |
TW (1) | TW537438U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7478667B2 (en) * | 2005-10-21 | 2009-01-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink clip and assembly |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2601565Y2 (en) * | 1993-02-26 | 1999-11-22 | 株式会社村上開明堂 | Electric retractable door mirror |
CN115394732B (en) * | 2022-05-30 | 2023-09-05 | 安世半导体科技(上海)有限公司 | Power semiconductor module and method for assembling the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2283781A (en) * | 1993-11-15 | 1995-05-17 | Thermalloy Inc | Spring clamp assembly with electrically insulating shoe |
US6115253A (en) * | 1994-04-05 | 2000-09-05 | Thermalloy, Inc. | Strap spring for heat sink clip assembly |
US6295203B1 (en) * | 2000-04-05 | 2001-09-25 | Foxconn Precision Components Co., Ltd. | Heat sink clip assembly |
US6466445B1 (en) * | 2001-04-27 | 2002-10-15 | Foxconn Precision Components Co., Ltd. | Clip for heat sink |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5208731A (en) * | 1992-01-17 | 1993-05-04 | International Electronic Research Corporation | Heat dissipating assembly |
TW477515U (en) * | 2000-05-19 | 2002-02-21 | Yau-Huei Lai | Improved heat sink holding device |
-
2002
- 2002-06-28 TW TW91209840U patent/TW537438U/en not_active IP Right Cessation
-
2003
- 2003-03-25 DE DE20304779U patent/DE20304779U1/en not_active Expired - Lifetime
- 2003-03-28 GB GB0307359A patent/GB2390227B/en not_active Expired - Fee Related
- 2003-04-04 JP JP2003001827U patent/JP3096939U/en not_active Expired - Fee Related
- 2003-04-18 FR FR0304856A patent/FR2841664B3/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2283781A (en) * | 1993-11-15 | 1995-05-17 | Thermalloy Inc | Spring clamp assembly with electrically insulating shoe |
US6115253A (en) * | 1994-04-05 | 2000-09-05 | Thermalloy, Inc. | Strap spring for heat sink clip assembly |
US6295203B1 (en) * | 2000-04-05 | 2001-09-25 | Foxconn Precision Components Co., Ltd. | Heat sink clip assembly |
US6466445B1 (en) * | 2001-04-27 | 2002-10-15 | Foxconn Precision Components Co., Ltd. | Clip for heat sink |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7478667B2 (en) * | 2005-10-21 | 2009-01-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink clip and assembly |
Also Published As
Publication number | Publication date |
---|---|
FR2841664A3 (en) | 2004-01-02 |
GB0307359D0 (en) | 2003-05-07 |
JP3096939U (en) | 2004-01-08 |
TW537438U (en) | 2003-06-11 |
GB2390227B (en) | 2005-12-07 |
FR2841664B3 (en) | 2004-05-14 |
DE20304779U1 (en) | 2003-08-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20100328 |