GB2387025A - LED and laser diode array cooling - Google Patents

LED and laser diode array cooling Download PDF

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Publication number
GB2387025A
GB2387025A GB0207176A GB0207176A GB2387025A GB 2387025 A GB2387025 A GB 2387025A GB 0207176 A GB0207176 A GB 0207176A GB 0207176 A GB0207176 A GB 0207176A GB 2387025 A GB2387025 A GB 2387025A
Authority
GB
United Kingdom
Prior art keywords
light source
heat
cooling
thermoelectric
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0207176A
Other versions
GB0207176D0 (en
Inventor
Kenneth Board
Gareth Peter Evans
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Enfis Ltd
Original Assignee
Enfis Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enfis Ltd filed Critical Enfis Ltd
Priority to GB0207176A priority Critical patent/GB2387025A/en
Publication of GB0207176D0 publication Critical patent/GB0207176D0/en
Priority to KR10-2004-7015372A priority patent/KR20050002904A/en
Priority to JP2003578818A priority patent/JP2005521251A/en
Priority to EP03715103A priority patent/EP1512180A2/en
Priority to AU2003219298A priority patent/AU2003219298A1/en
Priority to US10/509,217 priority patent/US20050243539A1/en
Priority to CA002480390A priority patent/CA2480390A1/en
Priority to PCT/GB2003/001271 priority patent/WO2003081127A2/en
Publication of GB2387025A publication Critical patent/GB2387025A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
    • A61B18/20—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser
    • A61B18/203—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser applying laser energy to the outside of the body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00005—Cooling or heating of the probe or tissue immediately surrounding the probe
    • A61B2018/00011—Cooling or heating of the probe or tissue immediately surrounding the probe with fluids
    • A61B2018/00023—Cooling or heating of the probe or tissue immediately surrounding the probe with fluids closed, i.e. without wound contact by the fluid
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00315—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body for treatment of particular body parts
    • A61B2018/00452—Skin
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00—Radiation therapy
    • A61N5/06—Radiation therapy using light
    • A61N2005/065—Light sources therefor
    • A61N2005/0651—Diodes
    • A61N2005/0652—Arrays of diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes

Abstract

A light emitting apparatus (1) comprises: a light source arrangement including a high power LED array (2) which is cooled by a cooling system (3, 4, 5, 6). The cooling system comprises a heat conducting spreader layer (3) in heat transfer relationship with the light source arrangement (2); a Peltier type thermoelectric cooler (4) in heat transfer relationship with the heat spreader (3); and a heat pipe arrangement (5) in heat transfer relationship with the thermoelectric cooler (4), the heat pipe arrangement including a distal condenser(6).

Description

- 1 - Might Emitting Apparatus 5 The present invention relates to light
emitting apparatus.
In order to maintain efficient light output from light emitting apparatus such as high brightness LED arrays or laser diode arrays and to increase the lifetime under lO operating conditions it is beneficial for the light emitting device (or array of devices) to be provided with an effective heat removal system. An improved light emitting apparatus having a highly efficient cooling system has been devised.
According to the present invention, there is provided: Light emitting apparatus comprising: 20 a) a light source arrangement; and b) a cooling system comprising: i) a heat conductive zone in heat transfer 25 relationship with the light source arrangement; ii) a thermoelectric cooling device in heat transfer relationship with the heat conductive zone; and
-2- iii) a heat pipe arrangement in heat transfer relationship with the thermoelectric cooling device. 5 It is preferred that the light source arrangement comprises a semi-conductor light source and/or a laser light source.
The light source arrangement beneficially comprises a plurality of discrete light sources advantageously arranged in an array. The relevant devices may comprise LED (solid 10 state) devices and/or laser devices such as solid state laser devices.
The heat conductive zone beneficially comprises a layer of high thermal conductivity material arranged contiguously with the light source arrangement. Beneficially the heat conductive zone is 50m or less in thickness (more beneficially 20m or less in thickness, most beneficially 10m or less in thickness).
20 The heat conductive zone is beneficially a layer of deposited high thermal conductivity material, preferably deposited by plasma/chemical vapour deposition techniques.
The high thermal conductivity material is advantageously deposited directly on a surface of the light source 25 arrangement (for example such as a rear heat transmissive surface of LED devices or a heat sink mounting for an array of such devices). Beneficially the high thermal conductivity zone comprises a layer of diamond material.
Other suitable materials include zinc oxide and/or sapphire 30 material and/or silver material. Heat flowing from the
-3 light source arrangement (typically the array of discrete light sources comprising the light source arrangement) is spread over a larger area by the high thermal conductivity spreader layer.
Beneficially the thermoelectric cooling device comprises a Peltier cooling device having a proximal end contiguous with the distal end of the heat conductive zone and a distal end contiguous with a proximal end of the heat pipe 10 arrangement. The thermoelectric cooling device is beneficially arranged to be controlled to determine the heat transfer out of the heat conductive zone and/or into the heat pipe arrangement. The thermoelectric/Peltier device beneficially includes control means (typically 15 appropriate drive circuitry) for controlling the current to the thermoelectric device for such purpose. Using the thermoelectric/Peltier device to control the heat transfer away from the heat conductive zone (and therefore away from the light source arrangement), thermal management of the 20 light source arrangement can be optimised and accurately controlled. The heat pipe cooling arrangement beneficially includes a proximal portion contiguous with the thermoelectric cooling 25 device and a distal portion provided with a condenser arrangement. The heat pipe cooling arrangement typically carries a coolant fluid to be heated by heat passing out of the thermoelectric cooling device. The coolant is beneficially directed (when heated) in a direction away 30 from the thermoelectric device. The coolant is
beneficially arranged to be directed away from the thermoelectric device by means of capillary action and/or diffusion. Heat pipe arrangements known in the art may be sufficient for use in accordance with the apparatus of the 5 invention. The coolant is directed toward a cooling zone in the distal region of the heat pipe arrangement, the coolant being returned in the direction of the thermoelectric device following cooling at the cooling zone (for example by means of the condenser where present).
10 Beneficially the coolant (for example or refrigerant) is arranged to vaporise under transfer of heat from the thermoelectric cooling device.
The heat pipe arrangement preferably includes a proximal 15 zone contiguous with the thermoelectric cooling device and a distal cooling zone. The apparatus beneficially further includes force cooling means for cooling the heat pipe arrangement in the region of the distal cooling zone. The force cooling means may comprise water cooling means (for 20 example a water jacket) and/or air cooling means such as an air fan or the like.
Beneficially, the apparatus includes an elongate housing having a proximal portion emitting light from the light 25 source arrangement, and a distal portion proximate the distal portion of the heat pipe arrangement. The light source arrangement, heat conductive zone, thermoelectric cooling device and heat pipe arrangement, are beneficially arranged in the sequence specified and in-line with one 30 another.
- s - According to a second aspect, the present invention provides a light source arrangement cooling system, the cooling system comprising: 5 i) a heat conductive zone in heat transfer relationship with the light source arrangement; ii) a thermoelectric cooling device in heat transfer relationship with the heat conductive zone; and iii) a heat pipe arrangement in heat transfer relationship with the thermoelectric cooling device. 15 The invention will now be further described, by way of example only, with reference to the accompanying drawing which is a schematic representation of apparatus in accordance with the invention.
20 Referring to the drawing, there is shown light emitting apparatus (generally designated 1) comprising, in sequence, an LED diode array 2, a high thermal conductivity heat spreader layer 3, a pettier type thermoelectric cooler 4 and a heat pipe arrangement 5 (including a distal condenser 25 6).
Heat flowing from the LED diode array 2 is spread over a larger area by the high conductivity spreader layer 3.
This layer is typically only a few microns thick and 30 provides rapid and highly efficient heat transfer away from
the diode array 2. Heat then flows into the cold (?) end of the thermoelectric Peltier cooler 4. The hot (?) end of the thermoelectric Peltier cooler layer 4 is in heat transfer coupling with the heat pipe 5. The LED diode 5 array may be arranged to emit light at any desired wavelength (or wavelength combination or wavelength band or wavelength band combination) and may be operated in pulsed or continuous wave mode. Typically the high thermal conductivity layer 3 includes a diamond material and may be 10 plasma/chemical vapour deposition deposited. Other suitable materials include, for example, sapphire materials, zinc oxide materials, silver materials and the like. 15 The Peltier cooler 4 will typically include control means including associated drive circuitry to accurately control the heat transfer away from the LED diode array via the high thermal conductivity spreader layer 3. Accurate control of the driven Peltier thermoelectric cooler 4 (in 20 combination with the provision of the high thermal conductivity heat spreader layer 3 and the downstream heat pipe cooling arrangement 5) provides for extremely efficient thermal management of the apparatus, and in particular, the diode array 2 to ensure consistency of 25 output and maximum life of the diode array.
The heat pipe arrangement 5 may be of a variety generally known in the art and include a wick to direct fluid coolant (contained in the heat pipe arrangement 5) away from the 30 "hot zone" via capillary action, gravity or diffusion. The
arrangement may include a fluid return system to return cooled fluid from the cold zone" at the distal end of the apparatus (for example the distal region provided with condenser 6). The condenser 6 may be force cooled for 5 example by air cooling or water cooling.
The present invention provides significant advantages in terms of the synergistic combination of the high thermal conductivity spreader layer 3, the thermoelectric Peltier 10 cooler 4 and the cooling pipe arrangement 5 in enabling closely controlled and efficient thermal management of the LED diode array 2. Typically the arrangement is housed into an elongate housing having a proximal end via which light is emitted from the LED diode array. This arrangement in 15 which the high thermal conductivity heat spreader layer 3, the thermoelectric Peltier cooler device 4 and the heat pipe arrangement 5 are arranged, in sequence, and in-line with one another provides an apparatus/device which is convenient for hand-held manipulation and use particularly 20 when the overall length of the apparatus in the housing is 50cm or less.

Claims (1)

  1. -8- CLAIMS:
    Light emitting apparatus comprising: a) a light source arrangement; and b) a cooling system comprising: 10 i) a heat conductive zone in heat transfer relationship with the light source arrangement; ii) a thermoelectric cooling device in heat 15 transfer relationship with the heat conductive zone; and iii) a heat pipe arrangement in heat transfer relationship with the thermoelectric 20 cooling device.
    2. Apparatus according to claim 1, wherein the light source arrangement comprises a semiconductor light source. Apparatus according to claim 1 or claim 2, wherein the light source arrangement comprises a laser light source. 30 4. Apparatus according to any preceding claim, wherein
    - 9 - the light source arrangement comprises a plurality of discrete light sources (for example arranged in an array). 5 5. Apparatus according to any preceding claim, wherein the light source arrangement comprises an LED array.
    6. Apparatus according to any of claims 1 to 4, wherein the light source arrangement comprises a laser diode array. 7. Apparatus according to any preceding claim, wherein the heat conductive zone comprises a layer of high thermal conductivity material contiguous with the 15 light source arrangement.
    8. Apparatus according to claim 7, wherein the heat conductive zone is 50m thick or less.
    20 9. Apparatus according to claim 8, wherein the heat conductive zone is 20m thick or less.
    10. Apparatus according to claim 9, wherein the heat conductive zone is loom thick or less.
    11. Apparatus according to any preceding claim, wherein the heat conductive zone is a layer of deposited high thermal conductivity material preferably plasma/chemical vapour deposited.
    - 1 0 12. Apparatus according to claim 11, wherein the deposited high thermal conductivity material is deposited on the surface of the light source arrangement.
    13. Apparatus according to any preceding claim, wherein the high thermal conductivity zone comprises a diamond material and/or a zinc oxide material and/or a sapphire material, and/or a silver material.
    14. Apparatus according to any preceding claim, wherein the thermoelectric cooling device comprises a pettier cooling device.
    15 15. Apparatus according to any preceding claim, wherein the thermoelectric cooling device is arranged to be controlled to determine the heat transfer out of the heat conductive zone and/or into the heat pipe arrangement. 16. Apparatus according to claim 15, wherein the apparatus includes control means for controlling the current to the thermoelectric device.
    25 17. Apparatus according to any preceding claim, wherein the heat pipe cooling arrangement includes a proximal portion contiguous with the thermoelectric cooling device and a distal portion provided with a condenser device.
    -11 18. Apparatus according to any preceding claim, wherein the heat pipe arrangement carries a coolant fluid to be heated by the thermoelectric cooling device and be directed (when heated) in a direction away from the 5 thermoelectric device.
    19. Apparatus according to claim 18, wherein the coolant is arranged to be directed away from the thermoelectric device by means of capillary action 10 and/or diffusion.
    20. Apparatus according to claim 18 or claim 19, wherein the coolant is directed toward a cooling zone in the distal region of the heat pipe arrangement, the 15 coolant being returned in the direction of the thermoelectric device following cooling and the cooling zone.
    21. Apparatus according to any of claims 18 to 20, wherein 20 the coolant is arranged to vaporise under transfer of heat from the thermoelectric cooling device.
    22. Apparatus according to claim 21, wherein the coolant is arranged to condense at a distal cooling zone of 25 the heat pipe arrangement.
    23. Apparatus according to any preceding claim having an elongate housing having a proximal portion emitting light from the light source arrangement and a distal 30 portion proximate the distal portion of the heat pipe
    -12 arrangement. The light source arrangement, heat conductive zone, thermoelectric cooling device, and heat pipe arrangement are arranged in sequence and in-
    line with one another.
    24. Apparatus according to any preceding claim, wherein the heat pipe arrangement includes a proximal zone contiguous with the thermoelectric cooling device and a distal cooling zone, the apparatus further including 10 force cooling means for cooling the heat pipe arrangement in the region of the distal cooling zone.
    25. Apparatus according to claim 24, wherein the force cooling means comprises water cooling means.
    26. Apparatus according to claim 24 or claim 25, wherein the force cooling means comprises air cooling means (such as an air fan or air compressor).
    20 27. A cooling system for a light source arrangement, the cooling system comprising: i) a heat conductive zone in heat transfer relationship with the light source arrangement; ii) a thermoelectric cooling device in heat transfer relationship with the heat conductive zone; and
    iii) a heat pipe arrangement in heat transfer relationship with the thermoelectric cooling device. 5 28. Apparatus substantially as herein described with reference to the accompanying drawings.
GB0207176A 2002-03-26 2002-03-26 LED and laser diode array cooling Withdrawn GB2387025A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GB0207176A GB2387025A (en) 2002-03-26 2002-03-26 LED and laser diode array cooling
KR10-2004-7015372A KR20050002904A (en) 2002-03-26 2003-03-25 Cooled light emitting apparatus
JP2003578818A JP2005521251A (en) 2002-03-26 2003-03-25 Light emitting device with cooling system
EP03715103A EP1512180A2 (en) 2002-03-26 2003-03-25 Cooled light emitting apparatus
AU2003219298A AU2003219298A1 (en) 2002-03-26 2003-03-25 Cooled light emitting apparatus
US10/509,217 US20050243539A1 (en) 2002-03-26 2003-03-25 Cooled light emitting apparatus
CA002480390A CA2480390A1 (en) 2002-03-26 2003-03-25 Cooled light emitting apparatus
PCT/GB2003/001271 WO2003081127A2 (en) 2002-03-26 2003-03-25 Cooled light emitting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0207176A GB2387025A (en) 2002-03-26 2002-03-26 LED and laser diode array cooling

Publications (2)

Publication Number Publication Date
GB0207176D0 GB0207176D0 (en) 2002-05-08
GB2387025A true GB2387025A (en) 2003-10-01

Family

ID=9933775

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0207176A Withdrawn GB2387025A (en) 2002-03-26 2002-03-26 LED and laser diode array cooling

Country Status (1)

Country Link
GB (1) GB2387025A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2404726A (en) * 2003-07-15 2005-02-09 Lear Corp Thermal control system for night vision light source
WO2005111715A2 (en) * 2004-05-11 2005-11-24 Infocus Corporation Cooling for light emitting diode
US7095110B2 (en) 2004-05-21 2006-08-22 Gelcore, Llc Light emitting diode apparatuses with heat pipes for thermal management
CN100523587C (en) * 2006-12-19 2009-08-05 胡家培 Radiating control emergency lighting integrated thick-film packaged LED lighting lamp tube
US8016470B2 (en) 2007-10-05 2011-09-13 Dental Equipment, Llc LED-based dental exam lamp with variable chromaticity

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6266958A (en) * 1985-09-19 1987-03-26 Fuji Xerox Co Ltd Printer
JPS63302584A (en) * 1987-06-02 1988-12-09 Fujitsu Ltd Temperature controller for laser diode
JPH0341787A (en) * 1989-07-07 1991-02-22 Komatsu Ltd Solid-state laser
JPH04179180A (en) * 1990-11-08 1992-06-25 Matsushita Electric Ind Co Ltd Short-wave laser ray source
JPH05167143A (en) * 1991-12-19 1993-07-02 Nippon Steel Corp Semiconductor laser equipment
WO2000048435A1 (en) * 1999-02-10 2000-08-17 Auburn University Method of plasma enhanced chemical vapor deposition of diamond
JP2000286483A (en) * 1999-03-31 2000-10-13 Sony Precision Technology Inc Laser light generator
WO2001016634A1 (en) * 1999-09-02 2001-03-08 Intel Corporation Dual-enclosure optoelectronic packages

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6266958A (en) * 1985-09-19 1987-03-26 Fuji Xerox Co Ltd Printer
JPS63302584A (en) * 1987-06-02 1988-12-09 Fujitsu Ltd Temperature controller for laser diode
JPH0341787A (en) * 1989-07-07 1991-02-22 Komatsu Ltd Solid-state laser
JPH04179180A (en) * 1990-11-08 1992-06-25 Matsushita Electric Ind Co Ltd Short-wave laser ray source
JPH05167143A (en) * 1991-12-19 1993-07-02 Nippon Steel Corp Semiconductor laser equipment
WO2000048435A1 (en) * 1999-02-10 2000-08-17 Auburn University Method of plasma enhanced chemical vapor deposition of diamond
JP2000286483A (en) * 1999-03-31 2000-10-13 Sony Precision Technology Inc Laser light generator
WO2001016634A1 (en) * 1999-09-02 2001-03-08 Intel Corporation Dual-enclosure optoelectronic packages

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2404726A (en) * 2003-07-15 2005-02-09 Lear Corp Thermal control system for night vision light source
GB2404726B (en) * 2003-07-15 2005-12-14 Lear Corp Active night vision cooling system
WO2005111715A2 (en) * 2004-05-11 2005-11-24 Infocus Corporation Cooling for light emitting diode
WO2005111715A3 (en) * 2004-05-11 2005-12-22 Infocus Corp Cooling for light emitting diode
US7252385B2 (en) 2004-05-11 2007-08-07 Infocus Corporation Projection LED cooling
US7553028B2 (en) 2004-05-11 2009-06-30 Infocus Corporation Projection LED cooling
CN101852976A (en) * 2004-05-11 2010-10-06 精工爱普生株式会社 Projection apparatus
CN101852976B (en) * 2004-05-11 2013-01-09 精工爱普生株式会社 Projection apparatus
US7095110B2 (en) 2004-05-21 2006-08-22 Gelcore, Llc Light emitting diode apparatuses with heat pipes for thermal management
CN100523587C (en) * 2006-12-19 2009-08-05 胡家培 Radiating control emergency lighting integrated thick-film packaged LED lighting lamp tube
US8016470B2 (en) 2007-10-05 2011-09-13 Dental Equipment, Llc LED-based dental exam lamp with variable chromaticity

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