GB2386096B - Solder paste stenciling apparatus for minimizing residue of solder paste - Google Patents
Solder paste stenciling apparatus for minimizing residue of solder pasteInfo
- Publication number
- GB2386096B GB2386096B GB0205343A GB0205343A GB2386096B GB 2386096 B GB2386096 B GB 2386096B GB 0205343 A GB0205343 A GB 0205343A GB 0205343 A GB0205343 A GB 0205343A GB 2386096 B GB2386096 B GB 2386096B
- Authority
- GB
- United Kingdom
- Prior art keywords
- solder paste
- stenciling apparatus
- minimizing residue
- minimizing
- residue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/10—Screen printing machines characterised by their constructional features
- B41P2215/13—Devices for increasing ink penetration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0292—Using vibration, e.g. during soldering or screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0205343A GB2386096B (en) | 2002-03-07 | 2002-03-07 | Solder paste stenciling apparatus for minimizing residue of solder paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0205343A GB2386096B (en) | 2002-03-07 | 2002-03-07 | Solder paste stenciling apparatus for minimizing residue of solder paste |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0205343D0 GB0205343D0 (en) | 2002-04-24 |
GB2386096A GB2386096A (en) | 2003-09-10 |
GB2386096B true GB2386096B (en) | 2004-02-11 |
Family
ID=9932473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0205343A Expired - Fee Related GB2386096B (en) | 2002-03-07 | 2002-03-07 | Solder paste stenciling apparatus for minimizing residue of solder paste |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2386096B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2525033A (en) * | 2014-04-10 | 2015-10-14 | Asm Assembly Systems Switzerland Gmbh | Screen printing apparatus and method |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04347636A (en) * | 1991-05-27 | 1992-12-02 | Canon Inc | Screen printing machine |
JPH05131609A (en) * | 1991-11-14 | 1993-05-28 | Toshiba Corp | Solder paste printing machine |
JPH05338113A (en) * | 1992-06-05 | 1993-12-21 | Seiko Epson Corp | Method for printing solder cream |
JPH06255078A (en) * | 1993-03-05 | 1994-09-13 | Toshiba Corp | Coating of substrate with paste |
JPH0852853A (en) * | 1995-09-22 | 1996-02-27 | Matsushita Electric Ind Co Ltd | Device and method for screen printing of cream solder |
JPH08183155A (en) * | 1994-12-29 | 1996-07-16 | Taiyo Yuden Co Ltd | Method and apparatus for paste printing |
JPH10202834A (en) * | 1997-01-27 | 1998-08-04 | Matsushita Electric Ind Co Ltd | Cream solder printing method |
US6016746A (en) * | 1997-08-19 | 2000-01-25 | Micron Communications, Inc. | Flip chip screen printing method |
US6138562A (en) * | 1998-01-20 | 2000-10-31 | Hertz; Allen D. | Vibrational energy waves for assist in the print release process for screen printing |
JP2000313100A (en) * | 1999-04-28 | 2000-11-14 | Juki Corp | Snap-off mechanism of printing machine |
JP2001260313A (en) * | 2000-03-14 | 2001-09-25 | Hitachi Kokusai Electric Inc | Method for printing cream solder |
-
2002
- 2002-03-07 GB GB0205343A patent/GB2386096B/en not_active Expired - Fee Related
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04347636A (en) * | 1991-05-27 | 1992-12-02 | Canon Inc | Screen printing machine |
JPH05131609A (en) * | 1991-11-14 | 1993-05-28 | Toshiba Corp | Solder paste printing machine |
JPH05338113A (en) * | 1992-06-05 | 1993-12-21 | Seiko Epson Corp | Method for printing solder cream |
JPH06255078A (en) * | 1993-03-05 | 1994-09-13 | Toshiba Corp | Coating of substrate with paste |
JPH08183155A (en) * | 1994-12-29 | 1996-07-16 | Taiyo Yuden Co Ltd | Method and apparatus for paste printing |
JPH0852853A (en) * | 1995-09-22 | 1996-02-27 | Matsushita Electric Ind Co Ltd | Device and method for screen printing of cream solder |
JPH10202834A (en) * | 1997-01-27 | 1998-08-04 | Matsushita Electric Ind Co Ltd | Cream solder printing method |
US6016746A (en) * | 1997-08-19 | 2000-01-25 | Micron Communications, Inc. | Flip chip screen printing method |
US6138562A (en) * | 1998-01-20 | 2000-10-31 | Hertz; Allen D. | Vibrational energy waves for assist in the print release process for screen printing |
JP2000313100A (en) * | 1999-04-28 | 2000-11-14 | Juki Corp | Snap-off mechanism of printing machine |
JP2001260313A (en) * | 2000-03-14 | 2001-09-25 | Hitachi Kokusai Electric Inc | Method for printing cream solder |
Also Published As
Publication number | Publication date |
---|---|
GB2386096A (en) | 2003-09-10 |
GB0205343D0 (en) | 2002-04-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20090307 |