GB2386096B - Solder paste stenciling apparatus for minimizing residue of solder paste - Google Patents

Solder paste stenciling apparatus for minimizing residue of solder paste

Info

Publication number
GB2386096B
GB2386096B GB0205343A GB0205343A GB2386096B GB 2386096 B GB2386096 B GB 2386096B GB 0205343 A GB0205343 A GB 0205343A GB 0205343 A GB0205343 A GB 0205343A GB 2386096 B GB2386096 B GB 2386096B
Authority
GB
United Kingdom
Prior art keywords
solder paste
stenciling apparatus
minimizing residue
minimizing
residue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0205343A
Other versions
GB2386096A (en
GB0205343D0 (en
Inventor
Cheng-Yuan Lin
Sheng-Long Wu
Te-Chang Huang
Hao-Wei Liang
Pin-Hsuan Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compeq Manufacturing Co Ltd
Original Assignee
Compeq Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compeq Manufacturing Co Ltd filed Critical Compeq Manufacturing Co Ltd
Priority to GB0205343A priority Critical patent/GB2386096B/en
Publication of GB0205343D0 publication Critical patent/GB0205343D0/en
Publication of GB2386096A publication Critical patent/GB2386096A/en
Application granted granted Critical
Publication of GB2386096B publication Critical patent/GB2386096B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/10—Screen printing machines characterised by their constructional features
    • B41P2215/13—Devices for increasing ink penetration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0292—Using vibration, e.g. during soldering or screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
GB0205343A 2002-03-07 2002-03-07 Solder paste stenciling apparatus for minimizing residue of solder paste Expired - Fee Related GB2386096B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0205343A GB2386096B (en) 2002-03-07 2002-03-07 Solder paste stenciling apparatus for minimizing residue of solder paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0205343A GB2386096B (en) 2002-03-07 2002-03-07 Solder paste stenciling apparatus for minimizing residue of solder paste

Publications (3)

Publication Number Publication Date
GB0205343D0 GB0205343D0 (en) 2002-04-24
GB2386096A GB2386096A (en) 2003-09-10
GB2386096B true GB2386096B (en) 2004-02-11

Family

ID=9932473

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0205343A Expired - Fee Related GB2386096B (en) 2002-03-07 2002-03-07 Solder paste stenciling apparatus for minimizing residue of solder paste

Country Status (1)

Country Link
GB (1) GB2386096B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2525033A (en) * 2014-04-10 2015-10-14 Asm Assembly Systems Switzerland Gmbh Screen printing apparatus and method

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04347636A (en) * 1991-05-27 1992-12-02 Canon Inc Screen printing machine
JPH05131609A (en) * 1991-11-14 1993-05-28 Toshiba Corp Solder paste printing machine
JPH05338113A (en) * 1992-06-05 1993-12-21 Seiko Epson Corp Method for printing solder cream
JPH06255078A (en) * 1993-03-05 1994-09-13 Toshiba Corp Coating of substrate with paste
JPH0852853A (en) * 1995-09-22 1996-02-27 Matsushita Electric Ind Co Ltd Device and method for screen printing of cream solder
JPH08183155A (en) * 1994-12-29 1996-07-16 Taiyo Yuden Co Ltd Method and apparatus for paste printing
JPH10202834A (en) * 1997-01-27 1998-08-04 Matsushita Electric Ind Co Ltd Cream solder printing method
US6016746A (en) * 1997-08-19 2000-01-25 Micron Communications, Inc. Flip chip screen printing method
US6138562A (en) * 1998-01-20 2000-10-31 Hertz; Allen D. Vibrational energy waves for assist in the print release process for screen printing
JP2000313100A (en) * 1999-04-28 2000-11-14 Juki Corp Snap-off mechanism of printing machine
JP2001260313A (en) * 2000-03-14 2001-09-25 Hitachi Kokusai Electric Inc Method for printing cream solder

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04347636A (en) * 1991-05-27 1992-12-02 Canon Inc Screen printing machine
JPH05131609A (en) * 1991-11-14 1993-05-28 Toshiba Corp Solder paste printing machine
JPH05338113A (en) * 1992-06-05 1993-12-21 Seiko Epson Corp Method for printing solder cream
JPH06255078A (en) * 1993-03-05 1994-09-13 Toshiba Corp Coating of substrate with paste
JPH08183155A (en) * 1994-12-29 1996-07-16 Taiyo Yuden Co Ltd Method and apparatus for paste printing
JPH0852853A (en) * 1995-09-22 1996-02-27 Matsushita Electric Ind Co Ltd Device and method for screen printing of cream solder
JPH10202834A (en) * 1997-01-27 1998-08-04 Matsushita Electric Ind Co Ltd Cream solder printing method
US6016746A (en) * 1997-08-19 2000-01-25 Micron Communications, Inc. Flip chip screen printing method
US6138562A (en) * 1998-01-20 2000-10-31 Hertz; Allen D. Vibrational energy waves for assist in the print release process for screen printing
JP2000313100A (en) * 1999-04-28 2000-11-14 Juki Corp Snap-off mechanism of printing machine
JP2001260313A (en) * 2000-03-14 2001-09-25 Hitachi Kokusai Electric Inc Method for printing cream solder

Also Published As

Publication number Publication date
GB2386096A (en) 2003-09-10
GB0205343D0 (en) 2002-04-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20090307