GB2380068A - PCB having printed conductive and dielectric layers on a base substrate - Google Patents
PCB having printed conductive and dielectric layers on a base substrate Download PDFInfo
- Publication number
- GB2380068A GB2380068A GB0221437A GB0221437A GB2380068A GB 2380068 A GB2380068 A GB 2380068A GB 0221437 A GB0221437 A GB 0221437A GB 0221437 A GB0221437 A GB 0221437A GB 2380068 A GB2380068 A GB 2380068A
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit
- conductive
- printed conductive
- producing
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides an improved printed conductive circuit and a method for making the same. Specifically there is provided a method of producing printed conductive circuits and antennae through the screen printing of conductive inks. Layers of conductive inks are printed onto a base substrate. A layer of dielectric ink may optionally be printed between the layers of conductive inks which serves to substantially separate them. The layers of conductive inks remain in contact to maintain conductivity. The number and design of each ink layer are optionally varied depending on the required application and electrical resistance of the product. Such a method has significant advantages in using fewer steps and produces circuits which have desired levels of resistivity.
Description
<Desc/Clms Page number 1>
1"Low Conductive Ink Composition"
2
3 The present invention provides an improved printed
4 conductive circuit and a method for making the same.
5 More specifically there is provided a method of
6 producing printed conductive circuits and antennae,
7 through the screen printing of conductive inks.
8
9 The field of the invention is those areas in which 10 the low electrical resistance of a circuit and/or 11 antenna is vital to its functionality and where low 12 production costs are important. Products where these 13 factors are relevant are inter alia ; membrane 14 switches, electroluminescent lamps, medical 15 diagnostic sensors, RFID and RF tags, smart cards, 16 satellite navigation and GPS systems, proximity 17 sensors, strain gauges and conductive ink 18 application to fabrics.
19 20 Traditional methods of circuit and/or antenna 21 manufacture are generally based around two 22 techniques, which are described below.
<Desc/Clms Page number 2>
1
2 In the first technique, a copper clad substrate
3 (which could be polyester or polyamides or
4 fibreglass) is used on which is deposited an etch
5 resist medium, this being effected by a number of
6 processes.
7
8 The unwanted copper is then removed by an etching
9 process. The etch resistant medium is then removed 10 by means of a chemical stripping agent and the 11 finished circuit is subjected to further processes 12 such as the printing of dielectric inks, lamination 13 or die cutting.
14 15 The second method uses a substrate (such as 16 polyester or polycarbonate) onto which a silver or 17 carbon, or a silver/carbon mixture loaded medium 18 (termed"conductive ink") is screen-printed. This 19 is then dried or cured and the finished circuit 20 subjected to further processes as detailed above, 21 such as the printing of dielectric inks, lamination 22 or die cutting.
23 24 The decision on which of the above detailed 25 processes is used is dependent on the level of 26 resistivity required. For low resistivity 27 requirements, copper gives the best results, but 28 this has the associated disadvantage that it is 29 expensive to buy in a laminated form and requires 30 more processing to achieve the circuit and/or 31 antenna layout.
32
<Desc/Clms Page number 3>
1 Screen printing of conductive ink is an economical
2 option, but inks of this type cannot achieve the low
3 levels of resistivity of copper due to the
4 microscopic separation of the silver/carbon
5 particles in the print medium. A resistance of 1. 0
6 ohms per sq mm on average is normally achievable.
7
8 There are therefore particular problems with the
9 methods of circuit and antenna manufacture as 10 described above. The copper clad etched technology 11 described is expensive to produce as it uses an 12 expensive substrate and there are a number of 13 processes involved. Producing circuits in this way 14 further results in the production of by-products 15 which can be detrimental to the environment.
16 17 Turning to the screen printing method described, 18 although the printed conductive inks are more cost 19 effective and less environmentally detrimental than 20 the contributory components of the copper clad 21 etched technology, these inks can only be used for a 22 limited number of applications where a higher level 23 of electrical resistance is acceptable.
24 25 It is therefore an object of the present invention 26 to provide an improved printed conductive circuit or 27 an antenna and a method of producing the same, 28 wherein a conductive circuit is produced by means of 29 a printing conductive inks onto a base substrate. A 30 further object of the present invention is to 31 provide a printed conductive circuit which has a low
<Desc/Clms Page number 4>
1 level of electrical resistivity comparable to that
2 of copper etched circuits.
3
4 According to one aspect of the present invention,
5 there is provided a printed conductive circuit, said
6 circuit including a base substrate onto which a
7 plurality of layers of a conductive ink are printed.
8
9 Preferably the conductive ink is a composite
10 material consisting of electrically conducting
11 particles mixed in a polymer material.
12 13 Preferably the electrically conducting particles are 14 a metal or metal composite such as silver or silver 15 coated copper.
16 17 Alternatively the electrically conducting particles 18 are carbon.
19 20 Alternatively, the electrically conducting particles 21 are electrically conducting polymer particles.
22 23 Preferably the base substrate is polyester, 24 polycarbonate, glass or paper.
25 26 Preferably the printed conductive circuit can act as 27 an antenna.
28 29 The present invention further provides a printed 30 conductive circuit, said circuit including a base 31 substrate onto which a plurality of layers of a 32 conductive ink are printed, wherein said layers of
<Desc/Clms Page number 5>
1 conductive ink are joined at at least one point and
2 are further separated by a layer of dielectric ink.
3
4 Preferably the conductive ink is a composite
5 material consisting of electrically conducting
6 particles mixed in a polymer material.
7
8 Preferably the electrically conducting particles are
9 a metal or metal composite.
10 11 Preferably the electrically conducting particles are 12 silver or silver coated copper.
13 14 Alternatively the electrically conducting particles 15 are carbon.
16 17 Alternatively, the electrically conducting particles 18 are electrically conducting polymer particles.
19 20 Preferably the base substrate is polyester, 21 polycarbonate, glass or paper.
22 23 Preferably the printed conductive circuit acts as an 24 antenna.
25 26 In a further aspect of the present invention, there 27 is provided a method of producing a printed 28 conductive circuit, said method comprising the steps 29 of; applying to a base substrate a layer of a 30 conductive ink, and further applying at least one 31 layer of conductive ink directly to the top layer of 32 the layer of conductive ink applied to the base
<Desc/Clms Page number 6>
1 substrate, and further exposing the base substrate
2 and all ink layers to both heat and pressure.
3
4 Preferably the inks are applied by means of a screen
5 printing technique.
6
7 Alternatively the inks are applied by lithographic
8 printing or flexographic printing.
9 10 Preferably said conductive ink is a composite 11 material consisting of electrically conducting 12 particles mixed in a polymer material.
13 14 Preferably the electrically conducting particles are 15 a metal or metal composite.
16 17 Preferably the electrically conducting particles are 18 silver or silver coated copper.
19 20 Alternatively the electrically conducting particles 21 are carbon.
22 23 Alternatively, the electrically conducting particles 24 are electrically conducting polymer particles.
25 26 Preferably the base substrate is polyester, 27 polycarbonate, glass or paper.
28 29 Preferably the pressure to which the circuit is 30 exposed is between 50 and 150 bar per sq cm.
31 32 More preferably the pressure is 100 bar per sq cm.
<Desc/Clms Page number 7>
1
2 Preferably the temperature to which the circuit is
3 heated is between 1200C and 220 C.
4
5 More preferably the temperature to which the circuit
6 is heated is 185 C.
7
8 The product of the present invention may further act
9 as an antenna.
10 11 In a yet further aspect, the present invention 12 provides a method of producing a printed conductive 13 circuit, the method including the steps of applying 14 to a base substrate a layer of conductive ink, 15 substantially applying to said layer of conductive 16 ink at least one layer of a dielectric ink, and 17 further applying at least one further layer of a 18 conductive ink, the layers of conductive ink being 19 joined at at least one point, and further being 20 substantially separated by at least one layer of 21 dielectric ink, and further comprising the step of 22 exposing the base substrate and all ink layers to 23 both heat and pressure.
24 25 Preferably the inks are applied by means of a screen 26 printing technique.
27 28 Alternatively the inks are applied by lithographic 29 printing or flexographic printing.
30
<Desc/Clms Page number 8>
1 Preferably said conductive ink is a composite
2 material consisting of electrically conducting
3 particles mixed in a polymer material
4
5 Preferably the electrically conducting particles are
6 a metal or metal composite.
7
8 Preferably the electrically conducting particles are
9 silver or silver coated copper.
10 11 Alternatively the electrically conducting particles 12 are carbon.
13 14 Alternatively, the electrically conducting particles 15 are electrically conducting polymer particles.
16 17 Preferably the base substrate is polyester, 18 polycarbonate, glass or paper.
19 20 Preferably the pressure to which the circuit is 21 exposed is between 50 and 150 bar per sq cm.
22 23 More preferably the pressure is 100 bar per sq cm.
24 25 Preferably the temperature to which the circuit is 26 heated is between 1200C and 220 C.
27 28 More preferably the temperature to which the circuit 29 is heated is 185 C.
30 31 The product of the present invention may further act 32 as an antenna.
<Desc/Clms Page number 9>
1
2 In summary the invention provides printed conductive
3 circuits and/or antennae and further a method for
4 the production of the same, which have resistivity
5 levels which are comparable to those achieved by
6 copper clad laminates and which further have
7 resistivity levels which are substantially less than
8 those achieved by the previously known methods of
9 screen printing produced conductive circuits which 10 use conductive inks.
11 12 The present invention has the further advantage that 13 it will reduce the overall cost of producing printed 14 conductive circuits and antennae. There are further 15 environmental benefits derived from the use of the 16 current products and methods of production, 17 especially over products currently derived by means 18 of using copper clad etched technology.
19 20 The present invention will now be described, by way 21 of example only with reference to the accompanying 22 drawings in which; 23 24 Figure 1 shows a plan view of a circuit 25 illustrating the relationship of an insulating layer 26 and a dielectric layer, 27 28 Figure 2 shows a side elevation showing the 29 relationship of the conductive ink layers and 30 dielectric ink layers applied to a base substrate, 31 and 32
<Desc/Clms Page number 10>
1 Figure 3 shows a side elevation of a plurality
2 of conductive ink layers applied to a base
3 substrate.
4
5 An example of a printed circuit according to the
6 present invention can be seen in figures 1 and 2.
7 From figure 1, an example of the layering
8 relationship between the conductive ink layer 1 and
9 the dielectric ink layer 2 can be seen.
10 11 The conductive ink 1 is preferably a composite of 12 silver powder or granules mixed in a polymer 13 material together with a solvent which is released 14 on drying or following exposure to a photo-initiator 15 that is activated when subject to the action of 16 ultra violet light at a certain wavelength.
17 18 The dielectric ink 2 is preferably a polymer that 19 acts as an insulator together with a solvent which 20 is released upon drying, or alternatively a photo- 21 initiator which is activated when exposed to ultra- 22 violet light.
23 24 In figure 2, the relationship of the printed ink 25 layers with the base substrate is illustrated.
26 27 The base substrate 3 is any material that will not 28 distort when heat and pressure is applied to it such 29 as polyester, polycarbonate, paper or glass.
30 31 As is depicted in'figure 2, an initial layer of 32 conductive ink la is printed onto the base substrate
<Desc/Clms Page number 11>
1 3. A dielectric layer 2 is then substantially
2 printed on top of the base conductive layer la. A
3 further layer of conductive ink 1b is then applied
4 substantially on top of the dielectric layer 2.
5 Although substantially separated from the initial
6 layer of conductive ink la by the dielectric layer
7 2, this further layer of conductive ink 1b makes
8 contact with the initial layer of the conductive ink
9 la at a point 4. Subsequent layering of dielectric
10 ink 2 and conductive ink 1 layers can be applied.
11 12 An optional dielectric encapsulating layer 5 may be 13 applied as the top layer. The application of this 14 layer will however be dependent on the application 15 to which the circuit is to be used for.
16 17 The various ink layers are applied by printing, and 18 in particular by screen-printing, although other 19 printing types such as lithographic or flexographic 20 may also be used.
21 22 The design of each layer, the area of the points of 23 join and the number of layers is dependent on the 24 particular application and electrical resistance 25 required of the product.
26 27 After drying or curing all ink layers the substrate 28 is subjected to both heat and compression 29 (pressure). The amount of heat and pressure applied 30 is dependent on the base substrate used, the 31 application and electrical resistance required of 32 the product.
<Desc/Clms Page number 12>
1
2 An alternative example of a printed circuit
3 according to the invention is illustrated in figure
4 3. In this example, there is successive layering of
5 conductive ink layers 1 on top of each other. An
6 optional dielectric encapsulating layer 5 may be
7 applied as the top layer, however the dielectric
8 layer does not lie between each layer of the
9 conductive ink layers. The application of the 10 dielectric layer will however be dependent on the 11 application to which the circuit is to be used for.
12 13 The most preferred material for use in the present 14 invention is 150 micron polyester and a 15 silver/polymer ink mix, printed in 3 layers with no 16 dielectric separation, subject to a pressure of 100 17 bar per sq cm, heated to 1850C with a dwell time of 18 105 seconds, a resistance in the region of 0.007 19 ohms per sq mm is achieved.
20 21 The conductive ink (which may be UV cured or 22 conventional solvent-based systems) is printed in 23 multiple similar layers to increase the area of the 24 circuitry and/or antenna. This has the effect of 25 reducing the resistivity without increasing the size 26 of the circuit and/or antenna.
27 28 In both of the examples detailed, each conductive 29 ink layer 1 layer is connected to the conductive ink 30 layer 1 above or beneath it. Other than on the 31 connecting points a dielectric insulating layer 2 is 32 printed that effects insulation between conductive
<Desc/Clms Page number 13>
1 layers. As shown in the example in figure 3 and as
2 detailed above, a further option is to print a
3 successive number of conductive ink layers which
4 have no dielectric insulating layer 2 printed
5 between each layer.
6
7 In all cases of circuit or antenna produced by this
8 invention, the finished printed product is subjected
9 to both a heat and compression process. This has 10 the effect of further reducing the resistivity 11 levels by forcing the particles contained within the 12 printed medium into closer proximity with one 13 another.
14 15 Although the invention has been particularly shown 16 and described with reference to the preferred 17 embodiments, it will be understood by those skilled 18 in the art that various changes in the form and 19 details may be made therein without departing from 20 the scope of the present invention.
Claims (44)
1 Claims
2
3 1. A printed conductive circuit comprising a base
4 substrate onto which a plurality of layers of a
5 conductive ink are printed.
6
7
2. A printed conductive circuit as claimed in claim
8 1, wherein the conductive ink is a composite
9 material consisting of electrically conducting
10 particles mixed in a polymer material.
11 12
3. A printed conductive circuit as claimed in claim 13 2, wherein the electrically conducting particles are 14 a metal such as silver or a metal composite such as 15 silver coated copper.
16 17
4. A printed conductive circuit as claimed in claim 18 2, wherein the electrically conducting particles are 19 carbon.
20 21
5. A printed conductive circuit as claimed in claim 22 2, wherein the electrically conducting particles are 23 electrically conducting polymer particles.
24 25
6. A printed conductive circuit as claimed in claims 26 1 to 5, wherein the base substrate is polyester, 27 polycarbonate, glass or paper.
28 29
7. A printed conductive circuit as claimed in any of 30 the preceding claims, which acts as an antenna.
<Desc/Clms Page number 15>
1
8. A printed conductive circuit including a base
2 substrate onto which a plurality of layers of a
3 conductive ink are printed, wherein the layers of
4 conductive ink are joined at at least one point and
5 are substantially separated by a layer of dielectric
6 ink.
7
8
9. A printed conductive circuit as claimed in claim
9 8, wherein the conductive ink is a composite 10 material consisting of electrically conducting 11 particles mixed in a polymer material.
12 13
10. A printed conductive circuit as claimed in claim 14 9, wherein the electrically conducting particles are 15 a metal or metal composite.
16 17
11. A printed conductive circuit as claimed in claim 18 9, wherein the electrically conducting particles are 19 silver.
20 21
12. A printed conductive circuit as claimed in claim 22 9, wherein the electrically conducting particles are 23 silver coated copper.
24 25
13. A printed conductive circuit as claimed in claim 26 9, wherein the electrically conducting particles are 27 carbon.
28 29
14. A printed conductive circuit as claimed in claim 30 9, wherein the electrically conducting particles are 31 electrically conducting polymer particles.
32
<Desc/Clms Page number 16>
1
15. A printed conductive circuit as claimed in
2 claims 8 to 14, wherein the base substrate is
3 polyester, polycarbonate, glass or paper.
4
5
16. A printed conductive circuit as claimed in any
6 of claims 8 to 15, which acts as an antenna.
7
8
17. A method of producing a printed conductive
9 circuit comprising the steps of: 10 applying to a base substrate a layer of a 11 conductive ink; 12 applying at least one further layer of 13 conductive ink directly to the top layer of the 14 layer of conductive ink applied to the base 15 substrate; and 16 exposing the base substrate and all ink 17 layers to both heat and pressure.
18 19
18. A method of producing a printed conductive 20 circuit as claimed in claim 17, wherein the inks are 21 applied by means of a screen printing technique.
22 23
19. A method of producing a printed conductive 24 circuit as claimed in claim 17, wherein the inks are 25 applied by lithographic printing or flexographic 26 printing.
27 28
20. A method of producing a printed conductive 29 circuit as claimed in claim 17, wherein the 30 conductive ink is a composite material consisting of 31 electrically conducting particles mixed in a polymer 32 material.
<Desc/Clms Page number 17>
2
21. A method of producing a printed conductive
3 circuit as claimed in claim 20, wherein the
4 electrically conducting particles are a metal or
5 metal composite.
6
7
22. A method of producing a printed conductive
8 circuit as claimed in claim 20, wherein the
9 electrically conducting particles are silver or 10 silver coated copper.
11 12
23. A method of producing a printed conductive 13 circuit as claimed in claim 20, wherein the 14 electrically conducting particles are carbon.
15 16
24. A method of producing a printed conductive 17 circuit as claimed in claim 20, wherein the 18 electrically conducting particles are electrically 19 conducting polymer particles.
20 21
25. A method of producing a printed conductive 22 circuit as claimed in claim 17 to 24, wherein the 23 base substrate is polyester, polycarbonate, glass or 24 paper.
25 26
26. A method of producing a printed conductive 27 circuit as claimed in claims 17 to 25, wherein the 28 pressure to which the circuit is exposed is between 29 50 and 150 bar per square centimetre.
30 31
27. A method of producing a printed conductive 32 circuit as claimed in claims 17 to 25, wherein the
<Desc/Clms Page number 18>
1 pressure to which the circuit is exposed is 100 bar
2 per square centimetre.
3
4
28. A method of producing a printed conductive
5 circuit as claimed in claims 17 to 27, wherein the
6 temperature to which the circuit is heated is
7 between 1200C and 220 C.
8
9
29. A method of producing a printed conductive
10 circuit as claimed in claims 17 to 27, wherein the
11 temperature to which the circuit is heated is 185 C.
12 13
30. A method of producing a printed conductive 14 circuit as claimed in any of claims 17 to 29, 15 wherein the printed conductive circuit further acts 16 as an antenna.
17 18
31. A method of producing a printed conductive 19 circuit comprising the steps of: 20 applying to a base substrate a layer of 21 conductive ink; 22 applying to said first layer of conductive 23 ink at least one layer of dielectric ink; 24 applying to the layer of dielectric ink at 25 least one further layer of a conductive ink, wherein 26 this layer of conductive ink is joined at at least 27 one point to the other layer of conductive ink, and 28 further wherein the layers of conductive ink are 29 separated by the at least one layer of dielectric 30 ink; and 31 exposing the base substrate and all the 32 ink layers to both heat and pressure.
<Desc/Clms Page number 19>
1 2
32. A method of producing a printed conductive 3 circuit as claimed in claim 31, wherein the inks are
4 applied by means of a screen printing technique.
5 6
33. A method of producing a printed conductive
7 circuit as claimed in claim 31, wherein the inks are
8 applied by lithographic printing or flexographic
9 printing.
10 11
34. A method of producing a printed conductive 12 circuit as claimed in claims 31 to 33, wherein the 13 conductive ink is a composite material consisting of 14 electrically conducting particles mixed in a polymer 15 material.
16 17
35. A method of producing a printed conductive 18 circuit as claimed in claim 34, wherein the 19 electrically conducting particles are a metal or a 20 metal composite.
21 22
36. A method of producing a printed conductive 23 circuit as claimed in claim 34, wherein the 24 electrically conducting particles are silver or 25 silver coated copper.
26 27
37. A method of producing a printed conductive 28 circuit as claimed in claim 34, wherein the 29 electrically conducting particles are carbon.
30 31
38. A method of producing a printed conductive 32 circuit as claimed in claim 34, wherein the
<Desc/Clms Page number 20>
1 electrically conducting particles are electrically 2 conducting polymer particles.
3 4
39. A method of producing a printed conductive 5 circuit as claimed in claims 31 to 38, wherein the 6 base substrate is polyester, polycarbonate, glass or
7 paper.
8 9
40. A method of producing a printed conductive 10 circuit as claimed in claims 31 to 39, wherein the 11 pressure to which the circuit is exposed is between 12 50 and 150 bar per square centimetre.
13 14
41. A method of producing a printed conductive 15 circuit as claimed in claims 31 to 39, wherein the 16 pressure to which the circuit is exposed is 100 bar 17 per square centimetre.
18 19
42. A method of producing a printed conductive 20 circuit as claimed in claims 31 to 41, wherein the 21 temperature to which the circuit is heated is 22 between 1200C and 220 C.
23 24
43. A method of producing a printed conductive 25 circuit as claimed in claims 31 to 41, wherein the 26 temperature to which the circuit is heated is 185 C.
27 28
44. A method of producing an antenna as claimed in 29 any of claims 31 to 43.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0221437A GB2380068B (en) | 2001-09-15 | 2002-09-16 | Low Conductive Ink Composition |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0122351A GB0122351D0 (en) | 2001-09-15 | 2001-09-15 | "Printing method" |
| GB0221437A GB2380068B (en) | 2001-09-15 | 2002-09-16 | Low Conductive Ink Composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB0221437D0 GB0221437D0 (en) | 2002-10-23 |
| GB2380068A true GB2380068A (en) | 2003-03-26 |
| GB2380068B GB2380068B (en) | 2005-08-03 |
Family
ID=26246552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0221437A Expired - Fee Related GB2380068B (en) | 2001-09-15 | 2002-09-16 | Low Conductive Ink Composition |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2380068B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004050433A1 (en) * | 2002-12-04 | 2004-06-17 | Scientific Generics Limited | Sensing apparatus and method |
| EP1855514A1 (en) * | 2006-05-10 | 2007-11-14 | AMC Centurion AB | Production of antenna devices |
| EP1914832A1 (en) * | 2006-10-17 | 2008-04-23 | Laird Technologies AB | A method of production of an antenna pattern |
| FR2977958A1 (en) * | 2011-07-12 | 2013-01-18 | Ask Sa | CONTACT-CONTACTLESS HYBRID INTEGRATED CIRCUIT BOARD WITH REINFORCED HOLDING OF THE ELECTRONIC MODULE |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115635765B (en) * | 2022-12-26 | 2023-03-07 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Ceramic packaging tube shell pore wall metallization die and screen printing equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2050702A (en) * | 1976-07-21 | 1981-01-07 | Shipley Co | Printed circuits |
| US4517227A (en) * | 1981-11-17 | 1985-05-14 | Rhone-Poulenc Specialites Chimiques | Forming of thick-layer, hybrid electronic printed circuits |
| US4640981A (en) * | 1984-10-04 | 1987-02-03 | Amp Incorporated | Electrical interconnection means |
| US4871583A (en) * | 1984-12-21 | 1989-10-03 | U.S. Philips Corporation | Housing for an electronic device |
| WO1996034360A1 (en) * | 1995-04-25 | 1996-10-31 | Interprint Formularios Ltda. | Memory card and method of producing same |
| EP1099564A1 (en) * | 1999-11-10 | 2001-05-16 | Oriel Technologicas, S.A. | Emblem with luminous motifs |
-
2002
- 2002-09-16 GB GB0221437A patent/GB2380068B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2050702A (en) * | 1976-07-21 | 1981-01-07 | Shipley Co | Printed circuits |
| US4517227A (en) * | 1981-11-17 | 1985-05-14 | Rhone-Poulenc Specialites Chimiques | Forming of thick-layer, hybrid electronic printed circuits |
| US4640981A (en) * | 1984-10-04 | 1987-02-03 | Amp Incorporated | Electrical interconnection means |
| US4871583A (en) * | 1984-12-21 | 1989-10-03 | U.S. Philips Corporation | Housing for an electronic device |
| WO1996034360A1 (en) * | 1995-04-25 | 1996-10-31 | Interprint Formularios Ltda. | Memory card and method of producing same |
| EP1099564A1 (en) * | 1999-11-10 | 2001-05-16 | Oriel Technologicas, S.A. | Emblem with luminous motifs |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004050433A1 (en) * | 2002-12-04 | 2004-06-17 | Scientific Generics Limited | Sensing apparatus and method |
| EP1855514A1 (en) * | 2006-05-10 | 2007-11-14 | AMC Centurion AB | Production of antenna devices |
| EP1914832A1 (en) * | 2006-10-17 | 2008-04-23 | Laird Technologies AB | A method of production of an antenna pattern |
| FR2977958A1 (en) * | 2011-07-12 | 2013-01-18 | Ask Sa | CONTACT-CONTACTLESS HYBRID INTEGRATED CIRCUIT BOARD WITH REINFORCED HOLDING OF THE ELECTRONIC MODULE |
| WO2013007897A3 (en) * | 2011-07-12 | 2013-03-28 | Ask S.A. | Hybrid contact/contactless integrated circuit card, the strength of the electronic module of which is reinforced |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0221437D0 (en) | 2002-10-23 |
| GB2380068B (en) | 2005-08-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20080916 |