GB2354116B - Assembly for electrical/electronic components - Google Patents

Assembly for electrical/electronic components

Info

Publication number
GB2354116B
GB2354116B GB9921307A GB9921307A GB2354116B GB 2354116 B GB2354116 B GB 2354116B GB 9921307 A GB9921307 A GB 9921307A GB 9921307 A GB9921307 A GB 9921307A GB 2354116 B GB2354116 B GB 2354116B
Authority
GB
United Kingdom
Prior art keywords
electrical
assembly
electronic components
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9921307A
Other versions
GB2354116A (en
GB9921307D0 (en
Inventor
Gareth Rhys Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Automotive Systems UK Ltd
Original Assignee
Llanelli Radiators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Llanelli Radiators Ltd filed Critical Llanelli Radiators Ltd
Priority to GB9921307A priority Critical patent/GB2354116B/en
Publication of GB9921307D0 publication Critical patent/GB9921307D0/en
Priority to PCT/GB2000/003348 priority patent/WO2001020674A2/en
Priority to EP00956698A priority patent/EP1254481A2/en
Priority to AU68565/00A priority patent/AU6856500A/en
Publication of GB2354116A publication Critical patent/GB2354116A/en
Application granted granted Critical
Publication of GB2354116B publication Critical patent/GB2354116B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
GB9921307A 1999-09-10 1999-09-10 Assembly for electrical/electronic components Expired - Lifetime GB2354116B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB9921307A GB2354116B (en) 1999-09-10 1999-09-10 Assembly for electrical/electronic components
PCT/GB2000/003348 WO2001020674A2 (en) 1999-09-10 2000-08-31 Assembly for electrical/electronic components
EP00956698A EP1254481A2 (en) 1999-09-10 2000-08-31 Assembly for electrical/electronic components
AU68565/00A AU6856500A (en) 1999-09-10 2000-08-31 Assembly for electrical/electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9921307A GB2354116B (en) 1999-09-10 1999-09-10 Assembly for electrical/electronic components

Publications (3)

Publication Number Publication Date
GB9921307D0 GB9921307D0 (en) 1999-11-10
GB2354116A GB2354116A (en) 2001-03-14
GB2354116B true GB2354116B (en) 2003-12-03

Family

ID=10860626

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9921307A Expired - Lifetime GB2354116B (en) 1999-09-10 1999-09-10 Assembly for electrical/electronic components

Country Status (4)

Country Link
EP (1) EP1254481A2 (en)
AU (1) AU6856500A (en)
GB (1) GB2354116B (en)
WO (1) WO2001020674A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10244791B4 (en) * 2002-09-26 2009-03-26 Robert Bosch Gmbh Device for cooling electronic components
DE102016212289B4 (en) 2016-07-06 2018-08-02 Conti Temic Microelectronic Gmbh Power electronics assembly with extruded cooling and protection element

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1156434A (en) * 1967-03-20 1969-06-25 Ibm Electronic Circuit Assembly
GB1343868A (en) * 1971-05-05 1974-01-16 Soncini G Apparatus for the construction of electric circuits
US3909679A (en) * 1974-11-07 1975-09-30 Rock Ola Mfg Corp Cabinet and heat sink for amplifier components
WO1981003734A1 (en) * 1980-06-19 1981-12-24 Digital Equipment Corp Heat pin integrated circuit packaging
EP0124029A2 (en) * 1983-04-29 1984-11-07 Siemens Aktiengesellschaft Well-coolable modular circuit carrying an electrical component
US4764847A (en) * 1985-12-04 1988-08-16 Vdo Adolf Schindling Ag Support plate for electronic components
US4872102A (en) * 1986-04-28 1989-10-03 Dimensions Unlimited, Inc. D.C. to A.C. inverter having improved structure providing improved thermal dissipation
US4933808A (en) * 1989-05-11 1990-06-12 Westinghouse Electric Corp. Solderless printed wiring board module and multi-module assembly
US5179503A (en) * 1991-04-19 1993-01-12 United Technologies Automotive, Inc. Modular automobile power distribution box

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5471572A (en) * 1977-11-18 1979-06-08 Fujitsu Ltd Semiconductor device
US4396935A (en) * 1980-10-06 1983-08-02 Ncr Corporation VLSI Packaging system
DE3278321D1 (en) * 1981-11-10 1988-05-11 Fujitsu Ltd Semiconductor devices provided with heat-dissipating means
US5018050A (en) * 1987-11-17 1991-05-21 Omron Tateisi Electronics Co. Solid state relay
US5463530A (en) * 1993-02-05 1995-10-31 The Bergquist Company Dual sided laminated semiconductor mounting
US5598322A (en) * 1994-09-27 1997-01-28 Watlow Winona, Inc. Power control system

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1156434A (en) * 1967-03-20 1969-06-25 Ibm Electronic Circuit Assembly
GB1343868A (en) * 1971-05-05 1974-01-16 Soncini G Apparatus for the construction of electric circuits
US3909679A (en) * 1974-11-07 1975-09-30 Rock Ola Mfg Corp Cabinet and heat sink for amplifier components
WO1981003734A1 (en) * 1980-06-19 1981-12-24 Digital Equipment Corp Heat pin integrated circuit packaging
EP0124029A2 (en) * 1983-04-29 1984-11-07 Siemens Aktiengesellschaft Well-coolable modular circuit carrying an electrical component
US4764847A (en) * 1985-12-04 1988-08-16 Vdo Adolf Schindling Ag Support plate for electronic components
US4872102A (en) * 1986-04-28 1989-10-03 Dimensions Unlimited, Inc. D.C. to A.C. inverter having improved structure providing improved thermal dissipation
US4933808A (en) * 1989-05-11 1990-06-12 Westinghouse Electric Corp. Solderless printed wiring board module and multi-module assembly
US5179503A (en) * 1991-04-19 1993-01-12 United Technologies Automotive, Inc. Modular automobile power distribution box

Also Published As

Publication number Publication date
EP1254481A2 (en) 2002-11-06
WO2001020674A2 (en) 2001-03-22
AU6856500A (en) 2001-04-17
GB2354116A (en) 2001-03-14
WO2001020674A3 (en) 2001-09-27
GB9921307D0 (en) 1999-11-10

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20190909