GB2352241A - Diamond-containing materials having modified thermal conductivity - Google Patents

Diamond-containing materials having modified thermal conductivity Download PDF

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Publication number
GB2352241A
GB2352241A GB0017293A GB0017293A GB2352241A GB 2352241 A GB2352241 A GB 2352241A GB 0017293 A GB0017293 A GB 0017293A GB 0017293 A GB0017293 A GB 0017293A GB 2352241 A GB2352241 A GB 2352241A
Authority
GB
United Kingdom
Prior art keywords
base material
diamond particles
diamond
thermal conductivity
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0017293A
Other versions
GB0017293D0 (en
Inventor
William John Baillie-Hamilton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fibre Optic Lamp Co Ltd
Original Assignee
Fibre Optic Lamp Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fibre Optic Lamp Co Ltd filed Critical Fibre Optic Lamp Co Ltd
Priority to PCT/GB2000/002642 priority Critical patent/WO2001004194A1/en
Priority to AU62972/00A priority patent/AU6297200A/en
Publication of GB0017293D0 publication Critical patent/GB0017293D0/en
Publication of GB2352241A publication Critical patent/GB2352241A/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • C23C24/06—Compressing powdered coating material, e.g. by milling
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

A method of modifying the thermal conductivity of a base material comprises the step of mixing the base material, at least when the base material is in a mobile state, with diamond particles. Typically the diamond particles are of a particle size lying the range 1 to 100 microns. The method can comprise a mixture of diamond particles which are similar in size or a mixture of particles of relatively large and small sizes. A base material is mixed with diamond particles in sufficient amounts to significantly increase the thermal conductivity of the mixed base material as against the thermal conductivity of the base material. The base material can comprise one or more of a wide range of plastics, metals, alloys, inorganic materials, plasticiser or catalytic material. Many applications of the materials produced are referred to.

Description

2352241 METHOD OF, AND MATERIAL FOR, IMPROVING THERMAL CONDUCTIVITY
TECHNICAL FIELD This invention relates to a method of, and a material for, improving thermal conductivity. In particular it is concerned with such a method and such a material for use in a context where relatively high temperature can arise and there arises the need to provide a path enabling heat to be conducted away from a location. This is not always readily achieved and the selection of a suitable material can be problematic. A material other- wise having suitable characteristics of strength, electrical or heat conductivity or some other characteristic, at one temperature may, on being raised to a higher temperature, suffer deterioration in one or more these characteristics or may introduce an additional unsatisfactory response. For many applications there is a need for a material while providing for good thermal conductivity also provides for electrical insulation.
DISCLOSURE OF THE INVENTION According to a first aspect of the present invention there is provided a method of modifying the thermal conductivity of a base material comprising the step of mixing the base material, at least when the base material is in a mobile state, with diamond particles. Typically, but not exclusively, the diamond particles are of a particle size lying the range 1 to 100 microns. The particles can be similar in size or can be a mixture of relatively large and of small sizes.
According to a second aspect of the present invention there is provided a material comprising a base material mixed with diamond particles in sufficient amounts to significantly increase the thermal conductivity of base material as against the thermal conductivity of the base material. Hereafter such a material is referred to as a 'diamond compound', The term 'compound' refers to the fact that the material is made up of a base material in which diamond particles are physically distributed. It is not intended 2 to suggest that there is necessarily some form of chemical bonding involved between the base material and the diamond particles.
According to a first preferred version of the second aspect of the present invention the 5 base material is selected from one or more of the following groups.
Group A ABS, acetal, acrylic, cellulose based materials including nitrocellulose, epoxy and vinyl resin materials, melarnine, polyamides, polyesters, polyethers, polyimides, polyolefins, polysulphones, polytetrafluorethylene, PPO, nylon, polyvinylchloride, rubbers (natural and artificial) including butyl, nitrile and neoprene, silane, silicones, styrene's, urea formaldehyde, urethanes or polyurethane's, vinyl's.
Group B Aluminium, copper, gold, iron, lead, mercury, molybdenum, nickel, platinum, silver, titanium, tungsten, zinc.
Group C Alloys (such as brass, bronze, steel) incorporating one or more of the members of Group B (including solders and brazing compounds).
Group D Alumina, asbestos, carbon, chalk, glasses including hard glasses, graphite, gypsum, mica, organic peroxides, oxides (inorganic) such as those of iron, titanium, chromium, quartz, silica, silicon and silicon based materials, talc.
Group E Mixtures of members of the preceding groups A to D with plasticisers and/or other material.
3 According to a second preferred version of the second aspect of the present invention the base material is selected to provide a vehicle for the diamond particles for a material intended to function as at least one member of the following group: adhesive, sealant, grease, lubricant, sheet, mouldable compounds, potting compound, 5 solid, extrusion.
According to a third preferred version of the second aspect of the present invention at least an initial mixture formed of the base material and the diamond particles is in the form of a member of the following group: gel, liquid, spray, powder, solid, extrusion.
MODES FOR CARRYING OUT THE INVENTION The present invention is directed to taking advantage of characteristics of diamond particularly in particulate form. Apart from being the hardest known naturally occurring material it has the highest known thermal conductivity at room temperature.
Diamond is capable of conducting a wide spectrum of light waves. Artificial diamond material when synthesised can be given electrically conductive, non-conductive or semi conductive properties.
For the purposes of the present invention the diamond powder or grit can be natural or synthetic. However the methods available for producing synthetic diamond provide for particular characteristics for a given diamond material to be readily and relatively easily created so that particles of closely controlled size are obtainable at relatively low cost when one considers the useful characteristics of the resulting diamond compounds and their uses.
Diamond is water loving and consequently for a given application in the manufacture of a particular diamond compound it may be necessary to make use of a moisture removing or excluding additive.
4 It is envisaged that for a diamond compound the diamond particles can be of small uniform size lying in the range of 0-70 microns. The use of small size particles provides for maximum saturation of the end product on mixing with the base material. As an alternative larger particles can be used which appears to result in the to formation of a direct bridge of diamond within the base material. Yet again a mixture of diamond particle sizes can be used to provide for close packing of the diamond particles within the base material.
A diamond compound with diamond particles carried in some suitable flexible carrier for use as an adhesive or a seal can be brought into contact with one or more of the surfaces to be joined or sealed and then rubbed on the surface or surfaces to roughen the surface and enhance adhesion or sealing. By way of example oxygen can be excluded from the contact area by using an oil or silicone based material.
In vie-,A, of the large number of diamond compounds that are envisaged in applications of the invention there are available many methods for manufacturing a diamond compound. Typically for use in a plastics material context the delivery mechanism can be tubes, syringes, pots or plastic bags containing the necessary base material (in the form of one or more components) and diamond particles which are mixed at the point of use by way of a two or more part dispenser with a mixing facility to subsequently polymerise.
INDUSTRIAL APPLICABILITY
The possible applications of a diamond compound are manifold. By using the diamond compound in relation to solid or liquid components the heat conducting properties of the resulting product are substantially enhanced. Without further modification the electrical conductivity of the product will remain unchanged so that the diamond compound can serve to link two related components while maintaining them electrically isolated to a greater or lesser extent will provide for heat to be conducted readily between the two components. The diamond compound can thus be used in connection with electronic units, circuit boards, semiconductor chips or whatever.
It is further envisaged that the while taking advantage of the considerably improved thermal conductivity provided in a diamond compound by suitable modification of the diamond particles prior during or following the mixing step by means of which the compound is produced it is possible to provide for other required characteristics. This the diamond particles can be given a coating such that when the coated diamond particles are mixed to form the diamond compound the compound reflects the properties generated by way of the coating. Thus the coating could be a metal such as gold to improve the electrical conductivity of the diamond compound. It is further envisaged that a semi-conductor material coating could be used to create a desired characteristic in a diamond compound.
Amongst a very wide range of possible uses the following are offered by way of example.
Improvement in the performance of optical glasses as the optical characteristics of diamond are outstandingly good over a wide spectrum of light while other characteristics enabling further benefits to be obtained, Increase thermal conductivity in electrical contacts, including those of brass, copper, gold, graphite or carbon, used in switches, contact sets, electric motors, spark plugs and so on. The diamond will tend to make such products longer lasting by being in effect self cleaning and more resistant to abrasion.
Improvement in heat removal and strength of casings, sheets, boards or whatever.
Can usefully be added to potting compounds and to serve as casing compound for micro chips, semiconductors and other micro-electronic components and assemblages. Can be sprayed over whole circuit boards to provide for cooling and 6 physical protection. The benefits would be particularly valuable in relation to aerospace and transport applications generally.
Useful in lamp making where there is a need to improve heat conductivity of components in the vicinity of incandescent filaments especially in applications where 5 the lamps are necessarily of relatively small size but run at a high rating.
Beneficial for use in metal components such a knives for surgical use, For use in structural extrusions and high stress components whether predominantly of metal, composite materials, extrusions or mouldings.
For use in any applications requiring high strength, high temperature, good heat conduction, for use in components previously lacking heat conducting characteristics such as seals, gaskets used throughout industry.
It is also envisaged that the formation of a diamond compound as a fibre or yarn will provide for strong abrasion resistance.
For use as an additive to materials likely to be subject to wear.

Claims (1)

  1. 7 CLAIMS
    1 A method of modifying the thermal conductivity of a base material comprising the step of mixing the base material, at least when the base material is in a mobile state, with diamond particles.
    2 A method of modifying as claimed in Claim 1 wherein the diamond particles are of a particle size lying the range 1 to 100 microns.
    3 A method as claimed in any preceding claim wherein the particles are similar in size or a mixture of particles of relatively large and small sizes.
    4 A material comprising a base material mixed with diamond particles in sufficient amounts to significantly increase the thermal conductivity of the mixed base material as against the thermal conductivity of the base material.
    A material as claimed in Claim 4 wherein the base material comprises one or more of the following: ABS, acetal, acrylic, cellulose based materials including nitro-cellulose, epoxy and vinyl resin materials, melamine, polyamides polyesters, polyethers, polyimides, polyolefins, polysulphones, polytetrafluorethylene, polyvinylcWoride, PPO, rubbers (natural and artificial) including butyl, nitrile and neoprene, silanes, silicones, styrene's, urea formaldehyde, urethanes or polyurethane's, vinyl's.
    6 A material as claimed in Claim 4 or Claim 5 wherein the base material includes one or more of the following: aluminium, copper, gold, iron, lead, mercury, molybdenum, nickel, platinum, silver, titanium, tungsten, zinc 8 7 A material as claimed in Claim 6 wherein the base material includes one or more alloys (such as brass, bronze, steel) including solders and brazing compounds.
    8 A material as claimed in Claim 4 wherein the base material includes one or more of the following: alumina, asbestos, carbon, chalk, glasses including hard glasses, graphite, gypsum, mica, organic peroxides, oxides (inorganic) such as those of iron, titanium, chromium; quartz, silica, silicon and silicon based materials, talc 9 A material as claimed in Claims 4 - 8 including a plasticiser.
    A material as claimed in Claim 4 - 10 wherein the base material is selected to provide a vehicle for the diamond particles for a material intended to function as at least one member of the following group: adhesive, sealant, grease, lubricant, sheet, mouldable compounds, potting compound, solid, extrusion.
    12 A material as claimed in Claim 4 - 10 formed from an initial mixture of the base material and the diamond particles are in the form of a member of the following group: gel, liquid, spray, powder, solid, extrusion.
GB0017293A 1999-07-14 2000-07-14 Diamond-containing materials having modified thermal conductivity Withdrawn GB2352241A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/GB2000/002642 WO2001004194A1 (en) 1999-07-14 2000-07-14 Method of, and material for, improving thermal conductivity
AU62972/00A AU6297200A (en) 1999-07-14 2000-07-14 Method of, and material for, improving thermal conductivity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9916563A GB9916563D0 (en) 1999-07-14 1999-07-14 Method of and material for improving thermal conductivity

Publications (2)

Publication Number Publication Date
GB0017293D0 GB0017293D0 (en) 2000-08-30
GB2352241A true GB2352241A (en) 2001-01-24

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GB9916563A Ceased GB9916563D0 (en) 1999-07-14 1999-07-14 Method of and material for improving thermal conductivity
GB0017293A Withdrawn GB2352241A (en) 1999-07-14 2000-07-14 Diamond-containing materials having modified thermal conductivity

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1566402A2 (en) * 2004-02-19 2005-08-24 Martin Siller Mineral or precious stone containing moulded parts

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2554113A1 (en) * 1983-10-26 1985-05-03 Charbit Eric Process for introducing precious stones into the manufacture of materials and thus increasing their strength, and products thus obtained.
JPS61145266A (en) * 1984-12-19 1986-07-02 Sumitomo Electric Ind Ltd Adhesive
JPS62179570A (en) * 1986-02-04 1987-08-06 Sumitomo Electric Ind Ltd Diamond paste
EP0379773A1 (en) * 1989-01-27 1990-08-01 Digital Equipment Corporation Thermally conductive electrically resistive diamond filled epoxy adhesive
US5095052A (en) * 1990-06-28 1992-03-10 The United States Of America As Represented By The Secretary Of The Air Force Low impulse coatings
EP0531867A1 (en) * 1991-09-09 1993-03-17 Sumitomo Bakelite Company Limited Resin paste for tight sealing
US5314514A (en) * 1992-05-13 1994-05-24 Fuji Photo Film Co., Ltd. Abrasive tape
EP0691413A2 (en) * 1993-04-06 1996-01-10 Sumitomo Electric Industries, Ltd. Diamond reinforced composite material and method of preparing the same
CN1119985A (en) * 1995-06-08 1996-04-10 *** Manufacture technology of diamond rubber tyre
RU2114874C1 (en) * 1994-09-29 1998-07-10 Институт неметаллических материалов СО РАН Antifriction polymer composition with sealing capability

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2554113A1 (en) * 1983-10-26 1985-05-03 Charbit Eric Process for introducing precious stones into the manufacture of materials and thus increasing their strength, and products thus obtained.
JPS61145266A (en) * 1984-12-19 1986-07-02 Sumitomo Electric Ind Ltd Adhesive
JPS62179570A (en) * 1986-02-04 1987-08-06 Sumitomo Electric Ind Ltd Diamond paste
EP0379773A1 (en) * 1989-01-27 1990-08-01 Digital Equipment Corporation Thermally conductive electrically resistive diamond filled epoxy adhesive
US5095052A (en) * 1990-06-28 1992-03-10 The United States Of America As Represented By The Secretary Of The Air Force Low impulse coatings
EP0531867A1 (en) * 1991-09-09 1993-03-17 Sumitomo Bakelite Company Limited Resin paste for tight sealing
US5314514A (en) * 1992-05-13 1994-05-24 Fuji Photo Film Co., Ltd. Abrasive tape
EP0691413A2 (en) * 1993-04-06 1996-01-10 Sumitomo Electric Industries, Ltd. Diamond reinforced composite material and method of preparing the same
RU2114874C1 (en) * 1994-09-29 1998-07-10 Институт неметаллических материалов СО РАН Antifriction polymer composition with sealing capability
CN1119985A (en) * 1995-06-08 1996-04-10 *** Manufacture technology of diamond rubber tyre

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
WPI Abstract Accession No. 1997-471827[44] & CN001119985 A *
WPI Abstract Accession No. 2000-036601[03] & RU002114874 C1 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1566402A2 (en) * 2004-02-19 2005-08-24 Martin Siller Mineral or precious stone containing moulded parts
EP1566402A3 (en) * 2004-02-19 2005-11-09 Martin Siller Mineral or precious stone containing moulded parts

Also Published As

Publication number Publication date
GB9916563D0 (en) 1999-09-15
GB0017293D0 (en) 2000-08-30

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