GB2345801B - Wire wound electronic component - Google Patents

Wire wound electronic component

Info

Publication number
GB2345801B
GB2345801B GB0008557A GB0008557A GB2345801B GB 2345801 B GB2345801 B GB 2345801B GB 0008557 A GB0008557 A GB 0008557A GB 0008557 A GB0008557 A GB 0008557A GB 2345801 B GB2345801 B GB 2345801B
Authority
GB
United Kingdom
Prior art keywords
electronic component
wire wound
wound electronic
wire
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0008557A
Other versions
GB0008557D0 (en
GB2345801A (en
Inventor
Hideki Ogawa
Hideo Aoba
Yoshihiro Amada
Takayuki Uehara
Kazuhiko Otsuka
Hideyuki Karasawa
Nobuyasu Shiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9237687A external-priority patent/JPH1167517A/en
Priority claimed from JP9237690A external-priority patent/JPH1167521A/en
Priority claimed from JP9237688A external-priority patent/JPH1167519A/en
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority claimed from GB9817928A external-priority patent/GB2329762B/en
Publication of GB0008557D0 publication Critical patent/GB0008557D0/en
Publication of GB2345801A publication Critical patent/GB2345801A/en
Application granted granted Critical
Publication of GB2345801B publication Critical patent/GB2345801B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H01F41/127—Encapsulating or impregnating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/045—Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/005—Impregnating or encapsulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Insulating Of Coils (AREA)
GB0008557A 1997-08-19 1998-08-17 Wire wound electronic component Expired - Fee Related GB2345801B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP9237687A JPH1167517A (en) 1997-08-19 1997-08-19 Winding-type electronic component, sealing resin, and filler
JP9237690A JPH1167521A (en) 1997-08-19 1997-08-19 Wire wound electronic component and its manufacture
JP9237688A JPH1167519A (en) 1997-08-19 1997-08-19 Wire wound electronic component
GB9817928A GB2329762B (en) 1997-08-19 1998-08-17 Wire wound electronic component

Publications (3)

Publication Number Publication Date
GB0008557D0 GB0008557D0 (en) 2000-05-24
GB2345801A GB2345801A (en) 2000-07-19
GB2345801B true GB2345801B (en) 2001-08-08

Family

ID=27451821

Family Applications (5)

Application Number Title Priority Date Filing Date
GB0008555A Withdrawn GB2345799A (en) 1997-08-19 1998-08-17 Filler material for a wire wound electronic component
GB0008559A Expired - Fee Related GB2345803B (en) 1997-08-19 1998-08-17 Wire wound electronic component
GB0008558A Expired - Fee Related GB2345802B (en) 1997-08-19 1998-08-17 Wire wound electronic component
GB0008556A Withdrawn GB2345800A (en) 1997-08-19 1998-08-17 Method of manufacture for a wire wound electronic component
GB0008557A Expired - Fee Related GB2345801B (en) 1997-08-19 1998-08-17 Wire wound electronic component

Family Applications Before (4)

Application Number Title Priority Date Filing Date
GB0008555A Withdrawn GB2345799A (en) 1997-08-19 1998-08-17 Filler material for a wire wound electronic component
GB0008559A Expired - Fee Related GB2345803B (en) 1997-08-19 1998-08-17 Wire wound electronic component
GB0008558A Expired - Fee Related GB2345802B (en) 1997-08-19 1998-08-17 Wire wound electronic component
GB0008556A Withdrawn GB2345800A (en) 1997-08-19 1998-08-17 Method of manufacture for a wire wound electronic component

Country Status (1)

Country Link
GB (5) GB2345799A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6534707B1 (en) * 2000-10-11 2003-03-18 Visteon Global Technologies, Inc. Method for absorbing active, external and dynamic magnetic fields using a ferrite encapsulated coating
DE60222815T2 (en) 2001-04-03 2008-07-03 AUTONETWORKS Technologies, LTD., Yokkaichi Optical connector, optical element mounting device, and optical connector mounting part
JP3847693B2 (en) * 2002-09-30 2006-11-22 シャープ株式会社 Manufacturing method of semiconductor device
EP1684316A1 (en) * 2005-01-20 2006-07-26 Delphi Technologies, Inc. A resin encapsulated device and method of manufacture
JP6377336B2 (en) * 2013-03-06 2018-08-22 株式会社東芝 Inductor and manufacturing method thereof
CN106229137B (en) * 2016-10-13 2018-05-18 伊戈尔电气股份有限公司 A kind of transformer dosing technology
DE102022111363A1 (en) * 2022-05-06 2023-11-09 Tdk Electronics Ag Inductive filter element

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2044550A (en) * 1979-03-09 1980-10-15 Gen Electric Case inductive circuit components
EP0234085A1 (en) * 1986-02-08 1987-09-02 Matsushita Electric Works, Ltd. Epoxy resin encapsulating composition
EP0307157A2 (en) * 1987-09-11 1989-03-15 Polyplastics Co. Ltd. Low stress encapsulant composition
JPH04338613A (en) * 1991-05-15 1992-11-25 Murata Mfg Co Ltd Magnetic shielding resin
US5189080A (en) * 1989-04-25 1993-02-23 Robert Bosch Gmbh Epoxy resin composition for encapsulating electric circuit components

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1213500B (en) * 1961-09-28 1966-03-31 Philips Patentverwaltung Heat well conductive insulating film with filler
JPS59119708A (en) * 1982-12-24 1984-07-11 Hotsukou Denshi Kk Shield type inductance element
JPS59129118A (en) * 1983-01-15 1984-07-25 Fujikura Ltd Thermally shrinkable plastic molded object
JPS60204023A (en) * 1984-03-28 1985-10-15 Hitachi Ltd Dynamic coordinate reader
JPS6177625A (en) * 1984-09-21 1986-04-21 Taiyo Yuden Co Ltd Manufacture of ferrite magnetic powdery body for magnetic paint
JPS61113642A (en) * 1984-11-09 1986-05-31 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing use
DD242817A1 (en) * 1985-11-19 1987-02-11 Nuenchritz Chemie epoxy molding compounds
JPS63318112A (en) * 1987-06-20 1988-12-27 Tdk Corp Inductance element and manufacture thereof
JP2675086B2 (en) * 1988-07-22 1997-11-12 株式会社日立製作所 Resin mold coil
JPH02208908A (en) * 1989-02-08 1990-08-20 Murata Mfg Co Ltd Inductance element and manufacture thereof
JP3142858B2 (en) * 1990-06-06 2001-03-07 北川工業株式会社 Ferrite molded product and its manufacturing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2044550A (en) * 1979-03-09 1980-10-15 Gen Electric Case inductive circuit components
EP0234085A1 (en) * 1986-02-08 1987-09-02 Matsushita Electric Works, Ltd. Epoxy resin encapsulating composition
EP0307157A2 (en) * 1987-09-11 1989-03-15 Polyplastics Co. Ltd. Low stress encapsulant composition
US5189080A (en) * 1989-04-25 1993-02-23 Robert Bosch Gmbh Epoxy resin composition for encapsulating electric circuit components
JPH04338613A (en) * 1991-05-15 1992-11-25 Murata Mfg Co Ltd Magnetic shielding resin

Also Published As

Publication number Publication date
GB0008556D0 (en) 2000-05-24
GB0008557D0 (en) 2000-05-24
GB2345800A (en) 2000-07-19
GB2345799A (en) 2000-07-19
GB2345803B (en) 2001-06-20
GB2345801A (en) 2000-07-19
GB2345802A (en) 2000-07-19
GB2345802B (en) 2001-08-01
GB0008555D0 (en) 2000-05-24
GB2345803A (en) 2000-07-19
GB0008558D0 (en) 2000-05-24
GB0008559D0 (en) 2000-05-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20130817