GB2343995B - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
GB2343995B
GB2343995B GB9927232A GB9927232A GB2343995B GB 2343995 B GB2343995 B GB 2343995B GB 9927232 A GB9927232 A GB 9927232A GB 9927232 A GB9927232 A GB 9927232A GB 2343995 B GB2343995 B GB 2343995B
Authority
GB
United Kingdom
Prior art keywords
wiring board
printed wiring
printed
board
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9927232A
Other versions
GB9927232D0 (en
GB2343995A (en
Inventor
Yuji Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB9927232D0 publication Critical patent/GB9927232D0/en
Publication of GB2343995A publication Critical patent/GB2343995A/en
Application granted granted Critical
Publication of GB2343995B publication Critical patent/GB2343995B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB9927232A 1998-11-20 1999-11-17 Printed wiring board Expired - Fee Related GB2343995B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33178798A JP2000156564A (en) 1998-11-20 1998-11-20 Printed wiring board and production thereof

Publications (3)

Publication Number Publication Date
GB9927232D0 GB9927232D0 (en) 2000-01-12
GB2343995A GB2343995A (en) 2000-05-24
GB2343995B true GB2343995B (en) 2002-01-16

Family

ID=18247644

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9927232A Expired - Fee Related GB2343995B (en) 1998-11-20 1999-11-17 Printed wiring board

Country Status (2)

Country Link
JP (1) JP2000156564A (en)
GB (1) GB2343995B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060180344A1 (en) * 2003-01-20 2006-08-17 Shoji Ito Multilayer printed wiring board and process for producing the same
JP2006253286A (en) * 2005-03-09 2006-09-21 Kyocera Corp Ceramic circuit board and manufacturing method thereof
JP4705400B2 (en) * 2005-04-01 2011-06-22 日本シイエムケイ株式会社 Manufacturing method of multilayer printed wiring board
JP4730426B2 (en) 2008-11-19 2011-07-20 ソニー株式会社 Mounting substrate and semiconductor module
CN103052279A (en) * 2011-10-11 2013-04-17 欣兴电子股份有限公司 Circuit board and manufacture method thereof.
JP6418757B2 (en) * 2014-03-03 2018-11-07 新光電気工業株式会社 WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE
CN107846789A (en) * 2017-11-24 2018-03-27 郑州云海信息技术有限公司 A kind of design method for solving PCB layout density

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2111313A (en) * 1981-12-11 1983-06-29 Western Electric Co Multi-layer circuit board fabrication
JPH0779078A (en) * 1993-09-08 1995-03-20 Shinko Electric Ind Co Ltd Multilayer wiring board and manufacture thereof
JPH08181458A (en) * 1994-12-27 1996-07-12 Sony Corp Multilayer printed circuit board and manufacture thereof
EP0743681A2 (en) * 1995-05-18 1996-11-20 Nec Corporation Wiring board for electronic devices with high-density terminals and method for producing same
US5582745A (en) * 1992-12-12 1996-12-10 International Business Machines Corporation Method of making circuit boards with locally enhanced wiring density
JPH09186510A (en) * 1995-12-27 1997-07-15 Fuji Elelctrochem Co Ltd Composite circuit module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2111313A (en) * 1981-12-11 1983-06-29 Western Electric Co Multi-layer circuit board fabrication
US5582745A (en) * 1992-12-12 1996-12-10 International Business Machines Corporation Method of making circuit boards with locally enhanced wiring density
JPH0779078A (en) * 1993-09-08 1995-03-20 Shinko Electric Ind Co Ltd Multilayer wiring board and manufacture thereof
JPH08181458A (en) * 1994-12-27 1996-07-12 Sony Corp Multilayer printed circuit board and manufacture thereof
EP0743681A2 (en) * 1995-05-18 1996-11-20 Nec Corporation Wiring board for electronic devices with high-density terminals and method for producing same
JPH09186510A (en) * 1995-12-27 1997-07-15 Fuji Elelctrochem Co Ltd Composite circuit module

Also Published As

Publication number Publication date
GB9927232D0 (en) 2000-01-12
JP2000156564A (en) 2000-06-06
GB2343995A (en) 2000-05-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20091117