GB2342152A

GB2342152A - Plate type heat pipe and its installation structure

Info

Publication number: GB2342152A
Application number: GB9928393A
Authority: GB
Inventors: Masaaki Yamamoto; Masami Ikeda; Tatsuhiko Ueki; Hitoshi Sho
Original assignee: Furukawa Electric Co Ltd
Current assignee: Furukawa Electric Co Ltd
Priority date: 1998-04-15
Filing date: 1999-04-07
Publication date: 2000-04-05
Anticipated expiration: 2019-04-07
Also published as: DE19980819T1; GB2342152B; TW414854B; WO1999053256A1; GB9928393D0; CN1263592A; JP4278720B2; CN1179188C

Abstract

A plate type heat pipe, comprising an enclosed container having principal plane parts (A) and (B) opposed to each other, at least one heat transfer block for heat transfer installed in the container so that the inner wall of the principal plane part (A) is connected through the heat transfer block to the inner wall of the principal plane part (B), a wick disposed in the container at at least one part of the heat transfer block, and a working fluid sealed in the container.

Description

2342152 Specification =E OE THE INVEYTIO Plate type heat pipe and cooling

device using same

FIELD OF THE INVEN-TIGN

The present invention relates to a plate type heat pipe to effectively cool electric or electronic parts such as semiconductor chips and a cooling device using the above-mentioned plate type heat pipe.

BACKGROUND OF THE INVENTIO

Electric or electronic components such as semiconductor chips or the like mounted on electric or electronic devices such as electrical power equipment, various devices such as personal computers or the like generate heat in some extent when used. When the electric or electronic parts are excessively heated, the performance thereof is lowered, or the lifetime thereof is shortened. Recently, electric devices represented by personal computers are downsized, and the development of the technology to cool the electric or electronic components mounted on the electric device is therefore an important technical issue.

There is known as a method of cooling electric or electronic chips which is to be cooled (hereinafter referred to as "heat generating part"), for example, an air cooling type, i.e., a cooling method by means of ventilating air in the interior of devices by fans attached to the box of the electric device to cool same so as to prevent the temperature of the heat generating part from excessively rising. This cooling method is effective to cool a relatively large scale of electric device.

In addition to the above air cooling type, a cooling method by means of attaching heat dissipating fins or a heat sink to dissipate the heat through 1 the fins or the heat sink is considered to be an effective method. There is further a cooling method to install a heat pipe between the heat sink or fins and the heat generating part. Furthermore, there is known a technology to blow an air to the heat sink or the fins by a motor driven fan to obtain higher cooling performance.

The mechanism of the heat pipe is briefly described hereunder. The heat pipe includes a container having a hermetically sealed hollow portion, i. e., cavity therein, and a working fluid enclosed within the container. A heat is transferred by means of phase transition and movement of a working fluid accommodated in the hollow portion of the container. Although some of the heat is transferred through the material of the container, an amount of the heat thus transferred through the container is relatively small compared with the heat transferred by the phase transition and movement of the working fluid in the container.

Then, the mechanism of the heat pipe in operation is briefly described. In a round tube type heat pipe, a heat generating part is connected to one end portion of the heat pipe, and fins for dissipating heat are connected to the other end portion of the heat pipe. In the portion of the heat pipe to which the heat generating part is attached (hereinafter referred to as "heat absorbing portion" or "heat absorbing side"), the working fluid evaporates by the heat transferred through the material of the container in its thickness direction, the evaporated working fluid swiftly flows to the portion to which the fins are attached (hereinafter referred to as "heat dissipating portion" or "heat dissipating side"). 'Me thus flowed evaporated working fluid is condensed and returns back to a liquid phase in the heat dissipating portion, and the heat thus transferred by the evaporated working fluid is dissipated from the interior of the container through the fins to the outside of the heat pipe. The heat is thus transferred from the heat absorbing portion to the heat dissipating portion.

2 In order to continuously carry out the above-mentioned heat transfer, it is necessary that the working fluid returned back to the liquid phase in the heat dissipating side has to be flowed back (circulates) to the heat absorbing side. In the heat pipe with the use of gravity, the heat absorbing side is positioned below the heat dissipating side (this mode is called as "bottom heat mode"). In this case, the working fluid returned back to the liquid phase in the heat dissipating side circulates to the heat absorbing side by gravity. However, in case that the heat absorbing side is positioned above the heat dissipating side (this mode is called as "top heat mode"), the circulation of the working fluid to the heat absorbing side is not sufficiently carried out, thus the so- called dry out phenomenon may occurs.

As the shape of the heat pipe, there is a round pipe (tube) type as its representing shape. In addition, recently attention is paid to a plate type heat type. Die plate type heat pipe may be called as a flat type heat pipe or flat plate type heat pipe. 'llie plate type heat pipe has a merit in which the heat generating part such as semiconductor chip may be contacted with the plate type heat pipe in wide area because of its shape.

More specifically, in the plate type heat pipe, the heat generating part may be contacted with a wide main surface of the heat pipe. The heat pipe is preferably used in the bottom heat mode even when the plate type heat pipe is applied, in order to maintain more secure circulation of the working fluid, as required in the round pipe type heat pipe. As a favorable cooling device with the use of the plate type heat pipe, there is considered a cooling device in which the plate type heat pipe is arranged in such manner that one of the main surface of the heat pipe faces downward, the heat generating part is contacted with thus downward facing main surface of the plate type heat pipe, and a heat sink is fixed on the other upwardly facing main surface of the heat pipe. According to the above-mentioned cooling device, the lower main surface of the heat pipe becomes the heat absorbing side, and the upper main 3 surface of the heat pipe to which the heat sink is fixed becomes the heat dissipating side, thus the heat plate type pipe is in the bottom heat mode.

However, recently the down sizing of the computer or the like progresses. Furthermore, there increases the change from installation type to mobile type in the kinds of the electric or electronic devices in which heat generating parts are mounted. In particular, a small sized computer or the like is considered to be used under the condition in which the computer is inclined to some extent. Accordingly, it is expected to provide a plate type heat pipe in which the performance of the heat pipe can be maintained to a pretty sufficient extent even applied in the top heat mode.

SUMMARY OF THE INYENTIO

The inventors have studied intensively to overcome the abovementioned conventional heat pipe. As a result, it is found that when a heat transfer block for transferring heat is disposed in the interior of the container between a main surface portion A and a main surface portion B facing each other so as to connect the inner wall of the main surface portion A to the inner wall of the main surface portion B, and in addition, a wick is arranged on at least a part of the heat transfer block, there may be provided a plate type heat pipe effectively maintaining the cooing performance of the plate type heat pipe even if used in the top heat mode under the condition in which the heat pipe is inclined. The present invention is made on the basis of the above finding.

The first embodiment of the plate type heat pipe of the present invention comprises:

a hermetically sealed container including a main surface portion A and main surface portion B facing each other; at least one heat transfer block disposed in a interior of said container in such manner that said heat transfer blocks is connected to both an inner 4 wall of said main surface portion A and an inner wall of said main surface portion B; a wick disposed at least on a part of said heat transfer block in the interior of said container; and a working fluid enclosed in the interior of said container.

In the second embodiment of the plate type heat pipe of the present invention, each of said main surface portion A and said main surface portion B comprises a flat plate material member.

In the third embodiment of the plate type heat pipe of the present invention, any one of said main surface portion A and said main surface portion B includes at least one protruding portions extending outward said container.

In the fourth embodiment of the plate type heat pipe of the present invention, a plurality of said protruding portions with different length extend outward said container.

In the fifth embodiment of the plate type heat pipe of the present invention, a plurality of said protruding portions with same length extend outward said container.

In the sixth embodiment of the plate type heat pipe of the present invention, said heat transfer block is disposed so as to be connected to each of said at least one protruding portions.

In the seventh embodiment of the plate type heat pipe of the present invention, said heat transfer block is disposed so as to be connected to at least one of plurality of said protruding portions.

In the eighth embodiment of the plate type heat pipe of the present invention, said heat transfer block comprises a column shaped or a square pillar shaped heat transfer block, and said heat transfer block is connected to both an inner wall of said main surface portion A and an inner wall of said main surface portion B by metal bonding.

In the ninth embodiment of the plate type heat pipe of the present invention, said wick is disposed at least on a part of each of an inner wall of said main surface portion A, an inner wall of said main surface portion B, and side walls of said heat transfer block.

In the tenth embodiment of the plate type heat pipe of the present invention, said wick is disposed across all surface of either said inner wall of said main surface portion A or said inner wall of said main surface portion B. In the eleventh embodiment of the plate type heat pipe of the present invention, said wick is disposed across all surface of either said inner wall of said main surface portion A or said inner wall of said main surface portion B, and all surface of side walls of said heat transfer block.

In the twelfth embodiment of the plate type heat pipe of the present invention, said wick is extended along through the side wall of said heat transfer block to the inner wall of other main surface portion on which said wick is not disposed, and disposed on said other main surface portion with said wick folded at a portion between said heat transfer block and said other main surface portion.

In the thirteenth embodiment of the plate type heat pipe of the present invention, said wick is disposed in such manner as being contacted or bonded with at least one of the inner wall of said main surface portion A, the inner wall of said main surface portion B and the side wall of said heat transfer block.

In the fourteenth embodiment of the plate type heat pipe of the present invention, said wick is fixed by the side surface of said heat transfer block and the inner wall of said protruding portion.

In the fifteenth embodiment of the plate type heat pipe of the present invention, a heat generating part is attached to an outer surface of said protruding portion to which said heat transfer block is connected.

In the sixteenth embodiment of the plate type heat pipe of the present 6 invention, a fin is disposed on an outer surface of any one of said main surface portion A and said main surface portion B. A cooling device of the present invention comprises said plate type heat- pipe as described in any one of the first to seventh embodiments disposed so as to face a printed wiring board on which at least one heat generating parts are mounted in such manner that at least one said heat generating parts are connected to at least one portions of said main surface portion to which at least one said heat transfer blocks are connected.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a descriptive view to show one of the embodiments of the plate type heat pipe of the invention; Fig. 2 is a descriptive view to show another embodiment of the plate type heat pipe of the invention; Fig. 3 is a partially enlarged descriptive view of Fig. 2.

DETAILED DESCRIPDON OF THE PREFERRED EM130DIMENTS The plate type heat pipe of the present invention maintains excellent performance even in the so-called top heat mode.

The plate type heat pipe of the present invention comprises (1) a hermetically sealed container including a main surface portion A (for example, upper surface portion) and a main surface portion B (for example, upper surface portion) facing each other, (2) at least one heat transfer block disposed in a interior of said container in such manner that said heat transfer blocks is connected to both an inner wall of said main surface portion A and an inner wall of said main surface portion B, (3) a wick disposed at least on a part of said heat transfer block in the interior of said container, and (4) a working fluid enclosed in the interior of said container.

Furthermore, in the plate type heat pipe of the invention, each of the 7 main surface portion A and the main surface portion B comprises a flat plate material member. Furthermore, in the plate type heat pipe of the invention, any one of the main surface portion A and the main surface portion B may includes at least one protruding portions extending outward from the body of the container. In the plate type heat pipe of the invention, the abovementioned protruding portions with different length may extend outward the container. In the plate type heat pipe of the invention, the above-mentioned protruding portions with same length may extend outward the container.

Furthermore, in the plate type heat pipe of the invention, the heat transfer block may be disposed so as to be connected to each of at least one protruding portions.

Furthermore, in the plate type heat pipe of the invention, the heat transfer block may be disposed so as to be connected to at least one of the plurality of protruding portions.

Furthermore, in the plate type heat pipe of the invention, the heat transfer block comprises a column shaped heat transfer block or a square pillar shaped heat transfer block, and the heat transfer block may be connected to both an inner wall of the main surface portion A and an inner wall of the main surface portion B by metal bonding.

Furthermore, in the plate type heat pipe of the invention, the wick is disposed at least on a part of each of an inner wall of the main surface portion 1 A, an inner wall of the main surface portion B, and a side wall of the heat transfer block. In the plate type heat pipe of the invention, the wick is disposed across all surface of either the inner wall of the main surface portion A or the inner wall of the main surface portion B. In the plate type heat pipe of the invention, the wick is disposed across all surface of either the inner wall of the main surface portion A or the inner wall of the main surface portion B, and all surface of side walls of the heat transfer block.

In the plate type heat pipe of the invention, the wick is extended along 8 through the side wall of the heat transfer block to the inner wall of other main surface portion on which the wick is not disposed, and disposed on the other main surface portion with the wick folded at a portion between the heat transfer block and the other main surface portion Furthermore, in the plate type heat pipe of the invention, the wick is disposed in such manner as being contacted or bonded with at least one of the inner wall of the main surface portion A, the inner wall of the main surface portion B and the side wall of the heat transfer block.

In the plate type heat pipe of the invention, the wick may be fixed by the side surface of the heat transfer block and the inner wall of the protruding portion.

In the plate type heat pipe of the invention, a heat generating part may be attached to an outer surface of the protruding portion with the heat transfer block connected therein.

In the plate type heat pipe of the invention, a fin may be disposed on an outer surface of any one of the main surface portion A and the main surface portion B. Furthermore, in the cooling device of the present invention, the plate type heat pipe as described above is disposed so as to face a printed wiring board on which at least one heat generating parts are mounted, and at least one heat generating parts are connected to at least one positions of the heat pipe in the interior of which at least one heat transfer blocks are disposed on.

The above-mentioned position may be the protruding portion or the flat portion.

The plate type heat pipe of the present invention is further described in detail with reference to the drawings. Fig. 1 is a descriptive view to show one of the embodiments of the plate type heat pipe of the invention, and the cooling device using the plate type heat pipe of the invention. The substrate 30 is for example a printed wiring board or the like, and the heat generating 9 part 40 such as semiconductor or the like is mounted thereon. The reference numeral 31 designates a lead.

The plate type heat pipe 1 is arranged in such manner that one of the main surface portions of the container contacts the upper surface of the heat generating part 40. The heat pipe 1 may be directly contacted with the heat generating part 40, or contacted with the heat generating part through a heat transfer grease or the like. In some case, the heat pipe is joined to the heat generating part by soldering or the like. The material of the container constituting the plate type heat pipe is not specifically limited. However, when such materials excellent in heat conductivity as a copper material or an aluminum material is used, the plate type heat pipe having an excellent heat performance can be obtained, thus favorable. There are listed as the copper material, JIS (Japanese Industrial Standard) C1020 type, C1100 type or the like, and as the aluminum material, JIS A1100 type, A3000 type, A5000 type, A6000 type or the like.

Within the hollow portion 13 of the plate type heat pipe of the invention, (not shown) an appropriate amount of working fluid is contained. There are water, substituted Freon, ammonium, alcohol, acetone or the like as the working fluid.

The heat transfer block 11 is disposed on the corresponding position in the interior of the container of the plate type heat pipe 1 to the portion to which the heat generating part 40 is connected. The heat transfer block 11 contacts the inner walls of the upper main surface portion and the lower main surface portion of the container in the hollow portion 13. The heat transfer block 11 may be metal bonded to the respective inner walls by soldering or the like. When the heat transfer block 11 is joined to the inner walls by metal bonding, the heat resistance becomes small, thus favorable.

The wick 12 is disposed within the hollow portion 13. More specifically, the wick 12 is arranged along the inner wall of the upper plate member of the container 10 (i.e., upper main surface portion of the container 10), and then, further along the side surface of the heat transfer block 11 to extend to the inner wall of the lower plate member of the container 10. More specifically, the tip portion of the wick contacts with the inner wall of the lower plate member. In the embodiment as shown in Fig. 1, the wick 12 is arranged along the inner wall of the upper plate member and then the side surface of the heat transfer block 11 to the inner wall of the lower plate member so as to cause the folded tip portion of the wick to contact with the inner wall of the lower plate member of the container. With the wick thus arranged, the wick 12 can contacts with the inner wall of the lower plate member with further smaller heat resistance. The tip portion of the wick may be metal bonded to the inner wall of the lower plate member. With the metal bonding, the heat resistance between the wick and the inner wall becomes further smaller.

When the temperature of the heat generating part 40 rises, the heat generated by the heat generating part 40 is transferred to the upper plate member of the heat pipe 1 by the operation of the heat pipe, and the heat thus transferred is dissipated through the fins 14 to the outside of the heat pipe, thus the heat generating part 40 is cooled. As far as the heat pipe operated in the bottom heat mode is concerned, as shown in Fig. 1, the working fluid in the interior of the heat pipe is expected to circulate (i.e., the working fluid is vaporized at the lower plate member, then reached to the upper plate member and condensed there, and then, the working fluid in the liquid phase flows back) by gravity. However, in case of the plate type heat pipe 1 of the present invention, even if the heat pipe is largely inclined to be in the top heat mode, the circulation of the working fluid can be maintained by means of the capillary action of the specifically arranged wick 12.

In particular, since the wick 12 contacts with or is joined to the inner wall of the container, on which side of the container the heat generating part 11 is fixed, the working fluid is surely circulated. Furthermore, when the wick 12 is arranged so as to contact with or be joined to the heat transfer block 11, the circulation of the working fluid is further surely maintained. In particular, in the embodiment as shown in Fig. 1, since the heat transfer block 11 is disposed at the corresponding position of the lower plate member of the container to the position to which the heat generating part 40 is connected, the heat generated by the heat generating part 40 is transferred through the material of the container 10 directly to the heat transfer block 11. The heat transferred to the heat transfer block 11 is cooled on the wide side surfaces of the heat transfer block by the working fluid (in liquid phase) circulating along the wick 12.

Other embodiment of the plate type heat pipe of the invention is described with reference to Figs. 2 and 3. The plate type heat pipe 2 of the invention has a container 20 which includes a plurality of protruding portions (in this case, three protruding portions) in one of the main surface portions. Each of the three protruding portions has the corresponding height to the respective heat generating parts 41 to 43 mounted through the lead 31 on the printed wiring board 30. In other words, the lower plate member (i.e., one of the main surface portion) of the container is substantially parallel to the printed wiring board while each of the three protruding portions contacts with the respective heat generating parts. In this embodiment, the container 20 is formed by joining the upper plate member 201 and the lower plate member 202. As shown in Fig. 2, three protruding portions are formed in the lower plate member 202 in advance by press forming. The working fluid (not shown) in an appropriate amount is enclosed within the hollow portion 22 of the container 20. The heat sink 50 is attached to the outer surface of the upper plate member of the container. The heat sink comprises, for example, a heat dissipating block or the like made of aluminum material.

The heat transfer blocks 23 to 25 are arranged in the interior of three 12 protruding portions, respectively. 7lie heat transfer block may be arranged in at least one protruding portions. In this case, the heat transfer block is arranged in each of all three protruding portions. '111e wick 21 is disposed in the hollow portion 22. 71e wick 21 is arranged so as to contact with the inner wall of the upper plate member of the container, then to contact with the side surfaces of the heat transfer blocks 23 to 25, and further to contact with or to be joined to the bottom portions of the protruding portions in the lower plate member of the container.

The wick 21 may be metal bonded by soldering, for example, to the bottom portion of the protruding portion. In the embodiment as shown in Fig. 2, three protruding portions are formed in the lower plate member 202 of the container 20, and each of the heat transfer blocks 23 to 25 is disposed in the protruding portions respectively. In this embodiment, the wick 21 is pinched between the side surface of the heat transfer block and the inner wall of the protruding portion. 7his is an effective means to fix the wick. Fig. 3 is a partially enlarged descriptive view of Fig. 2 to show the vicinity of the heat transfer block 24. As shown in Fig. 3, the wick 21 is pinched between the side surface of the heat transfer block 24 and the inner wall of the protruding portion of the lower plate member 202. According to the means to fix the wick as described above, the wick may be contacted with the inner wall and the heat transfer block with a small heat resistance without applying the process of a metal bonding, for example, soldering or the like, thus effective and practical.

The plate type heat pipe 2 of the invention as shown in Fig. 2 maintains the secure circulation of the working fluid even in the top heat mode as the above-mentioned plate type heat pipe 1 of the invention (as shown in Fig. 1) does. Furthermore, since the plate type heat pipe 2 has the protruding portions the heights of which correspond to the heights of the heat generating parts 23 to 25, i.e., the total height of the protruding portion and 13 the heat generating part is substantially equal, a plurality of heat generating parts having different heights mounted on the same printed wiring board can be cooled by the single plate type heat pipe, thus effective and practical.

EXAMPI The plate type heat pipe of the invention is described in detail by the example.

Example I

The container of the plate type heat pipe as shown in Fig. 1 was prepared by the use of the flat aluminum plate material of 1 mm in thickness, the size of which container was 100 mm in length, 70 mm in width and 6 mm in height. The aluminum heat transfer block of 25 mm in length, 25 mm in width and 4 mm in height, i.e., square pillar shape, was disposed at the corresponding position in the interior of thus prepared container to the position to which the heat generating part is attached. Each of the upper and lower surfaces of the heat transfer block was metal bonded to the upper inner wall and the lower inner wall of the container respectively.

In addition, as shown in Fig. 1, the wick is arranged on all the surface of the upper inner wall of the container, all the side surfaces of the heat transfer block, and a part of the lower inner wall of the container. The heat generating part is attached to the lower outer surface of the container. The interior of the container was evacuated and filled with water as the working fluid to prepare the plate type heat pipe of the invention.

Thus prepared plate type heat pipe of the invention was arranged in such manner that a MPU as the heat generating part mounted on the printed wiring board is placed to be in close contact through the heat transfer grease with the heat pipe. The above-mentioned plate type heat pipe of the invention was used under the condition of being inclined in 60 degrees from the horizontal plane. As a result, the MPU was effectively cooled without 14 causing the so-called dry out phenomenon.

Example 2

The container of the plate type heat pipe as shown in Fig. 2 was prepared by joining the upper plate member of the flat aluminum plate material of 1 mm in thickness, and the lower plate member of the aluminum plate material of 1 mm in thickness having three protruding portions formed by press forming. The heights of the three protruding portions were arranged so as to correspond to the respective heights of the heat generating parts. More specifically, the protruding portion in the central position was high, and the protruding portions at both sides are relatively lower. The size of the container was 100 mm in length, 70 mm in width and 6 mm in height. The height of the container in the central protruding portion was 9 mm, and the height of the container in the protruding portions at the both sides were 8 mm. The aluminum heat transfer block of 25 mm in length, 25 mrn in width and 7

mm in height, i.e., square pillar shape, was disposed in the central protruding portion in the interior of thus prepared container. Each of the aluminum heat transfer blocks of 25 mm in length, 25 mm in width and 6 mm in height, i.e., square pillar shape, was disposed in the respective protruding portions at both sides in the interior of thus prepared container. The upper and lower surfaces of each of the heat transfer blocks were metal bonded by soldering to the upper inner wall and the lower inner wall of the container, respectively.

Furthermore, as shown in Fig. 2, the wick was arranged on all surface of the upper inner wall, all side surfaces of the heat transfer blocks. In addition, as shown in Fig. 3, the tip portion of each of the wicks was pinched between the side surface of the heat transfer block and the inner wall of the protruding portion.

Furthermore, the interior of the container was evacuated and filled with water as the working fluid to prepare the plate type heat pipe of the invention.

Tlius prepared plate type heat pipe of the invention was arranged in such manner that MPUs having different heights as the heat generating parts mounted on the printed wiring board are placed to be in close contact through the heat transfer grease with the protruding portions of the heat pipe. The above-mentioned plate type heat pipe of the invention was used under the condition of being inclined in 60 degrees from the horizontal plane. As a result, MPUs were effectively cooled without causing the socalled dry out phenomenon.

As described in detail above, according to the present invention, there can be provided the plate type heat pipe maintaining excellent performance in cooling even in the so-called top heat mode. Accordingly, the cooling device using the plate type heat pipe of the invention maintains excellent cooling performance even in the top heat mode. For example, when the plate type heat pipe of the invention is applied to the electric or electronic device with the heat generating parts such as semiconductor chips mounted thereon, the electric or electronic device can be effectively cooled even the device is used under the condition of being inclined.

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Claims

WHAT IS CLAIMED IS: 1. A plate type heat pipe comprises: a hermetically

sealed container including a main surface portion A and main surface portion B facing each other; at least one heat transfer block disposed in a interior of said container in such manner that said heat transfer blocks is connected to both an inner wall of said main surface portion A and an inner wall of said main surface portion B; a wick disposed at least on a part of said heat transfer block in the interior of said container; and a working fluid enclosed in the interior of said container.
2. The plate type heat pipe as claimed in claim 1, wherein each of said main surface portion A and said main surface portion B comprises a flat plate material member.
3. The plate type heat pipe as claimed in claim 1, wherein any one of said main surface portion A and said main surface portion B includes at least one protruding portions extending outward said container.
4. The plate type heat pipe as claimed in claim 3, wherein a plurality of said protruding portions with different length extend outward said container.
5. The plate type heat pipe as claimed in claim 3, wherein a plurality of said protruding portions with same length extend outward said container.
6. The plate type heat pipe as claimed in claim 3, wherein said heat transfer block is disposed so as to be connected to each of said at least one protruding portions.
7. The plate type heat pipe as claimed in claim 3, wherein said heat transfer block is disposed so as to be connected to at least one of plurality of said protruding portions.
8. The plate type heat pipe as claimed in claim 2 or 3, wherein said heat transfer block comprises a column shaped or a square pillar shaped heat

17 transfer block, and said heat transfer block is connected to both an inner wall of said main surface portion A and an inner wall of said main surface portion B by metal bonding.
9. The plate type heat pipe as claimed in claim 1, wherein said wick is disposed at least on a part of each of an inner wall of said main surface portion A, an inner wall of said main surface portion B, and side walls of said heat transfer block.
10. The plate type heat pipe as claimed in claim 9, wherein said wick is disposed across all surface of either said inner wall of said main surface portion A or said inner wall of said main surface portion B.
11. Ile plate type heat pipe as claimed in claim 9, wherein said wick is disposed across all surface of either said inner wall of said main surface portion A or said inner wall of said main surface portion B, and all surface of side walls of said heat transfer block.
12. The plate type heat pipe as claimed in claim 10, wherein said wick is extended along through the side wall of said heat transfer block to the inner wall of other main surface portion on which said wick is not disposed, and disposed on said other main surface portion with said wick folded at a portion between said heat transfer block and said other main surface portion.
13. The plate type heat pipe as claimed in any one of claims 9 to 12, wherein said wick is disposed in such manner as being contacted or bonded with at least one of the inner wall of said main surface portion A, the inner wall of said main surface portion B and the side wall of said heat transfer block.
14. 'Re plate type heat pipe as claimed in claim 10 or 11, wherein said wick is fixed by the side surface of said heat transfer block and the inner wall of said protruding portion.
15. The plate type heat pipe as claimed in claim 6 or 7, wherein a heat generating part is attached to an outer surface of said protruding portion to 18 which said heat transfer block is connected.
16. The plate type heat pipe as claimed in claim 1, wherein a fin is disposed on an outer surface of any one of said main surface portion A and said main surface portion B.
17. A cooling device comprises said plate type heat pipe as claimed in any one of claims 1 to 7 disposed so as to face a printed wiring board on which at least one heat generating parts are mounted in such manner that at least one said heat generating parts are connected to at least one portions of said main surface portion to which at least one said heat transfer blocks are connected.

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