GB2340256B - Use of alkoxy N-Hydroxyalkyl alkanamide as resist removing agent composition for removing resist method for preparing the same and resist removing method. - Google Patents

Use of alkoxy N-Hydroxyalkyl alkanamide as resist removing agent composition for removing resist method for preparing the same and resist removing method.

Info

Publication number
GB2340256B
GB2340256B GB9918418A GB9918418A GB2340256B GB 2340256 B GB2340256 B GB 2340256B GB 9918418 A GB9918418 A GB 9918418A GB 9918418 A GB9918418 A GB 9918418A GB 2340256 B GB2340256 B GB 2340256B
Authority
GB
United Kingdom
Prior art keywords
resist
alkoxy
preparing
same
agent composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9918418A
Other versions
GB9918418D0 (en
GB2340256A (en
Inventor
Dong-Jin Park
Jin-Ho Hwang
June-Ing Gil
Je-Eung Park
Sang-Mun Chon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to GB0206688A priority Critical patent/GB2371544A/en
Publication of GB9918418D0 publication Critical patent/GB9918418D0/en
Publication of GB2340256A publication Critical patent/GB2340256A/en
Application granted granted Critical
Publication of GB2340256B publication Critical patent/GB2340256B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C215/00—Compounds containing amino and hydroxy groups bound to the same carbon skeleton
    • C07C215/02—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
GB9918418A 1998-08-05 1999-08-04 Use of alkoxy N-Hydroxyalkyl alkanamide as resist removing agent composition for removing resist method for preparing the same and resist removing method. Expired - Fee Related GB2340256B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0206688A GB2371544A (en) 1998-08-05 1999-08-04 Method for preparing an alkoxy N-hydroxyalkyl alkanamide

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR19980032355 1998-08-05
KR19980032354 1998-08-05
KR1019990020973A KR100335484B1 (en) 1998-08-05 1999-06-07 Use of an Alkoxy N-Hydroxyalkyl Alkanamide as Resist Removing Agent, Composition for Removing Resist, Method for Preparing the Same and Resist Removing Method Using the Same

Publications (3)

Publication Number Publication Date
GB9918418D0 GB9918418D0 (en) 1999-10-06
GB2340256A GB2340256A (en) 2000-02-16
GB2340256B true GB2340256B (en) 2002-06-19

Family

ID=27349792

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9918418A Expired - Fee Related GB2340256B (en) 1998-08-05 1999-08-04 Use of alkoxy N-Hydroxyalkyl alkanamide as resist removing agent composition for removing resist method for preparing the same and resist removing method.

Country Status (4)

Country Link
KR (1) KR100335484B1 (en)
CN (1) CN1249530C (en)
FR (1) FR2782176B1 (en)
GB (1) GB2340256B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6274537B1 (en) * 1998-08-05 2001-08-14 Samsung Electronics Co., Ltd. Use of alkoxy N-hydroxyalkyl alkanamide as resist removing agent, composition for removing resist, method for preparing the same and resist removing method using the same
KR100335484B1 (en) * 1998-08-05 2002-05-04 윤종용 Use of an Alkoxy N-Hydroxyalkyl Alkanamide as Resist Removing Agent, Composition for Removing Resist, Method for Preparing the Same and Resist Removing Method Using the Same
KR100360397B1 (en) * 1999-11-26 2002-11-18 삼성전자 주식회사 Resist removing composition and resist removing method using the same
JP4810764B2 (en) * 2001-06-29 2011-11-09 三菱瓦斯化学株式会社 Resist stripper composition
KR100468714B1 (en) * 2001-07-03 2005-01-29 삼성전자주식회사 Resist removing composition and resist removing method using the same
KR100434491B1 (en) 2001-08-17 2004-06-05 삼성전자주식회사 Resist or etching by-products removing composition and resist removing method using the same
KR101017738B1 (en) * 2002-03-12 2011-02-28 미츠비시 가스 가가쿠 가부시키가이샤 Photoresist stripping composition and cleaning composition
US7037852B2 (en) 2002-09-26 2006-05-02 Samsung Electronics Co., Ltd. Composition for stripping photoresist and method of preparing the same
JP4085262B2 (en) * 2003-01-09 2008-05-14 三菱瓦斯化学株式会社 Resist stripper
KR100751919B1 (en) 2005-11-18 2007-08-31 램테크놀러지 주식회사 Photoresist stripping composition and method of forming a pattern using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2199587A (en) * 1986-12-10 1988-07-13 Advanced Chem Tech Stripping compositions and use thereof
JPH02131239A (en) * 1988-11-11 1990-05-21 Nagase Denshi Kagaku Kk Composition of peeling agent
US5707947A (en) * 1991-01-25 1998-01-13 Ashland Inc. Organic stripping composition
JPH11125917A (en) * 1997-10-21 1999-05-11 Fuji Film Olin Kk Photoresist stripping solution

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2820801A (en) * 1958-01-21 Chjchj
US2704280A (en) * 1951-05-29 1955-03-15 Colgate Palmolive Co Long-chain aliphatic ether-amides in detergent compositions
US5204026A (en) * 1988-05-20 1993-04-20 The Boeing Company Solvent with alicyclic carbonate and ethylene dipropionate
US5690747A (en) * 1988-05-20 1997-11-25 The Boeing Company Method for removing photoresist with solvent and ultrasonic agitation
JPH02253265A (en) * 1989-03-28 1990-10-12 Nippon Zeon Co Ltd Resist peeling agent
US5753601A (en) * 1991-01-25 1998-05-19 Ashland Inc Organic stripping composition
JPH08190205A (en) * 1995-01-10 1996-07-23 Mitsubishi Gas Chem Co Inc Photoresist removing agent composition and removing method
JPH08202051A (en) * 1995-01-26 1996-08-09 Mitsubishi Gas Chem Co Inc Peeling agent composition for photoresist and peeling method
KR100234532B1 (en) * 1996-09-21 1999-12-15 윤종용 Thinner composition used in cleaning photoresist and semiconductor manufacturing method using the same
KR100335484B1 (en) * 1998-08-05 2002-05-04 윤종용 Use of an Alkoxy N-Hydroxyalkyl Alkanamide as Resist Removing Agent, Composition for Removing Resist, Method for Preparing the Same and Resist Removing Method Using the Same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2199587A (en) * 1986-12-10 1988-07-13 Advanced Chem Tech Stripping compositions and use thereof
JPH02131239A (en) * 1988-11-11 1990-05-21 Nagase Denshi Kagaku Kk Composition of peeling agent
US5707947A (en) * 1991-01-25 1998-01-13 Ashland Inc. Organic stripping composition
JPH11125917A (en) * 1997-10-21 1999-05-11 Fuji Film Olin Kk Photoresist stripping solution

Also Published As

Publication number Publication date
GB9918418D0 (en) 1999-10-06
CN1249530C (en) 2006-04-05
KR20000016878A (en) 2000-03-25
CN1243971A (en) 2000-02-09
FR2782176A1 (en) 2000-02-11
FR2782176B1 (en) 2005-09-23
KR100335484B1 (en) 2002-05-04
GB2340256A (en) 2000-02-16

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20100804