GB2334142A - Multiple function optical module - Google Patents
Multiple function optical module Download PDFInfo
- Publication number
- GB2334142A GB2334142A GB9802338A GB9802338A GB2334142A GB 2334142 A GB2334142 A GB 2334142A GB 9802338 A GB9802338 A GB 9802338A GB 9802338 A GB9802338 A GB 9802338A GB 2334142 A GB2334142 A GB 2334142A
- Authority
- GB
- United Kingdom
- Prior art keywords
- module
- optical
- optical module
- members
- die members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 48
- 230000005693 optoelectronics Effects 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims description 9
- SGPGESCZOCHFCL-UHFFFAOYSA-N Tilisolol hydrochloride Chemical compound [Cl-].C1=CC=C2C(=O)N(C)C=C(OCC(O)C[NH2+]C(C)(C)C)C2=C1 SGPGESCZOCHFCL-UHFFFAOYSA-N 0.000 claims 2
- 239000000203 mixture Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
- G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
A plurality of opto-electronic dies 10, comprising frames carrying respective opto-electronic devices having different functions, are assembled as a module on an optical source 24 in a stacked manner and aligned, e.g. by means of guides 26 and holes 22 in the frames. The devices may be emitters such as laser diodes or receivers, e.g. operating at different wavelengths, or a mixture of both. Passive elements such as mirrors 28 may also be included in the module. The configuration of the module can be easily changed.
Description
MULTIPLE FUNCTION OPTICAL MODULE
The present invention relates to a method and apparatus for an optical module capable of multiple functions and more particularly, the present invention relates to a stacked arrangement of optoelectronic dies.
In the prior art, there have been attempts to maximize the functioning of optical components in order to increase the efficiency of the circuits in which they are integrated.
Typically, these efforts have lead to engineering, manufacturing or design complications, all of which contribute to cost increases and ineffective use of valuable research and development time.
It would be most desirable to have a method for the fabrication of a multiple functioning optical module which could be readily and expediitiously assembled and employed in a circuit. The present invention provides an optical module satisfying these requirements and a method of forming such a module.
in accordance with one aspect of the present' invention, there is provided a multiple function optical module, comprising:
a plurality of opto electronic die members, each member of the members having a frame for carrying an opto electronic device, each device for performing a function different from another device of the members; and
an optical source having guide means;
alignment means on the frame for aligning the die members on the guide means of the optical source, whereby the die members may be stacked on the guide means.
The module as detineated herein provides significant advantages over currently used arrangements in that the module may be customized for certain applications desired by the user. To this end, optical dies having completely different functions may be stacked one upon the other. Selection of the die will depend on the functions sought by the module designer.
Of particular convenience is the feature of passive alignment of the dies on the optical source. As is well known in the art, alignment is typically the most labour intensive aspect in the manufacture of optical components. By making use of framed optical die components together with a guide system associated with the optical source, as one possibility, the alignment procedure is greatly simplified while alignment precision remains uncompromised.
Duplex, coupler and multiple wavelength modules inter alia may be created using the technology set forth herein and thus, in a further aspect of the present invention, there is provided a method of forming a multiple function module, comprising:
providing a plurality of opto electronic die members, each member of the members having a frame for carrying an opto electronic device, each device for performing a function different from another device of the members;
an optical source having guide means; and
alignment means on the frame for aligning the die members on the guide means of the optical source, whereby the die members may be stacked on the guide means to provide an optical module having a variety of functions.
As examples, modules may be formed to stack in alignment optoelectronic dies each for emitting a different wavelength. Further, the module may incorporate detector dies, each for detecting a different frequency.
For duplex operations, the module will include both transmitting and receiving dies in any number. Both passive and active components may be used and the modules integrated into a larger circuit.
Having thus generally described the invention, reference will now be made to the accompanying drawings illustrating preferred embodiments and in which;
Figure 1 is a plan view of the lead frame for receiving an optical die;
Figure 2 is a plan view of the lead frame for receiving an optical die according to a further embodiment; and
Figure 3 is an exploded view illustrating the disposition of the dies on the optical source.
Similar numerals employed in the text denote similar elements.
Referring now to the drawings, Figure 1 illustrates a first example of the optical die, generally denoted by numeral 10, for use in the present invention. A laser diode 12 is provided and a carrier or lead frame 14 is connected to the substrate and to laser diode 12 via contact pads 16 and 18. This configuration permits fliFchip bonding of laser diode to the pads while permitting the surface emitting laser to provide a collimated beam in a direction away from the plane of the contacts. As is known, the end strip 20 is removed after the laser has been attached and the package otherwise completed in order to isolate the two pads 16 and 18.
Lead frame 14 also has apertures 22 which are precisely aligned in relation to the bonding pads 1618. The apertures 22 facilitate passive alignment with guides on the optical source discussed herein after.
Figure 2 illustrates a further optical die induding a diode array 12'. It will be understood that the dies shown are only examples and optoelectronic component choice will depend on the requirements of the user.
Figure 3 is an exploded view of a stacked module. The optical source 24 may be any suitable source, of which there is an abundance in the prior art, useful with dies and accordingly detailed description will be obviated. The source 24 will include guides 26 shown in the example as projections, which may be machined or otherwise attached to source 24 as shown.
Guides 26 receive dies 10 at apertures 22 to ensure precise alignment between the optical device, in the example diodes 14, and optical fibers, broadly denoted by numeral 28.
The dies each may perform discreet functions as discussed supra to thus provide a multiple function module allowing the designerto select which functions are useful in a given situation.
As an altemative, the module shown in Figure 3 may optionally include passive elements 28 such as optical mirrors. In this arrangement, the active elements ( optical devices connected to the dies 10 ) may alternate with passive elements 28. Further, a series of elements 28 may be interposed with dies 10. Other combinations of elements are also possible. The module of Figure 3 may also be incorporated into an integrated circuit (not shown ) or mounted to circuit board (not shown).
Although specific embodiments of the invention have been discussed it will be appreciated that the invention is subject to substantial variation without departing from the spirit, nature or scope of the described and claimed invention.
Claims (15)
1. A multiple function optical module, comprising:
a plurality of opto electronic die members, each member of said members having a frame for carrying an opto electronic device, each said device for performing a function different from another device of said members;
an optical source having guide means; and
alignment means on said frame for aligning said die members on said guide means of said optical source, whereby said die members may be stacked on said guide means.
2. The optical module as defined in daim 1, wherein said optoelectronic die
members include active optical components and passive optical components.
3. The optical module as defined in claims 1 and 2, wherein said module indudes an opto electronic die receiving member for receiving a wavelength and a transmitting
member for transmitting a wavelength.
4. The optical module as defined in claims I through 3, wherein said receiving
member and said transmitting member are in alternating relation.
5. The optical module as defined in daim 4, wherein said receiving member comprises a single receiver and said transmitter comprises a single transmitter.
6. The optical module as defined in claims 4 and 5, wherein said receiving member comprises an array receiver and said transmitter comprises an array transmitter.
7. The optical module as defined in claims 1 through 6, wherein said module
comprises an optical coupler.
8. The optical module as defined in claims 1 through 7, wherein each said opto electronic die member includes at least one of a flip chip bonded vertical cavity surface emitting diode, detector diode or micro cavity diode.
The optical module as defined in claim 2, wherein said passive optical components include dichroic mirrors.
10. The optical module as defined in claim 1, wherein said alignment means comprises apertures in said die members.
11. The optical module as defined in claim 1, wherein said die members are passively aligned.
12. A method of forming a multiple function module, comprising
providing a plurality of opto electronic die members, each member of said members having a frame for carrying an opto electronic device, each said device for performing a function different from another device of said members;
an optical source having guide means; and
alignment means on said frame for aligning said die members on said guide means of said optical source, whereby said die members may be stacked on said guide means to provide an optical module having a variety of functions.
13. The method as defined in claim 12, further including the step of simultaneously transmitting and detecting wavelengths with said module.
14. The method as defined in claims 12 or 13, further including the step of simultaneously detecting a plurality of wavelengths of different frequency.
15. The method as defined in daims 12 through 14, further including the step of mounting said module to an electronic circuit board.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9802338A GB2334142A (en) | 1998-02-04 | 1998-02-04 | Multiple function optical module |
GB9828570A GB2334144B (en) | 1998-02-04 | 1998-12-23 | Multiple function optical module having electromagnetic shielding |
DE19860604A DE19860604A1 (en) | 1998-02-04 | 1998-12-29 | Optical module with multiple functions with an electromagnetic shield, and method for its production |
CA002257061A CA2257061A1 (en) | 1998-02-04 | 1998-12-30 | Multiple function optical module having electromagnetic shielding |
US09/223,779 US6034808A (en) | 1998-02-04 | 1998-12-31 | Multiple function optical module having electromagnetic shielding |
FR9900091A FR2774478A1 (en) | 1998-02-04 | 1999-01-07 | Multifunctional optical module |
SE9900385A SE9900385L (en) | 1998-02-04 | 1999-02-04 | Optical module with multiple function with electromagnetic shielding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9802338A GB2334142A (en) | 1998-02-04 | 1998-02-04 | Multiple function optical module |
Publications (2)
Publication Number | Publication Date |
---|---|
GB9802338D0 GB9802338D0 (en) | 1998-04-01 |
GB2334142A true GB2334142A (en) | 1999-08-11 |
Family
ID=10826416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9802338A Withdrawn GB2334142A (en) | 1998-02-04 | 1998-02-04 | Multiple function optical module |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2334142A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0526776A1 (en) * | 1991-08-06 | 1993-02-10 | International Business Machines Corporation | High speed optical interconnect |
WO1995028744A1 (en) * | 1994-04-15 | 1995-10-26 | Photonics Research Incorporated | Wafer scale optoelectronic package |
JPH0878772A (en) * | 1994-09-05 | 1996-03-22 | Mitsubishi Electric Corp | Assembling method for stacked semiconductor laser device and semiconductor laser chip |
US5623181A (en) * | 1995-03-23 | 1997-04-22 | Iwasaki Electric Co., Ltd. | Multi-layer type light emitting device |
-
1998
- 1998-02-04 GB GB9802338A patent/GB2334142A/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0526776A1 (en) * | 1991-08-06 | 1993-02-10 | International Business Machines Corporation | High speed optical interconnect |
WO1995028744A1 (en) * | 1994-04-15 | 1995-10-26 | Photonics Research Incorporated | Wafer scale optoelectronic package |
JPH0878772A (en) * | 1994-09-05 | 1996-03-22 | Mitsubishi Electric Corp | Assembling method for stacked semiconductor laser device and semiconductor laser chip |
US5623181A (en) * | 1995-03-23 | 1997-04-22 | Iwasaki Electric Co., Ltd. | Multi-layer type light emitting device |
Also Published As
Publication number | Publication date |
---|---|
GB9802338D0 (en) | 1998-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |