GB2319660B - Gate insulating layer having diamond-like carbon and thin film transistor employing the same and process for manufacturing gate insulating layer - Google Patents

Gate insulating layer having diamond-like carbon and thin film transistor employing the same and process for manufacturing gate insulating layer

Info

Publication number
GB2319660B
GB2319660B GB9724618A GB9724618A GB2319660B GB 2319660 B GB2319660 B GB 2319660B GB 9724618 A GB9724618 A GB 9724618A GB 9724618 A GB9724618 A GB 9724618A GB 2319660 B GB2319660 B GB 2319660B
Authority
GB
United Kingdom
Prior art keywords
insulating layer
gate insulating
diamond
carbon
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9724618A
Other versions
GB2319660A (en
GB9724618D0 (en
Inventor
Jin Jang
Kyu-Chang Park
Jong Hyun Moon
Suk-Jae Chung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of GB9724618D0 publication Critical patent/GB9724618D0/en
Publication of GB2319660A publication Critical patent/GB2319660A/en
Application granted granted Critical
Publication of GB2319660B publication Critical patent/GB2319660B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • H01L29/66765Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/4908Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Formation Of Insulating Films (AREA)
GB9724618A 1996-11-27 1997-11-20 Gate insulating layer having diamond-like carbon and thin film transistor employing the same and process for manufacturing gate insulating layer Expired - Lifetime GB2319660B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960057811A KR100272260B1 (en) 1996-11-27 1996-11-27 Thin film transistor using diamond like carbon and manufacturing method thereof

Publications (3)

Publication Number Publication Date
GB9724618D0 GB9724618D0 (en) 1998-01-21
GB2319660A GB2319660A (en) 1998-05-27
GB2319660B true GB2319660B (en) 2001-10-24

Family

ID=19483727

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9724618A Expired - Lifetime GB2319660B (en) 1996-11-27 1997-11-20 Gate insulating layer having diamond-like carbon and thin film transistor employing the same and process for manufacturing gate insulating layer

Country Status (4)

Country Link
JP (1) JP3054862B2 (en)
KR (1) KR100272260B1 (en)
DE (1) DE19751745A1 (en)
GB (1) GB2319660B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307782A (en) * 1998-04-24 1999-11-05 Semiconductor Energy Lab Co Ltd Semiconductor device and its manufacture
TW521537B (en) * 1998-05-08 2003-02-21 Idemitsu Kosan Co Organic electroluminescence element
KR20000039802A (en) * 1998-12-16 2000-07-05 김영환 Method for manufacturing lower substrate of thin film transistor liquid crystal display device
KR100713877B1 (en) * 1998-12-18 2007-07-18 비오이 하이디스 테크놀로지 주식회사 Tft-lcd
KR100767354B1 (en) * 2000-09-04 2007-10-16 삼성전자주식회사 Thin film transistor plate and fabricating method thereof
GB9929614D0 (en) * 1999-12-15 2000-02-09 Koninkl Philips Electronics Nv Method of manufacturing a transistor
JP2005228819A (en) 2004-02-10 2005-08-25 Mitsubishi Electric Corp Semiconductor device
JP2005235923A (en) 2004-02-18 2005-09-02 Nippon Hoso Kyokai <Nhk> Organic thin film transistor, method of manufacturing the same, and organic thin film device
KR100696536B1 (en) * 2005-09-26 2007-03-19 삼성에스디아이 주식회사 Organic thin film transistor and organic light emitting display apparatus comprising the same
KR100786498B1 (en) * 2005-09-27 2007-12-17 삼성에스디아이 주식회사 Transparent thin film transistor and manufacturing method thereof
KR100963026B1 (en) 2008-06-30 2010-06-10 삼성모바일디스플레이주식회사 Thin film transistor, method of manufacturing the thin film transistor and flat panel display device having the thin film transistor
KR100963027B1 (en) 2008-06-30 2010-06-10 삼성모바일디스플레이주식회사 Thin film transistor, method of manufacturing the thin film transistor and flat panel display device having the thin film transistor
CN116960162A (en) 2017-10-12 2023-10-27 应用材料公司 Process for reducing plasma-induced damage

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2243949A (en) * 1990-03-13 1991-11-13 Kobe Steel Ltd Diamond MIS field effect transistor
GB2254733A (en) * 1991-03-29 1992-10-14 Kobe Steel Ltd Diamond schottky gate fet
US5523588A (en) * 1993-09-28 1996-06-04 Kabushiki Kaisha Kobe Seiko Sho Diamond film field effect transistor with self aligned source and drain regions

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559367A (en) * 1994-07-12 1996-09-24 International Business Machines Corporation Diamond-like carbon for use in VLSI and ULSI interconnect systems

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2243949A (en) * 1990-03-13 1991-11-13 Kobe Steel Ltd Diamond MIS field effect transistor
GB2254733A (en) * 1991-03-29 1992-10-14 Kobe Steel Ltd Diamond schottky gate fet
US5523588A (en) * 1993-09-28 1996-06-04 Kabushiki Kaisha Kobe Seiko Sho Diamond film field effect transistor with self aligned source and drain regions

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Pat.Abs.of Jp.Vol.7,No.255(E210),12/11/83,page133,SUWA SEIKOSHA and JP58-141572 *
WPI abstract accession number 1993-307046 [39], PAJ abstractand English translation of JP5218402 *

Also Published As

Publication number Publication date
DE19751745A1 (en) 1998-05-28
JPH10294468A (en) 1998-11-04
KR19980038871A (en) 1998-08-17
KR100272260B1 (en) 2000-11-15
GB2319660A (en) 1998-05-27
GB9724618D0 (en) 1998-01-21
JP3054862B2 (en) 2000-06-19

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PE20 Patent expired after termination of 20 years

Expiry date: 20171119