GB2319658B - Method of fabricating a word line - Google Patents

Method of fabricating a word line

Info

Publication number
GB2319658B
GB2319658B GB9624435A GB9624435A GB2319658B GB 2319658 B GB2319658 B GB 2319658B GB 9624435 A GB9624435 A GB 9624435A GB 9624435 A GB9624435 A GB 9624435A GB 2319658 B GB2319658 B GB 2319658B
Authority
GB
United Kingdom
Prior art keywords
fabricating
word line
word
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9624435A
Other versions
GB2319658A (en
GB9624435D0 (en
Inventor
Der-Yuan Wu
Yi-Chung Sheng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Microelectronics Corp
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW085111565A external-priority patent/TW316326B/en
Priority to GB9624435A priority Critical patent/GB2319658B/en
Priority to DE19648733A priority patent/DE19648733C2/en
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to JP9011965A priority patent/JPH10107034A/en
Publication of GB9624435D0 publication Critical patent/GB9624435D0/en
Priority to NL1007868A priority patent/NL1007868C2/en
Priority to FR9800082A priority patent/FR2773418B1/en
Publication of GB2319658A publication Critical patent/GB2319658A/en
Publication of GB2319658B publication Critical patent/GB2319658B/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • H01L21/28017Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28035Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
    • H01L21/28044Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer
    • H01L21/28061Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer the conductor comprising a metal or metal silicide formed by deposition, e.g. sputter deposition, i.e. without a silicidation reaction

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
GB9624435A 1996-09-21 1996-11-25 Method of fabricating a word line Expired - Fee Related GB2319658B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB9624435A GB2319658B (en) 1996-09-21 1996-11-25 Method of fabricating a word line
DE19648733A DE19648733C2 (en) 1996-09-21 1996-11-25 Process for the production of word lines in dynamic read / write memories
JP9011965A JPH10107034A (en) 1996-09-21 1997-01-07 Method for manufacturing word line
NL1007868A NL1007868C2 (en) 1996-09-21 1997-12-23 Method for manufacturing a word line, and integrated semiconductor circuit obtained therewith.
FR9800082A FR2773418B1 (en) 1996-09-21 1998-01-07 METHOD FOR MANUFACTURING A WORD CONDUCTOR

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW085111565A TW316326B (en) 1996-09-21 1996-09-21 Manufacturing method of word line
GB9624435A GB2319658B (en) 1996-09-21 1996-11-25 Method of fabricating a word line
NL1007868A NL1007868C2 (en) 1996-09-21 1997-12-23 Method for manufacturing a word line, and integrated semiconductor circuit obtained therewith.
FR9800082A FR2773418B1 (en) 1996-09-21 1998-01-07 METHOD FOR MANUFACTURING A WORD CONDUCTOR

Publications (3)

Publication Number Publication Date
GB9624435D0 GB9624435D0 (en) 1997-01-15
GB2319658A GB2319658A (en) 1998-05-27
GB2319658B true GB2319658B (en) 2001-08-22

Family

ID=27447012

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9624435A Expired - Fee Related GB2319658B (en) 1996-09-21 1996-11-25 Method of fabricating a word line

Country Status (5)

Country Link
JP (1) JPH10107034A (en)
DE (1) DE19648733C2 (en)
FR (1) FR2773418B1 (en)
GB (1) GB2319658B (en)
NL (1) NL1007868C2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100290781B1 (en) * 1998-06-30 2001-06-01 박종섭 Semiconductor device and manufacturing method
JP2000294775A (en) * 1999-04-07 2000-10-20 Sony Corp Manufacture of semiconductor device
US7243027B2 (en) 2005-07-07 2007-07-10 Schlumberger Technology Corporation Method and system to generate deliverable files
KR100771538B1 (en) 2005-12-14 2007-10-31 주식회사 하이닉스반도체 Method of fabricating the semiconductor device having W-polycide gate with low resistance and recessed channel

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4128670A (en) * 1977-11-11 1978-12-05 International Business Machines Corporation Fabrication method for integrated circuits with polysilicon lines having low sheet resistance
JPS61263243A (en) * 1985-05-17 1986-11-21 Matsushita Electronics Corp Manufacture of high melting point metal silicide wiring
JPS63133672A (en) * 1986-11-26 1988-06-06 Nec Corp Semiconductor device
US4851295A (en) * 1984-03-16 1989-07-25 Genus, Inc. Low resistivity tungsten silicon composite film
JPH0273669A (en) * 1988-09-09 1990-03-13 Sony Corp Semiconductor device
US4910578A (en) * 1985-06-25 1990-03-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having a metal electrode interconnection film with two layers of silicide
EP0400821A2 (en) * 1989-05-31 1990-12-05 STMicroelectronics, Inc. Local interconnect for integrated circuits
US5070038A (en) * 1988-12-24 1991-12-03 Samsung Electronics Co., Ltd. Method of forming low-resistive contact to N+/P+ preohmic regions in very large scale integrated devices
EP0497596A2 (en) * 1991-01-31 1992-08-05 STMicroelectronics, Inc. Method for fabricating integrated circuit structures

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4389257A (en) * 1981-07-30 1983-06-21 International Business Machines Corporation Fabrication method for high conductivity, void-free polysilicon-silicide integrated circuit electrodes
JPS61276373A (en) * 1985-05-31 1986-12-06 Nippon Texas Instr Kk Manufacturing process of semiconductor device
US4690730A (en) * 1986-03-07 1987-09-01 Texas Instruments Incorporated Oxide-capped titanium silicide formation
JPS6376479A (en) * 1986-09-19 1988-04-06 Oki Electric Ind Co Ltd Manufacture of semiconductor device
US4737474A (en) * 1986-11-17 1988-04-12 Spectrum Cvd, Inc. Silicide to silicon bonding process
JPS63227058A (en) * 1987-03-17 1988-09-21 Matsushita Electronics Corp High melting-point metallic silicide gate mos field-effect transistor
JPS63272028A (en) * 1987-04-30 1988-11-09 Oki Electric Ind Co Ltd Method of forming high melting point metal silicide film
US4774201A (en) * 1988-01-07 1988-09-27 Intel Corporation Tungsten-silicide reoxidation technique using a CVD oxide cap
US4981442A (en) * 1989-03-23 1991-01-01 Nippon Acchakutanshi Seizo Kabushiki Kaisha Electrical harness
US5591674A (en) * 1991-12-30 1997-01-07 Lucent Technologies Inc. Integrated circuit with silicon contact to silicide
JP3067433B2 (en) * 1992-12-04 2000-07-17 キヤノン株式会社 Method for manufacturing semiconductor device
JPH06334453A (en) * 1993-05-25 1994-12-02 Canon Inc Amplifier
US5635765A (en) * 1996-02-26 1997-06-03 Cypress Semiconductor Corporation Multi-layer gate structure

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4128670A (en) * 1977-11-11 1978-12-05 International Business Machines Corporation Fabrication method for integrated circuits with polysilicon lines having low sheet resistance
US4851295A (en) * 1984-03-16 1989-07-25 Genus, Inc. Low resistivity tungsten silicon composite film
JPS61263243A (en) * 1985-05-17 1986-11-21 Matsushita Electronics Corp Manufacture of high melting point metal silicide wiring
US4910578A (en) * 1985-06-25 1990-03-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having a metal electrode interconnection film with two layers of silicide
JPS63133672A (en) * 1986-11-26 1988-06-06 Nec Corp Semiconductor device
JPH0273669A (en) * 1988-09-09 1990-03-13 Sony Corp Semiconductor device
US5070038A (en) * 1988-12-24 1991-12-03 Samsung Electronics Co., Ltd. Method of forming low-resistive contact to N+/P+ preohmic regions in very large scale integrated devices
EP0400821A2 (en) * 1989-05-31 1990-12-05 STMicroelectronics, Inc. Local interconnect for integrated circuits
EP0497596A2 (en) * 1991-01-31 1992-08-05 STMicroelectronics, Inc. Method for fabricating integrated circuit structures

Also Published As

Publication number Publication date
JPH10107034A (en) 1998-04-24
FR2773418A1 (en) 1999-07-09
DE19648733C2 (en) 2002-11-07
FR2773418B1 (en) 2002-12-06
DE19648733A1 (en) 1998-04-16
NL1007868C2 (en) 1999-06-24
GB2319658A (en) 1998-05-27
GB9624435D0 (en) 1997-01-15

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20091125