GB2317585B - Improvements in and relating to grinding machines - Google Patents

Improvements in and relating to grinding machines

Info

Publication number
GB2317585B
GB2317585B GB9712082A GB9712082A GB2317585B GB 2317585 B GB2317585 B GB 2317585B GB 9712082 A GB9712082 A GB 9712082A GB 9712082 A GB9712082 A GB 9712082A GB 2317585 B GB2317585 B GB 2317585B
Authority
GB
United Kingdom
Prior art keywords
relating
grinding machines
grinding
machines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9712082A
Other versions
GB2317585A (en
GB9712082D0 (en
Inventor
Mark Andrew Stocker
Dermot Robert Falkner
Paul Martin Howard Morantz
Michael George Pierse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intermec Europe Ltd
Original Assignee
Western Atlas UK Ltd
Unova UK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Atlas UK Ltd, Unova UK Ltd filed Critical Western Atlas UK Ltd
Priority to GB9712082A priority Critical patent/GB2317585B/en
Priority to GB9806247A priority patent/GB2322318B/en
Publication of GB9712082D0 publication Critical patent/GB9712082D0/en
Publication of GB2317585A publication Critical patent/GB2317585A/en
Application granted granted Critical
Publication of GB2317585B publication Critical patent/GB2317585B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/18—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for positioning only
    • B23Q3/186—Aligning devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B17/00—Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor
    • B24B17/04—Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor involving optical auxiliary means, e.g. optical projection form grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B17/00—Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor
    • B24B17/04—Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor involving optical auxiliary means, e.g. optical projection form grinding machines
    • B24B17/06—Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor involving optical auxiliary means, e.g. optical projection form grinding machines combined with electrical transmission means, e.g. controlled by photoelectric cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/04—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/06—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces internally
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
GB9712082A 1996-06-15 1997-06-11 Improvements in and relating to grinding machines Expired - Lifetime GB2317585B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB9712082A GB2317585B (en) 1997-06-11 1997-06-11 Improvements in and relating to grinding machines
GB9806247A GB2322318B (en) 1996-06-15 1997-06-11 Grinding machines for grinding discs or wafer workpieces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9712082A GB2317585B (en) 1997-06-11 1997-06-11 Improvements in and relating to grinding machines

Publications (3)

Publication Number Publication Date
GB9712082D0 GB9712082D0 (en) 1997-08-13
GB2317585A GB2317585A (en) 1998-04-01
GB2317585B true GB2317585B (en) 1999-12-01

Family

ID=10813934

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9712082A Expired - Lifetime GB2317585B (en) 1996-06-15 1997-06-11 Improvements in and relating to grinding machines

Country Status (1)

Country Link
GB (1) GB2317585B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1089851B1 (en) * 1998-06-25 2002-10-16 Unova U.K. Limited Wafer edge polishing method and apparatus
CN109262396B (en) * 2018-10-15 2021-08-03 项孝泓 Special equipment for machining head of automobile air inlet welding manifold
CN110026845A (en) * 2019-05-24 2019-07-19 哈电集团（秦皇岛）重型装备有限公司 A kind of large container U-tube pipe end derusting burnishing device and polishing method
CN111941244A (en) * 2020-08-12 2020-11-17 中机城市建设有限公司 Over-and-under type construction steel pipe inner wall rust cleaning grinding device
CN112157745A (en) * 2020-08-31 2021-01-01 衡阳市无量雕塑艺术有限公司 A grinding device for production of wooden sculpture
CN112405115B (en) * 2020-09-22 2022-08-12 成都飞机工业（集团）有限责任公司 Photographing type three-dimensional scanning device and method based on measurement of in-situ position of large part
CN115502795B (en) * 2022-08-11 2024-05-03 青岛高测科技股份有限公司 Feeding device, feeding control method and system of grinding machine, equipment and medium

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2143447A (en) * 1981-03-30 1985-02-13 Energy Adaptive Grinding Inc Improvements in grinding control method and apparatus
EP0222521A2 (en) * 1985-11-04 1987-05-20 Silicon Technology Corporation An automatic edge grinder
US4793101A (en) * 1986-10-22 1988-12-27 Bbc Brown Boveri Ag Method of making an encircling groove on the edge of a semiconductor slice of a power semiconductor component
GB2296458A (en) * 1994-11-28 1996-07-03 Tokyo Seimitsu Co Ltd A chamfer grinding system for wafers incorporating two chamfering means to increase throughput

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2143447A (en) * 1981-03-30 1985-02-13 Energy Adaptive Grinding Inc Improvements in grinding control method and apparatus
EP0222521A2 (en) * 1985-11-04 1987-05-20 Silicon Technology Corporation An automatic edge grinder
US4793101A (en) * 1986-10-22 1988-12-27 Bbc Brown Boveri Ag Method of making an encircling groove on the edge of a semiconductor slice of a power semiconductor component
GB2296458A (en) * 1994-11-28 1996-07-03 Tokyo Seimitsu Co Ltd A chamfer grinding system for wafers incorporating two chamfering means to increase throughput

Also Published As

Publication number Publication date
GB2317585A (en) 1998-04-01
GB9712082D0 (en) 1997-08-13

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PE20 Patent expired after termination of 20 years

Expiry date: 20170610