GB2289640B - Method for soldering electronic component and apparatus therefor - Google Patents
Method for soldering electronic component and apparatus thereforInfo
- Publication number
- GB2289640B GB2289640B GB9410245A GB9410245A GB2289640B GB 2289640 B GB2289640 B GB 2289640B GB 9410245 A GB9410245 A GB 9410245A GB 9410245 A GB9410245 A GB 9410245A GB 2289640 B GB2289640 B GB 2289640B
- Authority
- GB
- United Kingdom
- Prior art keywords
- electronic component
- apparatus therefor
- soldering electronic
- soldering
- therefor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4336735A JP2683713B2 (en) | 1992-11-24 | 1992-11-24 | Electronic component soldering method and apparatus |
FR9406175A FR2720018B1 (en) | 1992-11-24 | 1994-05-20 | Method and apparatus for soldering electronic components. |
DE4417866A DE4417866C2 (en) | 1992-11-24 | 1994-05-20 | Process for soldering electronic components and device therefor |
GB9410245A GB2289640B (en) | 1992-11-24 | 1994-05-23 | Method for soldering electronic component and apparatus therefor |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4336735A JP2683713B2 (en) | 1992-11-24 | 1992-11-24 | Electronic component soldering method and apparatus |
FR9406175A FR2720018B1 (en) | 1992-11-24 | 1994-05-20 | Method and apparatus for soldering electronic components. |
DE4417866A DE4417866C2 (en) | 1992-11-24 | 1994-05-20 | Process for soldering electronic components and device therefor |
GB9410245A GB2289640B (en) | 1992-11-24 | 1994-05-23 | Method for soldering electronic component and apparatus therefor |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9410245D0 GB9410245D0 (en) | 1994-07-13 |
GB2289640A GB2289640A (en) | 1995-11-29 |
GB2289640B true GB2289640B (en) | 1998-03-11 |
Family
ID=27435977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9410245A Expired - Fee Related GB2289640B (en) | 1992-11-24 | 1994-05-23 | Method for soldering electronic component and apparatus therefor |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2683713B2 (en) |
DE (1) | DE4417866C2 (en) |
FR (1) | FR2720018B1 (en) |
GB (1) | GB2289640B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3222796B2 (en) * | 1997-02-06 | 2001-10-29 | ティーディーケイ株式会社 | Electronic component soldering equipment |
DE102010054114A1 (en) * | 2010-12-10 | 2012-06-14 | Centrotherm Photovoltaics Ag | Drying device for drying electronic silk-screen printing paste on surface of solar cell for manufacturing electrical strip conductor, has transport unit defining transport plane that lies between openings of supplying and exhausting units |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1330881A (en) * | 1969-09-22 | 1973-09-19 | Chausson Usines Sa | Brazing furnace and process for aluminium radiator cores |
GB1402174A (en) * | 1971-08-09 | 1975-08-06 | Chausson Usines Sa | Brazing furnaces |
US5163599A (en) * | 1989-10-06 | 1992-11-17 | Hitachi Techno Engineering Co., Ltd. | Reflow soldering apparatus |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02396A (en) * | 1987-11-30 | 1990-01-05 | Furukawa Electric Co Ltd:The | Heating method of soldered circuit board |
US4876437A (en) * | 1988-07-14 | 1989-10-24 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus |
JPH064187B2 (en) * | 1988-10-04 | 1994-01-19 | 権士 近藤 | Reflow soldering equipment |
JPH03268864A (en) * | 1990-03-19 | 1991-11-29 | Fujitsu Ltd | Soldering reflow furnace |
US5180096A (en) * | 1990-07-25 | 1993-01-19 | Nihon Den-Netsu Keiki Co., Ltd. | Method and apparatus for reflow-soldering of printed circuit boards |
JPH0739483Y2 (en) * | 1990-11-15 | 1995-09-13 | 千住金属工業株式会社 | Reflow furnace |
JP2722142B2 (en) * | 1991-07-31 | 1998-03-04 | 日本電気株式会社 | Automatic reflow soldering equipment |
JP3103410B2 (en) * | 1991-12-20 | 2000-10-30 | 大阪酸素工業株式会社 | Soldering method using special atmosphere gas |
CH683736A5 (en) * | 1992-05-27 | 1994-04-29 | Kontakt Systeme Ag | Continuous reflow soldering furnace - has cassette modules for heating and soldering components fitted to circuit boards carried through on a permeable conveyor |
DE4302976A1 (en) * | 1992-07-22 | 1994-01-27 | Bosch Gmbh Robert | Device and method for soldering components on circuit boards |
-
1992
- 1992-11-24 JP JP4336735A patent/JP2683713B2/en not_active Expired - Lifetime
-
1994
- 1994-05-20 DE DE4417866A patent/DE4417866C2/en not_active Expired - Fee Related
- 1994-05-20 FR FR9406175A patent/FR2720018B1/en not_active Expired - Fee Related
- 1994-05-23 GB GB9410245A patent/GB2289640B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1330881A (en) * | 1969-09-22 | 1973-09-19 | Chausson Usines Sa | Brazing furnace and process for aluminium radiator cores |
GB1402174A (en) * | 1971-08-09 | 1975-08-06 | Chausson Usines Sa | Brazing furnaces |
US5163599A (en) * | 1989-10-06 | 1992-11-17 | Hitachi Techno Engineering Co., Ltd. | Reflow soldering apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH06226438A (en) | 1994-08-16 |
DE4417866C2 (en) | 2000-07-20 |
FR2720018A1 (en) | 1995-11-24 |
FR2720018B1 (en) | 1996-08-09 |
JP2683713B2 (en) | 1997-12-03 |
GB2289640A (en) | 1995-11-29 |
DE4417866A1 (en) | 1995-11-23 |
GB9410245D0 (en) | 1994-07-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20070523 |