GB2279899B - A screen printing system - Google Patents
A screen printing systemInfo
- Publication number
- GB2279899B GB2279899B GB9416286A GB9416286A GB2279899B GB 2279899 B GB2279899 B GB 2279899B GB 9416286 A GB9416286 A GB 9416286A GB 9416286 A GB9416286 A GB 9416286A GB 2279899 B GB2279899 B GB 2279899B
- Authority
- GB
- United Kingdom
- Prior art keywords
- screen printing
- printing system
- screen
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0692—Solder baths with intermediary means for bringing solder on workpiece, e.g. rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP077831U JPH05438U (en) | 1991-06-24 | 1991-06-24 | Cream solder printing equipment |
JP36040991A JP2990242B2 (en) | 1991-12-06 | 1991-12-06 | Cream solder printing system |
GB9213186A GB2257386B (en) | 1991-06-24 | 1992-06-22 | Screen printing apparatus |
CA002094072A CA2094072C (en) | 1991-06-24 | 1993-04-15 | Apparatus and system for screen printing |
CA002112299A CA2112299C (en) | 1991-06-24 | 1993-12-23 | Method for screen printing of paste |
JP7190959A JP2969501B2 (en) | 1991-06-24 | 1995-06-23 | Cream solder printing equipment |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9416286D0 GB9416286D0 (en) | 1994-10-05 |
GB2279899A GB2279899A (en) | 1995-01-18 |
GB2279899B true GB2279899B (en) | 1995-07-05 |
Family
ID=27543463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9416286A Expired - Fee Related GB2279899B (en) | 1991-06-24 | 1992-06-22 | A screen printing system |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2279899B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5925187A (en) * | 1996-02-08 | 1999-07-20 | Speedline Technologies, Inc. | Apparatus for dispensing flowable material |
WO1997043123A1 (en) * | 1996-05-15 | 1997-11-20 | Matsushita Electric Industrial Co., Ltd. | Method for controlling screen printing machine |
FR2754474B1 (en) | 1996-10-15 | 1999-04-30 | Novatec | DEVICE FOR DEPOSITING A VISCOUS OR PASTA ON A SUBSTRATE THROUGH THE OPENINGS OF A STENCIL |
US6453810B1 (en) | 1997-11-07 | 2002-09-24 | Speedline Technologies, Inc. | Method and apparatus for dispensing material in a printer |
US6324973B2 (en) | 1997-11-07 | 2001-12-04 | Speedline Technologies, Inc. | Method and apparatus for dispensing material in a printer |
US5947022A (en) * | 1997-11-07 | 1999-09-07 | Speedline Technologies, Inc. | Apparatus for dispensing material in a printer |
US6158338A (en) * | 1998-12-22 | 2000-12-12 | Dek Printing Machines Limited | Cassette for holding and dispensing a viscous material for use in an apparatus for depositing the viscous material on a substrate |
-
1992
- 1992-06-22 GB GB9416286A patent/GB2279899B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB9416286D0 (en) | 1994-10-05 |
GB2279899A (en) | 1995-01-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20090622 |