GB2274942B - Semiconductor manufacturing method - Google Patents

Semiconductor manufacturing method

Info

Publication number
GB2274942B
GB2274942B GB9302299A GB9302299A GB2274942B GB 2274942 B GB2274942 B GB 2274942B GB 9302299 A GB9302299 A GB 9302299A GB 9302299 A GB9302299 A GB 9302299A GB 2274942 B GB2274942 B GB 2274942B
Authority
GB
United Kingdom
Prior art keywords
semiconductor manufacturing
semiconductor
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9302299A
Other versions
GB9302299D0 (en
GB2274942A (en
Inventor
Nalin Kumar Patel
Jeremy Henley Burroughes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Europe Ltd
Original Assignee
Toshiba Cambridge Research Centre Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Cambridge Research Centre Ltd filed Critical Toshiba Cambridge Research Centre Ltd
Priority to GB9302299A priority Critical patent/GB2274942B/en
Publication of GB9302299D0 publication Critical patent/GB9302299D0/en
Publication of GB2274942A publication Critical patent/GB2274942A/en
Application granted granted Critical
Publication of GB2274942B publication Critical patent/GB2274942B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
GB9302299A 1993-02-05 1993-02-05 Semiconductor manufacturing method Expired - Fee Related GB2274942B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9302299A GB2274942B (en) 1993-02-05 1993-02-05 Semiconductor manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9302299A GB2274942B (en) 1993-02-05 1993-02-05 Semiconductor manufacturing method

Publications (3)

Publication Number Publication Date
GB9302299D0 GB9302299D0 (en) 1993-03-24
GB2274942A GB2274942A (en) 1994-08-10
GB2274942B true GB2274942B (en) 1996-09-25

Family

ID=10729925

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9302299A Expired - Fee Related GB2274942B (en) 1993-02-05 1993-02-05 Semiconductor manufacturing method

Country Status (1)

Country Link
GB (1) GB2274942B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0238066A2 (en) * 1986-03-18 1987-09-23 Fujitsu Limited A method for effecting adhesion of silicon or silicon dioxide plates
US5089439A (en) * 1990-02-02 1992-02-18 Hughes Aircraft Company Process for attaching large area silicon-backed chips to gold-coated surfaces

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0238066A2 (en) * 1986-03-18 1987-09-23 Fujitsu Limited A method for effecting adhesion of silicon or silicon dioxide plates
US5089439A (en) * 1990-02-02 1992-02-18 Hughes Aircraft Company Process for attaching large area silicon-backed chips to gold-coated surfaces

Also Published As

Publication number Publication date
GB9302299D0 (en) 1993-03-24
GB2274942A (en) 1994-08-10

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20120205