GB2274021A - A Method of mounting a semi-conductor chip in a holder by mechanical clamping - Google Patents

A Method of mounting a semi-conductor chip in a holder by mechanical clamping Download PDF

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Publication number
GB2274021A
GB2274021A GB9325637A GB9325637A GB2274021A GB 2274021 A GB2274021 A GB 2274021A GB 9325637 A GB9325637 A GB 9325637A GB 9325637 A GB9325637 A GB 9325637A GB 2274021 A GB2274021 A GB 2274021A
Authority
GB
United Kingdom
Prior art keywords
holder
clamping means
chip
semi
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9325637A
Other versions
GB9325637D0 (en
Inventor
Gunther Schuster
Walter Pfeiffer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Defence and Space GmbH
Original Assignee
Deutsche Aerospace AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Aerospace AG filed Critical Deutsche Aerospace AG
Publication of GB9325637D0 publication Critical patent/GB9325637D0/en
Publication of GB2274021A publication Critical patent/GB2274021A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Abstract

A chip 3 is inserted without force into its holder and held in its intended position by mechanical clamping only. In this respect, respective counter mounts 1 and spring elements 2 may be previously punched out from the holder material, and adapted, by bending, to the chip dimensions, the spring elements then serving to hold the chip relative to the counter mounts. After mounting and the making of required electrical connections, the holder will be accommodated in a housing, e.g. by encapsulation. <IMAGE>

Description

2274021 A METHOD OF MOUNTING SEMI-CONDUCTOR COMPONENTS ONTO A HOLDER BY
MECHMICAL CLAMPING This invention relates to a method of mounting semiconductor chips onto a holder which Is to be accommodated 5 In a housing.
When manufacturing an Integrated circuit, semiconductor components (chips) are connected to a frame (lead-frame) or a housing base. Thereafter, a plurality of electrical connections to the exterior are produced by bonding prior to fitting a cover to the housing or encasement of the leadframe with a plastic material.
Conventional methods, such as gluing, eutectic bonding and soldering, are available for connecting the chips to the housing base or lead-frame (hereinafter referred to collectively as a 'holder').
When gluing, a glue paste is applied to the holder, or an adhesive foil (pre-form) is placed on the holder; then the chip is placed on or pushed into the adhesive. The adhesives used can have electrically conductive or dielectrically insulating properties. The adhesive is hardened and the chip is connected to the holder by subsequent heat treatment at approximately 1200C over approximately 30 minutes.
2 In eutectic bonding, the chip is pressed at approximately 4000C onto a gold-layered holder and laterally moved until the Si/Au eutecticum. joins the chip to the holder. If appropriate, gold-preforms are applied 5 between the holder and the chip.
When soldering, a low-temperature metal solder, usually as a pre-form, is used for attaching a chip to a holder. If appropriate, a flux can also be used.
A particular disadvantage of all these conventional processes is that the intermediate product has to be thermally treated. Differing expansion coefficients between the holder, the chip and the connecting layer produce further thermo-mechanical stress in the chip.
It is an object of the Invention to provide for the mounting of a semi-conductor chip onto a holder preferably without the use of force and in a specified position.
Pursuant thereto, the invention provides a method of mounting semiconductor components on to a holder which is to be accommodated in a housing, wherein the component is insertable into its holder (preferably without the use of force) and is capable of being held in a specified position solely by mechanical clamping.
3 To mechanically clamp a chip onto a holder, the latter is initially punched and bent to match the chip architecture.
Some other preferable features of the present invention are set out in the appended claims.
The invention will be described further, by way of example, with reference to the accompanying drawings, in which:
Fig. 1 is an exemplary vertical cross-section through a relevant portion of a lead-frame; Fig. 2 is a corresponding view showing the mounting of a chip into the portion of Fig. 1; and Fig. 3 is a top plan view of substantially the same portion of the lead-frame.
Fig. 1 shows counter mounts 1 adapted to the dimension of the chip which is to be mounted and spring elements 2. These are punched out beforehand and bent to match the dimensions of the chip 3 which is to be mounted thereby.
The spring elements 2 are bent open, as indicated by the arrows in Fig. 1, and the chip 3 is inserted by a robot in the direction of the arrow in Fig. 2. Upon closure of the spring elements 2, the chip 3 is simultaneously clamped in and aligned.
4 Fig. 3 shows the bond pads 4 of the chip 3 and the contact webs 5 of the lead-frame which are subsequently electrically interconnected by way of bonding. 5 Thereafter encapsulation can be carried out.
The connection between the chip 3 and the clamping means, namely the spring elements 2 and outer mounts of the lead frame or other holder can be electrically conductive or non-conductive, as required, by choice of materials. For example, when the frame is of metal, the connection Is conductive, but the frame would usually be earthed. If a non-conductive connection Is required appropriate areas of insulating material can be provided on the chip or the frame at the points of contact.
The above described method of clamping offers a number of advantages over conventional processes: the connection between the chip and the holder Is practically free of thermal stress; aids, such as adhesive or preform, are dispensed with, and in consequence thereof there are no solvent vapours or flux residues; furthermore, temperature treatment of the chip and the holder are not required.
The method of the Invention Is particularly suitable for mounting semiconductor chips which react with particular sensitivity to mechanical forces and tensions 4 caused by changes in temperature, for example pressure sensors and acceleration sensors. However, other semiconductor chips for communication techniques can be economically mounted in large numbers by way of this method.
6

Claims (11)

CLAIMS:
1. A method of mounting semi-conductor components onto a holder which is to be accommodated in a housing, wherein the component is insertable Into its holder and is capable of being held in position solely by mechanical clamping means.
2. A method according to claim 1, wherein the component and the clamping means are connected in an electrically conductive manner.
3. A method according to claim 1, wherein the component and the clamping means are connected in a dielectrically insulating manner.
4. A method according to any one of the above claims, wherein the semi-conductor component Is inserted into the clamping means without the use of force.
5. A method according to any one of the above claims, wherein the semiconductor component has edges which are rounded off or slanted.
6. A method according to any one of the above claims, wherein the clamping means is formed as part of the 7 holder, which is constituted by a housing base or a frame (lead-frame).
7. A method according to any one of the above claims, wherein the clamping means Is made of metal, glass, ceramic or plastics material.
8. A method according to any one of the above claims, wherein positioning of the semi-conductor component is achieved by way of the clamping means.
9. A method according to any one of the above claims, wherein the clamping means is composed of two separate sections which are joined upon Insertion of the semiconductor component.
10. A method according to claim 9, wherein the joint provided by way of the clamping means is nondestructively releasable.
11. A method of mounting semi-conductor components onto a holder which is to be accommodated in a housing substantially as hereinbefore described with reference to and as illustrated by the accompanying drawings.
GB9325637A 1992-12-16 1993-12-15 A Method of mounting a semi-conductor chip in a holder by mechanical clamping Withdrawn GB2274021A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4242566A DE4242566A1 (en) 1992-12-16 1992-12-16 Process for mounting semiconductor components in housings by mechanical clamping

Publications (2)

Publication Number Publication Date
GB9325637D0 GB9325637D0 (en) 1994-02-16
GB2274021A true GB2274021A (en) 1994-07-06

Family

ID=6475504

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9325637A Withdrawn GB2274021A (en) 1992-12-16 1993-12-15 A Method of mounting a semi-conductor chip in a holder by mechanical clamping

Country Status (4)

Country Link
JP (1) JPH06283640A (en)
DE (1) DE4242566A1 (en)
FR (1) FR2699328A1 (en)
GB (1) GB2274021A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006022591A1 (en) * 2004-08-26 2006-03-02 Infineon Technologies Ag Packaging of integrated circuits to lead frames

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319470A1 (en) * 2003-04-29 2004-11-25 W. C. Heraeus Gmbh & Co. Kg Metal-plastic composite component and method for its production
DE102014216770A1 (en) * 2014-08-22 2016-02-25 Zf Friedrichshafen Ag Sensor module assembly

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
WO1990010951A1 (en) * 1989-03-06 1990-09-20 Allied-Signal Inc. Electronic device for managing and dissipating heat and for improving inspection and repair, and method of manufacture thereof
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
US5057901A (en) * 1989-09-27 1991-10-15 Die Tech, Inc. Lead frame for semi-conductor device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60195943A (en) * 1984-03-19 1985-10-04 Hitachi Ltd Semiconductor device
US4766478A (en) * 1986-09-02 1988-08-23 Dennis Richard K Lead frame for semi-conductor device and process of connecting same
DE3636373A1 (en) * 1986-10-25 1988-05-05 Heraeus Gmbh W C Connecting clip, method of producing a connecting clip and use of two connecting clips as connecting lugs for a varistor
DE3701310A1 (en) * 1987-01-17 1988-07-28 Bodenseewerk Geraetetech Contact-making device for making contact with surface-mounted integrated circuits
US4870224A (en) * 1988-07-01 1989-09-26 Intel Corporation Integrated circuit package for surface mount technology
JPH02268459A (en) * 1989-04-10 1990-11-02 Nec Corp Semiconductor package
DE3924823A1 (en) * 1989-07-27 1991-02-21 Telefunken Electronic Gmbh Semiconductor module with several semiconductors on basic substrate - has cover substrate for all semiconductors with conductive track configuration with terminal face(s)
JPH0437160A (en) * 1990-06-01 1992-02-07 Hitachi Ltd Lead frame and assembly method of semiconductor device which uses lead frame

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
WO1990010951A1 (en) * 1989-03-06 1990-09-20 Allied-Signal Inc. Electronic device for managing and dissipating heat and for improving inspection and repair, and method of manufacture thereof
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
US5057901A (en) * 1989-09-27 1991-10-15 Die Tech, Inc. Lead frame for semi-conductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006022591A1 (en) * 2004-08-26 2006-03-02 Infineon Technologies Ag Packaging of integrated circuits to lead frames
US7645639B2 (en) 2004-08-26 2010-01-12 Infineon Technologies Ag Packaging of integrated circuits to lead frames

Also Published As

Publication number Publication date
GB9325637D0 (en) 1994-02-16
DE4242566A1 (en) 1994-06-23
JPH06283640A (en) 1994-10-07
FR2699328A1 (en) 1994-06-17

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)