GB2271073B - Method of producing a semiconductor device - Google Patents

Method of producing a semiconductor device

Info

Publication number
GB2271073B
GB2271073B GB9323785A GB9323785A GB2271073B GB 2271073 B GB2271073 B GB 2271073B GB 9323785 A GB9323785 A GB 9323785A GB 9323785 A GB9323785 A GB 9323785A GB 2271073 B GB2271073 B GB 2271073B
Authority
GB
United Kingdom
Prior art keywords
ball
copper
electrode pad
less
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9323785A
Other versions
GB2271073A (en
GB9323785D0 (en
Inventor
Kiyoaki Tsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001467A external-priority patent/JPH03208355A/en
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9323785D0 publication Critical patent/GB9323785D0/en
Publication of GB2271073A publication Critical patent/GB2271073A/en
Application granted granted Critical
Publication of GB2271073B publication Critical patent/GB2271073B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

Electrical connection to an A1 electrode of a semiconductor is made by the attachment of a copper wire. A copper ball 8a formed by flaming out one end of a copper wire 8 is moved downward to an A1 electrode pad 5 on a semiconductor chip and brought into contact for less than 150 ms. Plastic deformation then occurs so that the copper ball is pressed to the aluminium electrode pad in such a manner that the height of the copper ball (h, Fig. 8) is 25 mu m or less. It is therefore possible to decrease the work hardening property of the Cu ball and prevent A1 exclusion when the Cu ball is bonded to the A1 electrode pad. <IMAGE>
GB9323785A 1990-01-10 1993-11-18 Method of producing a semiconductor device Expired - Fee Related GB2271073B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001467A JPH03208355A (en) 1990-01-10 1990-01-10 Semiconductor device and manufacture thereof
GB9010385A GB2239829B (en) 1990-01-10 1990-05-09 Semiconductor device and method of producing the same
SG155894A SG155894G (en) 1990-01-10 1994-10-21 Semiconductor device and method of producing the same

Publications (3)

Publication Number Publication Date
GB9323785D0 GB9323785D0 (en) 1994-01-05
GB2271073A GB2271073A (en) 1994-04-06
GB2271073B true GB2271073B (en) 1994-06-29

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GB9323785A Expired - Fee Related GB2271073B (en) 1990-01-10 1993-11-18 Method of producing a semiconductor device

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4444349A (en) * 1981-05-04 1984-04-24 Kulicke & Soffa Industries, Inc. Wire bonding apparatus
GB2174032A (en) * 1985-03-01 1986-10-29 Mitsubishi Electric Corp Ball-type bonding wires for semiconductor devices and method for producing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4444349A (en) * 1981-05-04 1984-04-24 Kulicke & Soffa Industries, Inc. Wire bonding apparatus
GB2174032A (en) * 1985-03-01 1986-10-29 Mitsubishi Electric Corp Ball-type bonding wires for semiconductor devices and method for producing same

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GB2271073A (en) 1994-04-06
GB9323785D0 (en) 1994-01-05

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