GB2246662B - A photodetector device - Google Patents
A photodetector deviceInfo
- Publication number
- GB2246662B GB2246662B GB9026969A GB9026969A GB2246662B GB 2246662 B GB2246662 B GB 2246662B GB 9026969 A GB9026969 A GB 9026969A GB 9026969 A GB9026969 A GB 9026969A GB 2246662 B GB2246662 B GB 2246662B
- Authority
- GB
- United Kingdom
- Prior art keywords
- photodetector device
- photodetector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
- H01L27/1465—Infrared imagers of the hybrid type
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2201768A JPH0485961A (en) | 1990-07-30 | 1990-07-30 | Optical sensor |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9026969D0 GB9026969D0 (en) | 1991-01-30 |
GB2246662A GB2246662A (en) | 1992-02-05 |
GB2246662B true GB2246662B (en) | 1994-08-24 |
Family
ID=16446622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9026969A Expired - Fee Related GB2246662B (en) | 1990-07-30 | 1990-12-12 | A photodetector device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH0485961A (en) |
FR (1) | FR2665302B1 (en) |
GB (1) | GB2246662B (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2263980B (en) * | 1992-02-07 | 1996-04-10 | Marconi Gec Ltd | Apparatus and method for testing bare dies |
JPH06232234A (en) * | 1993-01-29 | 1994-08-19 | Mitsubishi Electric Corp | Optical detection element |
US5596222A (en) * | 1994-08-12 | 1997-01-21 | The Charles Stark Draper Laboratory, Inc. | Wafer of transducer chips |
US5756395A (en) * | 1995-08-18 | 1998-05-26 | Lsi Logic Corporation | Process for forming metal interconnect structures for use with integrated circuit devices to form integrated circuit structures |
GB2340997A (en) * | 1998-08-26 | 2000-03-01 | Lsi Logic Corp | Optoelectronic integrated circuit and method of testing |
WO2003017372A1 (en) | 2001-08-14 | 2003-02-27 | Infineon Technologies Ag | Photodiode arrangement with two photodiodes |
US20030049925A1 (en) | 2001-09-10 | 2003-03-13 | Layman Paul Arthur | High-density inter-die interconnect structure |
JP2007258199A (en) * | 2006-03-20 | 2007-10-04 | Nec Electronics Corp | Imaging element |
WO2008142968A1 (en) * | 2007-05-21 | 2008-11-27 | Shimadzu Corporation | Imaging element and imaging device provided with the same |
KR101004024B1 (en) * | 2009-12-29 | 2010-12-31 | 한국지질자원연구원 | Non contact rock fall detection method using photo sensors |
WO2019160517A2 (en) * | 2018-02-15 | 2019-08-22 | Aselsan Elektroni̇k Sanayi̇ Ve Ti̇caret Anoni̇m Şi̇rketi̇ | A method for improving the flip-chip bonding process |
US10727267B2 (en) * | 2018-09-12 | 2020-07-28 | Sensors Unlimited, Inc. | Interconnect bump structures for photo detectors |
JP2020098901A (en) * | 2018-12-14 | 2020-06-25 | キヤノン株式会社 | Photoelectric conversion device, photoelectric conversion device manufacturing method, semiconductor device manufacturing method |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4709141A (en) * | 1986-01-09 | 1987-11-24 | Rockwell International Corporation | Non-destructive testing of cooled detector arrays |
EP0271522A1 (en) * | 1986-06-26 | 1988-06-22 | Santa Barbara Research Center | Backside contact blocked impurity band detector |
US4943491A (en) * | 1989-11-20 | 1990-07-24 | Honeywell Inc. | Structure for improving interconnect reliability of focal plane arrays |
-
1990
- 1990-07-30 JP JP2201768A patent/JPH0485961A/en active Pending
- 1990-12-12 GB GB9026969A patent/GB2246662B/en not_active Expired - Fee Related
-
1991
- 1991-07-30 FR FR9109662A patent/FR2665302B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2246662A (en) | 1992-02-05 |
JPH0485961A (en) | 1992-03-18 |
FR2665302A1 (en) | 1992-01-31 |
FR2665302B1 (en) | 1994-01-28 |
GB9026969D0 (en) | 1991-01-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
746 | Register noted 'licences of right' (sect. 46/1977) |
Effective date: 19951107 |
|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19991212 |